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Journal Articles

Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics

Pradeep Lall, Aniket Shirgaokar, Dinesh Arunachalam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031008.
https://doi.org/10.1115/1.4006863
Published Online: July 19, 2012
View Article titled, Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics
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Topics: Cycles, Eigenvalues, Electronics, Failure, Model development, Reliability, Solders, Temperature, Thermal expansion, Thermomechanics
Journal Articles

Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)

John Lau, ASME Fellow, Walter Dauksher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 96–105.
https://doi.org/10.1115/1.1846069
Published Online: June 3, 2005
View Article titled, Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)
Open the PDF for Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards) in another window
Topics: Ceramics, Creep, Cycles, Lead-free solders, Reliability, Solders, Temperature, Printed circuit boards, Fatigue, Weibull distribution
Journal Articles

Statistical Aspects of Lifetime in the Presence of UV Radiation

Michael I. Zeifman, Dov Ingman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 1–3.
https://doi.org/10.1115/1.1498263
Published Online: March 14, 2003
View Article titled, Statistical Aspects of Lifetime in the Presence of UV Radiation
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Topics: Composite materials, Reliability, Shapes, Stress, Ultraviolet radiation, Damage, Rupture, Weibull distribution, Microcracks, Testing
Journal Articles

Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability

J. Lau, S. Golwalkar, S. Erasmus, R. Surratt, P. Boysan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 169–176.
https://doi.org/10.1115/1.2906414
Published Online: June 1, 1992
View Article titled, Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability
Open the PDF for Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability in another window
Topics: Reliability, Solder joints, Temperature, Corners (Structural elements), Failure, Failure analysis, Fatigue, Fatigue life, Finite element analysis, Scanning electron microscopy