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Keywords: Defect
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... property to compensate for any placement offsets. However, some problems emerged in practice due to its special features. The major challenges for manufacturer are the inspection of solder joint and to perform touch-up. In most cases, the defect of solder joint cannot be found until in-circuit...