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Muhammad Jahidul Hoque, Alperen Günay, Andrew Stillwell, Yashraj Gurumukhi, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020903.
Paper No: EP-20-1081
Published Online: February 22, 2021
... (MHSs) strategically placed on high power dissipation areas of the PCB enables elimination of electrical potential difference, and removal of electrical isolation materials, resulting in better cooling performance due to direct contact between devices and the HS. By studying a gallium nitride (GaN) 2 kW...