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Keywords: CBGA
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
Published Online: November 17, 2008
... of simulation methodology on solder joint crack growth correlation and fatigue life prediction ,” ASME J. Electron. Packag. 1043-7398 10.1115/1.1413764 , 124 ( 3 ), pp. 147 – 154 . Pang , J. H. L. , Seetoh , C. W. , and Wang , Z. P. , 2000 , “ CBGA Solder Joint Reliability Evaluation...