1-2 of 2
Keywords: PBGA
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee, Wei Xu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
https://doi.org/10.1115/1.4041064
Published Online: September 10, 2018
...] Egan , E. , Kelly , G. , and Herard , L. , 1999 , “ PBGA Warpage and Stress Prediction for Efficient Creation of the Thermomechanical Design Space for Package-Level Reliability ,” 49th Electronic Components and Technology Conference ( ECTC ), San Diego, CA, June, 1–4, pp. 1217 – 1223...
View Article titled, Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of <span class="search-highlight">PBGA</span> Components
Open the PDF for Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of <span class="search-highlight">PBGA</span> Components in another window
Topics: Ball-Grid-Array packaging, Electromagnetic scattering, Materials properties, Radiation scattering, Scattering (Physics), Temperature, Thermal expansion, Warping, Simulation, Laminates
Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
https://doi.org/10.1115/1.2993146
Published Online: November 17, 2008
.... , and Ackerman , W. , 2001 , “ On the Design Parameters of Flip-Chip PBGA Package Assembly for Optimum Solder Ball Reliability ,” IEEE Trans. Compon. Packag. Technol. 1521-3331 10.1109/6144.926397 , 24 ( 2 ), pp. 300 – 307 . Silverman , M. , 1998 , “ Summary of HALT and HASS Results...
View Article titled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
Open the PDF for Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling in another window
Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints