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Keywords: Multidisciplinary Design
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 306–313.
Published Online: November 16, 2004
.... This methodology can be applied to any electronic product design at any packaging level from the system level to the chip level. 20 10 2003 16 11 2004 ball grid arrays thermal management (packaging) neural nets optimisation Multidisciplinary Design Electronics Packaging Neural Networks...
