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Keywords: Microsystems
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
Published Online: September 10, 2018
..., 2018. Assoc. Editor: Xiaobing Luo. 28 02 2018 20 07 2018 Flip chip MEMS Microsystems Solder The ongoing technical progress, especially in electronics and its miniaturization, continuously poses new challenges for joining technologies. Examples are the joining...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
Published Online: June 26, 2018
.... As such, the stress had to be larger than in the real case and couple too much calculation noise inside. In the new model, the element-type solution was used to obtain a smooth distribution on the plot and prevent deviation. Failure analysis MEMS Microsystems Physics of failure Reliability Sensors...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
Published Online: May 11, 2018
... 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis The rapid increase in heat dissipation of next-generation integrated circuits necessitates...
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
Published Online: May 9, 2018
..., and reliability. These topics are organized across five different tracks: (1) heterogeneous integration—microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011001.
Paper No: EP-17-1019
Published Online: March 2, 2018
... Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received February 12, 2017; final manuscript received October 27, 2017; published online March 2, 2018. Assoc. Editor: Yi-Shao Lai. 12 02 2017 27 10 2017 Flip chip Microsystems Underfill...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031004.
Paper No: EP-16-1110
Published Online: June 14, 2017
... analysis High density interconnects Microsystems In two-dimensional (2D) packaging, a silicon chip is assembled directly on a higher coefficient of thermal expansion (CTE) ceramic or an organic substrate. Tin-based solder interconnects are typically used to connect the chip to the substrate. Two...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031002.
Paper No: EP-16-1064
Published Online: June 14, 2017
... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
Published Online: June 14, 2017
... environment MEMS Microsystems Nanotechnolgy PWB Reliability SMT The ever increasing portability, miniaturization, and functionality of consumer electronic products have driven the move to thinner printed wiring assemblies (PWAs) and smaller clearances between adjacent components. Accidental drop...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011006.
Paper No: EP-16-1097
Published Online: January 5, 2017
... temperature variation. MEMS Microsystems Thermal analysis 12 08 2016 30 11 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received August 12, 2016; final manuscript received...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011005.
Paper No: EP-16-1083
Published Online: January 5, 2017
... transfer in multi-microchannel evaporators under such conditions is currently very limited in the open literature. Microsystems Thermal analysis 13 07 2016 15 11 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
Published Online: December 29, 2016
... is unlimited. 24 06 2016 04 11 2016 Composite materials Conductive adhesives Microsystems Solder Thermal analysis The performance characteristics of TIMs continue to improve rapidly with the development of novel nanostructured materials and advanced manufacturing processes...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041005.
Paper No: EP-16-1069
Published Online: October 10, 2016
.... Editor: Toru Ikeda. 05 06 2016 13 08 2016 High density interconnects Microsystems Reliability Solder The solder joints used as interconnects in today's electronic packaging continue to get smaller and smaller in size to meet the demand on further miniaturization...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2016, 138(4): 040801.
Paper No: EP-16-1013
Published Online: August 24, 2016
... manuscript received July 21, 2016; published online August 24, 2016. Assoc. Editor: Eric Wong. 16 01 2016 21 07 2016 3D packaging Microsystems Thermal analysis Flow boiling in microscale systems was studied intensively in the past two decades and is still attracting...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041002.
Paper No: EP-16-1049
Published Online: August 19, 2016
... received March 12, 2016; final manuscript received August 1, 2016; published online August 19, 2016. Assoc. Editor: Satish Chaparala. 12 03 2016 01 08 2016 Bio-Research Microsystems The traditional approach to microfluidics is based on monolithic integration of multiple...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031008.
Paper No: EP-16-1014
Published Online: July 28, 2016
... received June 27, 2016; published online July 28, 2016. Assoc. Editor: Pradip Dutta. 16 01 2016 27 06 2016 Microsystems Thermal analysis The rise in energy consumption by data centers over the last few decades has necessitated technological progress in nearly every field...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031005.
Paper No: EP-16-1041
Published Online: May 19, 2016
... online May 19, 2016. Assoc. Editor: Xiaobing Luo. 24 02 2016 01 05 2016 Microsystems Thermal analysis Consistent trends toward achieving higher computing performance have led to the miniaturization and proliferation of a large number of components in an increasingly smaller...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010905.
Paper No: EP-15-1105
Published Online: March 10, 2016
... . Manuscript received October 1, 2015; final manuscript received January 2, 2016; published online March 10, 2016. Assoc. Editor: Toru Ikeda. 01 10 2015 02 01 2016 Microsystems Microreactors offer advantages concerning mass and heat transfer processes due to a high specific surface...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010901.
Paper No: EP-15-1091
Published Online: March 10, 2016
... manuscript received December 31, 2015; published online March 10, 2016. Assoc. Editor: Mehdi Asheghi. 25 09 2015 31 12 2015 Microsystems Thermal analysis Microchannel evaporators are one of the most promising cooling techniques for high-performance electronic devices. These heat...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010907.
Paper No: EP-15-1104
Published Online: March 10, 2016
... packaging Microsystems Thermal analysis Gallium nitride (GaN) HEMTs have received considerable attention over the last decade due to the material characteristics that improve electrical performance [ 1 ]. Thermal management of high radio frequency power devices using GaN HEMT has become...