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Journal Articles

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit Vinson, David Huitink

J. Electron. Packag.

Paper No: EP-22-1037

DOI: https://doi.org/10.1115/1.4055024

Published Online: July 18, 2022

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Topics: Solders, Testing, Stress, Failure, Ball-Grid-Array packaging, Copper, Current density, Electrical resistance, Flip-chip, Reliability

Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama

J. Electron. Packag. June 2021, 143(2): 020801.

Paper No: EP-20-1074

DOI: https://doi.org/10.1115/1.4048038

Published Online: August 27, 2020

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Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire

Journal Articles

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

Alexander Otto, Sven Rzepka, Bernhard Wunderle

J. Electron. Packag. September 2019, 141(3): 031012.

Paper No: EP-18-1098

DOI: https://doi.org/10.1115/1.4043646

Published Online: June 17, 2019

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Topics: Cycles, Failure, Junctions, Temperature, Wire, Stress, Failure mechanisms, Thermomechanics

Journal Articles

Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition

Guicui Fu, Maogong Jiang, Bo Wan, Yanruoyue Li, Cheng Ma

J. Electron. Packag. March 2019, 141(1): 011004.

Paper No: EP-18-1055

DOI: https://doi.org/10.1115/1.4041984

Published Online: February 25, 2019

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Topics: Bonding, Shock (Mechanics), Wire, Risk assessment

Journal Articles

A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices

Liang Yin, Christopher Kapusta, Arun Gowda, Kaustubh Nagarkar

J. Electron. Packag. September 2018, 140(3): 031009.

Paper No: EP-17-1113

DOI: https://doi.org/10.1115/1.4040499

Published Online: July 2, 2018

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Topics: Overlays (Materials engineering), Packaging, Power semiconductor devices, Reliability, Silicon, Wire, Gates (Closures), Manufacturing, Temperature, Heat sinks

Journal Articles

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling

J. Electron. Packag. March 2018, 140(1): 017001.

Paper No: EP-17-1111

DOI: https://doi.org/10.1115/1.4038735

Published Online: March 2, 2018

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Topics: Bridges (Structures), Electrons, Sensors, Silicon, Stress, Wire

Journal Articles

Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages

Huang-Kuang Kung, Chi-Lung Hsieh

J. Electron. Packag. December 2017, 139(4): 041002.

Paper No: EP-17-1042

DOI: https://doi.org/10.1115/1.4037276

Published Online: July 27, 2017

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Topics: Wire, Deflection

Journal Articles

Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process

Tzeng Yih-Fong, Chen Fu-Chen, Chen Chih-Huang

J. Electron. Packag. December 2015, 137(4): 041004.

Paper No: EP-14-1080

DOI: https://doi.org/10.1115/1.4031471

Published Online: October 1, 2015

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Topics: Ball-Grid-Array packaging, Optimization, Principal component analysis, Shear strength, Wire, Wire bonding, Design, Performance evaluation, Process design

Journal Articles

Modeling and Experimental Study of a Wire Clamp for Wire Bonding

Fuliang Wang, Dengke Fan

J. Electron. Packag. March 2015, 137(1): 011012.

Paper No: EP-14-1035

DOI: https://doi.org/10.1115/1.4028836

Published Online: March 1, 2015

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Topics: Clamps (Tools), Wire, Wire bonding

Journal Articles

Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method

S. Kim, M. Mayer, J. Persic, J. T. Moon

J. Electron. Packag. March 2015, 137(1): 011002.

Paper No: EP-13-1089

DOI: https://doi.org/10.1115/1.4028281

Published Online: October 6, 2014

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Topics: Temperature, Wire

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

Experimental and Modeling Studies of Looping Process for Wire Bonding

Fuliang Wang, Yun Chen

J. Electron. Packag. December 2013, 135(4): 041009.

Paper No: EP-13-1070

DOI: https://doi.org/10.1115/1.4025667

Published Online: November 18, 2013

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Topics: Wire, Materials properties, Finite element model

Journal Articles

Variable-Length Link-Spring Model for Kink Formation During Wire Bonding

Fuliang Wang, Weidong Tang, Junhui Li, Lei Han

J. Electron. Packag. December 2013, 135(4): 041004.

Paper No: EP-12-1061

DOI: https://doi.org/10.1115/1.4025308

Published Online: September 19, 2013

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Topics: Springs, Wire, Wire bonding, Deformation

Journal Articles

Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules

Pushparajah Rajaguru, Stoyan Stoyanov, Hua Lu, Chris Bailey

J. Electron. Packag. June 2013, 135(2): 021009.

Paper No: EP-12-1043

DOI: https://doi.org/10.1115/1.4024056

Published Online: April 12, 2013

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Topics: Aluminum, Design, Optimization, Wire, Warping, Finite element analysis, Reliability, Failure

Journal Articles

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

C. L. Gan, U. Hashim

J. Electron. Packag. June 2013, 135(2): 021010.

Paper No: EP-12-1099

DOI: https://doi.org/10.1115/1.4024013

Published Online: April 12, 2013

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Topics: High temperature, Packaging, Reliability, Stress, Wire, Failure mechanisms, Temperature, Semiconductors (Materials), Nanoscale phenomena, Nanoelectronics

Journal Articles

Development of Accelerated Method for Thermal Cycling in Electronic Packaging Application

Michael Mayer, Michael McCracken, John Persic

J. Electron. Packag. June 2013, 135(2): 021007.

Paper No: EP-12-1096

DOI: https://doi.org/10.1115/1.4023911

Published Online: March 28, 2013

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Topics: Temperature, Wire, Cycles, Polysilicon

Journal Articles

Direct-Write Stretchable Sensors Using Single-Walled Carbon Nanotube/Polymer Matrix

Morteza Vatani, Yanfeng Lu, Kye-Shin Lee, Ho-Chan Kim, Jae-Won Choi

J. Electron. Packag. March 2013, 135(1): 011009.

Paper No: EP-12-1041

DOI: https://doi.org/10.1115/1.4023293

Published Online: February 26, 2013

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Topics: Sensors, Single-walled carbon nanotubes, Polymers, Wire, Electronics

Journal Articles

Pull Force and Displacement of Cu/Au Wire Interconnects

J. Lau, S. Wu, J. M. Lau

J. Electron. Packag. December 2012, 134(4): 041002.

DOI: https://doi.org/10.1115/1.4007233

Published Online: August 29, 2012

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Topics: Displacement, Wire

Journal Articles

On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator

Wuwei Feng, Qingfeng Meng, Youbo Xie, Hong Fan

J. Electron. Packag. December 2010, 132(4): 041002.

DOI: https://doi.org/10.1115/1.4002900

Published Online: November 19, 2010

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Topics: Bonding, Feature extraction, Signals, Wire bonding, Generators, Principal component analysis, Wire, Damping, Artificial neural networks, Shear strength

Journal Articles

Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

Takashi Anzawa, Qiang Yu, Masanori Yamagiwa, Tadahiro Shibutani, Masaki Shiratori

J. Electron. Packag. September 2010, 132(3): 031012.

DOI: https://doi.org/10.1115/1.4002451

Published Online: September 30, 2010

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Topics: Bonding, Crack propagation, Fatigue life, Fracture (Materials), Reliability, Solder joints, Temperature, Temperature distribution, Wire, Wire bonding

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Journal citation

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Manuscript

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition

A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages

Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process

Modeling and Experimental Study of a Wire Clamp for Wire Bonding

Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method

Special Section on InterPACK 2013

Experimental and Modeling Studies of Looping Process for Wire Bonding

Variable-Length Link-Spring Model for Kink Formation During Wire Bonding

Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

Development of Accelerated Method for Thermal Cycling in Electronic Packaging Application

Direct-Write Stretchable Sensors Using Single-Walled Carbon Nanotube/Polymer Matrix

Pull Force and Displacement of Cu/Au Wire Interconnects

On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator

Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

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