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Keywords: 63Sn–37Pb solderClose
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 278–286.
Published Online: July 20, 2006
...Gang Chen; Xu Chen; Kwang Soo Kim; Mohammad Abdel-Karim; Masao Sakane A series of multiaxial ratcheting tests were conducted on 63Sn–37Pb solder. A unified viscoplastic constitutive model was developed on the basis of the Ohno–Wang kinematic hardening model, and the rate dependence of the material...