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Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

Reece Whitt, Rafael Estrella, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041103.
Paper No: EP-23-1032
https://doi.org/10.1115/1.4063484
Published Online: October 9, 2023
View Article titled, Converging Jet Impingement for Enhanced Liquid Cooling
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Topics: Additive manufacturing, Cooling, Electronics, Fluids, Heat transfer, Jets, Nozzles, Pressure, Reynolds number, Simulation
Journal Articles

Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets

Prabhakar Subrahmanyam, B. K. Gnanavel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031009.
Paper No: EP-20-1104
https://doi.org/10.1115/1.4049579
Published Online: February 19, 2021
View Article titled, Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets
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Topics: Flow (Dynamics), Heat transfer, Heat transfer coefficients, Jets, Nozzles, Reynolds-averaged Navier–Stokes equations, Silicon, Reynolds number, Turbulence, Temperature
Journal Articles

Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030904.
Paper No: EP-12-1092
https://doi.org/10.1115/1.4024944
Published Online: July 24, 2013
View Article titled, Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell
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Topics: Computer simulation, Data centers, Flow (Dynamics), Temperature, Tiles, Turbulence, Computational fluid dynamics, Uncertainty
Journal Articles

Analysis of Heat Transfer Enhancement in Minichannel Heat Sinks With Turbulent Flow Using H 2 O – Al 2 O 3 Nanofluids

T. L. Bergman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021008.
https://doi.org/10.1115/1.3103949
Published Online: April 2, 2009
View Article titled, Analysis of Heat Transfer Enhancement in Minichannel Heat Sinks With Turbulent Flow Using H 2 O – Al 2 O 3 Nanofluids
Open the PDF for Analysis of Heat Transfer Enhancement in Minichannel Heat Sinks With Turbulent Flow Using H 2 O – Al 2 O 3 Nanofluids in another window
Topics: Heat sinks, Heat transfer, Nanofluids, Turbulence, Water, Coolants, Fluids
Journal Articles

Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels

E. Elsaadawy, H. Mortazavi, M. S. Hamed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031011.
https://doi.org/10.1115/1.2912182
Published Online: August 5, 2008
View Article titled, Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels
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Topics: Turbulence, Forced convection, Shear stress
Journal Articles

Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement

C. J. Fang, M. C. Wu, Y. M. Kuo, C. Y. Lee, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 400–410.
https://doi.org/10.1115/1.2804087
Published Online: December 28, 2006
View Article titled, Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement
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Topics: Disks, Heat transfer, Nozzles, Reynolds number, Transients (Dynamics), Turbulence, Heat flux, Steady state, Jets, Rotation
Journal Articles

Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink

X. L. Xie, W. Q. Tao, Y. L. He
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 247–255.
https://doi.org/10.1115/1.2753887
Published Online: December 13, 2006
View Article titled, Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink
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Topics: Cooling, Heat flux, Heat sinks, Heat transfer, Pressure drop, Temperature, Thermal resistance, Turbulence, Wall thickness, Water
Journal Articles

Air Cooling of Variable Array of Heated Modules in a Vertical Channel

Vipin Yadav, Keshav Kant
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 205–215.
https://doi.org/10.1115/1.2721594
Published Online: July 23, 2006
View Article titled, Air Cooling of Variable Array of Heated Modules in a Vertical Channel
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Topics: Computer simulation, Convection, Cooling, Flow (Dynamics), Heat transfer, Temperature, Printed circuit boards, Boundary-value problems, Turbulence, Heat flux
Journal Articles

Flow Structure and Enhanced Heat Transfer in Channel Flow With Dimpled Surfaces: Application to Heat Sinks in Microelectronic Cooling

Carlos Silva, Egidio Marotta, Leroy Fletcher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 157–166.
https://doi.org/10.1115/1.2721087
Published Online: July 3, 2006
View Article titled, Flow Structure and Enhanced Heat Transfer in Channel Flow With Dimpled Surfaces: Application to Heat Sinks in Microelectronic Cooling
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Topics: Channel flow, Computer simulation, Cooling, Design, Flow (Dynamics), Friction, Heat sinks, Heat transfer, Reynolds number, Geometry
Journal Articles

An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature

Peter Rodgers, Vale´rie Eveloy, M. S. J. Hashmi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 67–75.
https://doi.org/10.1115/1.1849234
Published Online: March 21, 2005
View Article titled, An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature
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Topics: Computational fluid dynamics, Flow (Dynamics), Heat transfer, Junctions, Modeling, Temperature, Turbulence, Viscosity, Eddies (Fluid dynamics), Air flow
Journal Articles

Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

Jeffrey Rambo, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 452–459.
https://doi.org/10.1115/1.2056575
Published Online: February 11, 2005
View Article titled, Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet
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Topics: Air flow, Blades, Computational fluid dynamics, Cooling, Energy dissipation, Entropy, Flow (Dynamics), Temperature, Thermal management, Heat
Journal Articles

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Tunc Icoz, Yogesh Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 465–471.
https://doi.org/10.1115/1.1827262
Published Online: January 24, 2005
View Article titled, Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs
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Topics: Computer simulation, Cooling systems, Design, Electronic equipment, Flow (Dynamics), Heat, Temperature, Turbulence, Cooling, Heat transfer
Journal Articles

h adiabatic and u max ′

Robert J. Moffat
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 501–509.
https://doi.org/10.1115/1.1827265
Published Online: January 24, 2005
View Article titled, h adiabatic and u max ′
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Topics: Computational fluid dynamics, Flow (Dynamics), Heat transfer, Temperature, Turbulence, Heat transfer coefficients, Heat conduction, Heating, Coolants, Computer cooling
Journal Articles

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

Alfonso Ortega, Shankar Ramanathan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 226–234.
https://doi.org/10.1115/1.1569506
Published Online: June 10, 2003
View Article titled, On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources
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Topics: Cooling, Flow (Dynamics), Heat, Strips, Temperature, Wakes, Electronic components, Turbulence
Journal Articles

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

Peter J. Rodgers, Vale´rie C. Eveloy, Mark R. Davies
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 76–83.
https://doi.org/10.1115/1.1533060
Published Online: March 14, 2003
View Article titled, An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion
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Topics: Computer software, Flow (Dynamics), Forced convection, Heat transfer, Junctions, Modeling, Temperature, Thermal conductivity, Errors, Computational fluid dynamics
Journal Articles

A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 107–114.
https://doi.org/10.1115/1.483141
Published Online: October 1, 1999
View Article titled, A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
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Topics: Ball-Grid-Array packaging, Heat sinks, Heat transfer, Junctions, Modeling, Natural convection, Radiation (Physics), Solders, Temperature, Thermal conductivity
Journal Articles

Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks

Y. Asako, Y. Yamaguchi, M. Faghri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 202–208.
https://doi.org/10.1115/1.2792685
Published Online: September 1, 1999
View Article titled, Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks
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Topics: Flow (Dynamics), Heat transfer, Ducts, Reynolds number, Computation, Flow visualization, Fluid dynamics, Numerical analysis, Plates (structures), Prandtl number
Journal Articles

Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct

A. Gupta, Y. Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 243–252.
https://doi.org/10.1115/1.2792629
Published Online: September 1, 1998
View Article titled, Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct
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Topics: Cooling, Ducts, Heat, Reynolds number, Heat transfer, Water, Algebra, Buoyancy, Flow (Dynamics), Flow visualization
Journal Articles

Orifice and Impingement Flow Fields in Confined Jet Impingement

G. K. Morris, S. V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 68–72.
https://doi.org/10.1115/1.2792288
Published Online: March 1, 1998
View Article titled, Orifice and Impingement Flow Fields in Confined Jet Impingement
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Topics: Flow (Dynamics), Pressure drop, Design, Electronic packaging, Flow visualization, Heat transfer, Outflow, Renormalization (Physics), Reynolds number, Separation (Technology)
Journal Articles

Solid Model Based Preprocessor to CFD Code for Applications to Electronic Cooling Systems

D. Agonafer, A. Vimba
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 138–143.
https://doi.org/10.1115/1.2792220
Published Online: June 1, 1997
View Article titled, Solid Model Based Preprocessor to CFD Code for Applications to Electronic Cooling Systems
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Topics: Computational fluid dynamics, Computer cooling, Solid models, Computer-aided design, Boundary-value problems, Fluids, Geometry, Materials properties, Mesh generation, Turbulence