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Keywords: Fatigue Life
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
Published Online: July 14, 1999
... on the microstructure and mechanical properties of the Sn-Pb system has been studied previously. By increasing the cooling rate from furnace cooling to water quenching, Mei and Morris 18 19 reported that the fatigue life of solders joint became longer with increasing cooling rate. So our research results to 63/37 Sn...
