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Keywords: Microsystems
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
Published Online: September 10, 2018
...: Xiaobing Luo. 28 02 2018 20 07 2018 Flip chip MEMS Microsystems Solder The ongoing technical progress, especially in electronics and its miniaturization, continuously poses new challenges for joining technologies. Examples are the joining of dissimilar materials (e.g...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
Published Online: June 26, 2018
... LECTRONIC P ACKAGING . Manuscript received January 15, 2018; final manuscript received May 9, 2018; published online June 26, 2018. Assoc. Editor: Toru Ikeda. 15 01 2018 09 05 2018 Failure analysis MEMS Microsystems Physics of failure Reliability Sensors...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
Published Online: May 11, 2018
... OF E LECTRONIC P ACKAGING . Manuscript received September 14, 2017; final manuscript received January 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis...
Journal Articles
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
Published Online: May 9, 2018
... or reproduce the published form of this work, or allow others to do so, for United States Government purposes. 16 02 2018 21 02 2018 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors SOC Wafer level...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011001.
Paper No: EP-17-1019
Published Online: March 2, 2018
... ACKAGING . Manuscript received February 12, 2017; final manuscript received October 27, 2017; published online March 2, 2018. Assoc. Editor: Yi-Shao Lai. 12 02 2017 27 10 2017 Flip chip Microsystems Underfill The flow of a Newtonian fluid in a porous medium (as shown in Fig...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031002.
Paper No: EP-16-1064
Published Online: June 14, 2017
... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031004.
Paper No: EP-16-1110
Published Online: June 14, 2017
..., it is possible to design a configuration with substantially low average peeling stress level at the aluminum/passivation interface which has a greatly reduced risk of failure. References [1] Ben Yoo , S. J. , 2015 , “ Heterogeneous 2D and 3D Photonic Integration for Future Chip-Scale Microsystems...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
Published Online: June 14, 2017
..., Actuators and Microsystems ( TRANSDUCERS & EUROSENSORS XXVII ), Barcelona, Spain, June 16–20, pp. 1835 – 1838 . 10.1109/Transducers.2013.6627147 [17] Sheehy , M. , Reid , M. , Punch , J. , Goyal , S. , and Kelly , G. , 2008 , “ The Failure Mechanisms of Micro-Scale...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011006.
Paper No: EP-16-1097
Published Online: January 5, 2017
... OF E LECTRONIC P ACKAGING . Manuscript received August 12, 2016; final manuscript received November 30, 2016; published online January 5, 2017. Assoc. Editor: M. Baris Dogruoz. 12 08 2016 30 11 2016 MEMS Microsystems Thermal analysis New cooling solutions are needed...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011005.
Paper No: EP-16-1083
Published Online: January 5, 2017
... Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received July 13, 2016; final manuscript received November 15, 2016; published online January 5, 2017. Assoc. Editor: M. Baris Dogruoz. 13 07 2016 15 11 2016 Microsystems Thermal analysis...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
Published Online: December 29, 2016
... is unlimited. 24 06 2016 04 11 2016 Composite materials Conductive adhesives Microsystems Solder Thermal analysis The performance characteristics of TIMs continue to improve rapidly with the development of novel nanostructured materials and advanced manufacturing processes...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041005.
Paper No: EP-16-1069
Published Online: October 10, 2016
.... Editor: Toru Ikeda. 05 06 2016 13 08 2016 High density interconnects Microsystems Reliability Solder The solder joints used as interconnects in today's electronic packaging continue to get smaller and smaller in size to meet the demand on further miniaturization...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. December 2016, 138(4): 040801.
Paper No: EP-16-1013
Published Online: August 24, 2016
... with microscale pore size and pressure regulating valves are also common components in these systems. 3D packaging Microsystems Thermal analysis 16 01 2016 21 07 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041002.
Paper No: EP-16-1049
Published Online: August 19, 2016
....53.005745 Bio-Research Microsystems The traditional approach to microfluidics is based on monolithic integration of multiple components on a single chip [ 1 , 2 ]. This approach allows for the simultaneous fabrication of multiple components including, but not limited to, microfluidic...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031008.
Paper No: EP-16-1014
Published Online: July 28, 2016
... received June 27, 2016; published online July 28, 2016. Assoc. Editor: Pradip Dutta. 16 01 2016 27 06 2016 Microsystems Thermal analysis The rise in energy consumption by data centers over the last few decades has necessitated technological progress in nearly every field...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031005.
Paper No: EP-16-1041
Published Online: May 19, 2016
... February 24, 2016; final manuscript received May 1, 2016; published online May 19, 2016. Assoc. Editor: Xiaobing Luo. 24 02 2016 01 05 2016 Microsystems Thermal analysis Consistent trends toward achieving higher computing performance have led to the miniaturization...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010905.
Paper No: EP-15-1105
Published Online: March 10, 2016
... detachment and coalescence in bends were avoided by an additional bend within the curve based on systematically varied geometrical dimensions. 1 Corresponding author. 01 10 2015 02 01 2016 Microsystems In this work, a modular redispersion system is used to evaluate the bubble...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010907.
Paper No: EP-15-1104
Published Online: March 10, 2016
.... 185 – 196 . http://www.techstreet.com/ashrae/products/1838630 3D packaging Microsystems Thermal analysis Gallium nitride (GaN) HEMTs have received considerable attention over the last decade due to the material characteristics that improve electrical performance [ 1 ]. Thermal...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010914.
Paper No: EP-15-1101
Published Online: March 10, 2016
... and Microsystems ( TRANSDUCERS ), Anchorage, AK, June 21–25, pp. 1144 – 1147 10.1109/TRANSDUCERS.2015.7181130 . [6] Goyal , S. , Upasani , S. , and Patel , D. M. , 1999 , “ Improving Impact Tolerance of Portable Electronic Products: Case Study of Cellular Phones ,” Exp. Mech. , 39 ( 1 ), pp...