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Journal Articles

Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications

Jun Wang, Yang Zhao, Han Chen, Yan Tang, Guozhen Liu, Renli Liang, Jiangnan Dai, Changqing Chen, Junyong Kang, Duanjun Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031102.
Paper No: EP-19-1120
https://doi.org/10.1115/1.4046764
Published Online: April 17, 2020
View Article titled, Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications
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Topics: Electrodes, Irradiation (Radiation exposure), Nanowires, Transparency, Ultraviolet radiation, Light-emitting diodes, Welding
Journal Articles

Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Yang Peng, Renli Liang, Yun Mou, Jiangnan Dai, Mingxiang Chen, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040804.
Paper No: EP-18-1089
https://doi.org/10.1115/1.4044624
Published Online: September 19, 2019
View Article titled, Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies
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Topics: Light-emitting diodes, Packaging, Ultraviolet radiation
Journal Articles

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

Zhiyuan Zhu, Min Yu, Lisha Liu, Yufeng Jin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2015, 137(4): 044501.
Paper No: EP-15-1062
https://doi.org/10.1115/1.4031750
Published Online: October 20, 2015
View Article titled, Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate
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Topics: Adhesives, Bonding, Silicon, Temperature, Shear strength, Ultraviolet radiation
Journal Articles

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

Shin-ichi Satake, Gaku Sorimachi, Takahiro Kanai, Jun Taniguchi, Noriyuki Unno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031003.
https://doi.org/10.1115/1.4001854
Published Online: September 9, 2010
View Article titled, Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV
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Topics: Hardening (Curing), Particulate matter, Resins, Ultraviolet radiation, Glass, Holography, Temperature, Displacement, Microchannels
Journal Articles

Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions

K. K. Lee, S. C. Tan, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 52–58.
https://doi.org/10.1115/1.1846068
Published Online: March 21, 2005
View Article titled, Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions
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Topics: Adhesives, Bonding, Hardening (Curing), Shear (Mechanics), Ultraviolet radiation, Fourier transform infrared spectroscopy
Journal Articles

Statistical Aspects of Lifetime in the Presence of UV Radiation

Michael I. Zeifman, Dov Ingman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 1–3.
https://doi.org/10.1115/1.1498263
Published Online: March 14, 2003
View Article titled, Statistical Aspects of Lifetime in the Presence of UV Radiation
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Topics: Composite materials, Reliability, Shapes, Stress, Ultraviolet radiation, Damage, Rupture, Weibull distribution, Microcracks, Testing
Journal Articles

Optical Measurements of Shrinkage in UV-Cured Adhesives

A. J. Hudson, S. C. Martin, M. Hubert, J. K. Spelt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 352–354.
https://doi.org/10.1115/1.1498264
Published Online: December 12, 2002
View Article titled, Optical Measurements of Shrinkage in UV-Cured Adhesives
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Topics: Adhesives, Hardening (Curing), Shrinkage (Materials), Ultraviolet radiation, Ultraviolet cured adhesives, Optical measurement