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Keywords: Failure analysis
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031107.
Paper No: EP-19-1129
Published Online: April 24, 2020
..., a failure analysis of Ag nanoparticle ink lines were assessed using current loading tests and microscopic observations to discuss the damage mechanism and evaluate electrical reliability under high-density current. Atomic transport due to EM was observed at 60 kA/cm 2 current loading, and relatively large...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
Published Online: August 20, 2018
... gives more consistent failure times. Failure analysis for the tested devices shows the primary failure mode is “input” trace crack first, followed by fatigue through the solder for complete failure. A finite element (FE) model, correlated with experimental modal analysis, is shown to accurately estimate...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
Published Online: June 26, 2018
...; published online June 26, 2018. Assoc. Editor: Toru Ikeda. 15 01 2018 09 05 2018 Failure analysis MEMS Microsystems Physics of failure Reliability Sensors Microelectromechanical systems (MEMS) have been widely used in many sensor applications. They can be miniaturized...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031007.
Paper No: EP-18-1009
Published Online: June 11, 2018
.... Assoc. Editor: Jin Yang. 28 01 2018 12 05 2018 Area array COB Failure analysis Flip chip Reliability Solder Nowadays, the urgent requirement of fine-pitch interconnects in microelectronic packages, and the utilization of lead-free solders considering environmental...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031005.
Paper No: EP-17-1107
Published Online: May 21, 2018
... manuscript received April 27, 2018; published online May 21, 2018. Assoc. Editor: Toru Ikeda. 12 10 2017 27 04 2018 Failure analysis Harsh environment Reliability Solder The fatigue failure of solder joints in printed circuit boards is one of the limiting factors...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021003.
Paper No: EP-17-1115
Published Online: May 9, 2018
... 20 03 2018 Electronic Failure analysis Harsh environment Ceramic packages are selected for microprocessors and similar components that support high-reliability electronics systems because they provide a hermetic environment that prevents the active device from being exposed...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
... LECTRONIC P ACKAGING . Manuscript received September 28, 2017; final manuscript received January 4, 2018; published online March 2, 2018. Assoc. Editor: Sreekant Narumanchi. 28 09 2017 04 01 2018 Composite materials DCA Electronic Failure analysis Harsh environment Physics...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
Published Online: March 2, 2018
... Electronic Failure analysis Harsh environment Physics of failure Reliability The rapidly growing application fields in mobility, i.e., electromobility and automated driving (AD), and fully connected vehicles, not only trigger the development of a new generation of electronic systems...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010902.
Paper No: EP-17-1087
Published Online: March 2, 2018
... 2017 Electronic Failure analysis Thermal analysis The global conditions in a data center are determined by computer room air conditioning (CRAC) set point temperature, mass flow rate of cold air being supplied to the room, and overall heat load for the room. Local conditions...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031002.
Paper No: EP-16-1064
Published Online: June 14, 2017
... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031004.
Paper No: EP-16-1110
Published Online: June 14, 2017
... of Accelerated Thermal Cycle Parameters and the Geometry Dimensions on Solder Joint Reliability ,” IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis ( HDP ), Shanghai, China, June 27–30, pp. 242 – 246 . 10.1109/HDP.2006.1707600 The 2.5D test vehicle...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
Published Online: June 14, 2017
... . Weibull characteristic life η , Weibull shape parameter β ′, and the percentage of FM-a type failure modes for each test condition are listed. In Fig. 21 , a sample probability density function and optical microscope images of an FM-a type failure taken from failure analysis are presented. Fig...
Journal Articles
Article Type: Guest Editorial
J. Electron. Packag. June 2017, 139(2): 020301.
Paper No: EP-17-1032
Published Online: June 12, 2017
...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020905.
Paper No: EP-16-1147
Published Online: April 28, 2017
... Tester Made From Toy-Bricks ,” Adv. Sci. , 3 ( 4 ), p. 1500396 . 10.1002/advs.201500396 [11] Hocheng , H. , and Chen , C. M. , 2014 , “ Design, Fabrication and Failure Analysis of Stretchable Electrical Routing ,” Sensors , 14 ( 7 ), pp. 11855 – 11877 . 10.3390/s140711855 [12...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020903.
Paper No: EP-16-1143
Published Online: April 24, 2017
... ACKAGING . Manuscript received December 16, 2016; final manuscript received March 24, 2017; published online April 24, 2017. Assoc. Editor: Justin A. Weibel. 16 12 2016 24 03 2017 Electronic Failure analysis Harsh environment Physics of failure Reliability Thermal analysis...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011001.
Paper No: EP-16-1073
Published Online: November 10, 2016
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031006.
Paper No: EP-15-1054
Published Online: June 28, 2016
... . Manuscript received May 26, 2015; final manuscript received June 13, 2016; published online June 28, 2016. Assoc. Editor: Shi-Wei Ricky Lee. 26 05 2015 13 06 2016 3D packaging Chip stacking Failure analysis The three-dimensional integrated circuit (3D IC) is an emerging...
Journal Articles
Article Type: Editorial
J. Electron. Packag. September 2016, 138(3): 038001.
Paper No: EP-16-1065
Published Online: June 6, 2016
... 21 05 2016 22 05 2016 3D packaging CSP Failure analysis High density interconnects SMT List of JEP Reviewers Alekhya Addagatla David Hutt Kaustubh Nagarkar Dereje Agonafer Toru Ikeda Luu T. Nguyen S. Ravi Annapragada Toshitaka Ishizaki Mark...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021001.
Paper No: EP-15-1109
Published Online: March 23, 2016
... received February 15, 2016; published online March 23, 2016. Assoc. Editor: Yi-Shao Lai. 07 10 2015 15 02 2016 Failure analysis Power packaging Reliability Interconnection materials in electric devices undergo cyclic stress caused by a mismatch of thermal expansion...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011002.
Paper No: EP-15-1079
Published Online: March 10, 2016
... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received August 30, 2015; final manuscript received December 19, 2015; published online March 10, 2016. Assoc. Editor: Yi-Shao Lai. 30 08 2015 19 12 2015 Failure analysis Reliability Solder joints provide both electrical...