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Keywords: Kawamura and Kuwahara technique
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014502.
Published Online: March 4, 2010
... epoxy molding compound Kawamura and Kuwahara technique Cross model finite difference method (FDM) Epoxy molding compound (EMC) encapsulation by transfer molding has become the most common packaging process for microchips ( 1 ). However, the process remains susceptible to several manufacturing...
