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Journal Articles

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Chong Ye, Charles I. Ume, Suresh K. Sitaraman

J. Electron. Packag. June 2020, 142(2): 021007.

Paper No: EP-19-1085

DOI: https://doi.org/10.1115/1.4046163

Published Online: March 9, 2020

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Topics: Carbon, Electronics, Finite element analysis, Polymers, Strips, Simulation, Textiles, Mechanical properties

Journal Articles

Investigation of Strip Warpage Behavior in Wire Bonding Process

Wan-Chun Chuang, Wei-Long Chen

J. Electron. Packag. June 2020, 142(2): 021002.

Paper No: EP-19-1067

DOI: https://doi.org/10.1115/1.4045362

Published Online: February 3, 2020

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Topics: Strips, Temperature, Warping, Molding, Assembly lines

Journal Articles

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

Youmin Yu, Victor Chiriac, Yingwei Jiang, Zhijie Wang

J. Electron. Packag. June 2015, 137(2): 021013.

Paper No: EP-13-1015

DOI: https://doi.org/10.1115/1.4029569

Published Online: June 1, 2015

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Topics: Heat transfer, Optimization, Solders, Strips, Reflow soldering

Journal Articles

Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution

Jun Jie Liu, Hua Zhang, S. C. Yao, Yubai Li

J. Electron. Packag. June 2014, 136(2): 021008.

Paper No: EP-13-1129

DOI: https://doi.org/10.1115/1.4027420

Published Online: April 29, 2014

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Topics: Boiling, Cooling, Flow (Dynamics), Heat flux, Heat transfer, Microchannels, Modeling, Porous materials, Pressure drop, Temperature

Journal Articles

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

Bengt Sundén, Gongnan Xie

J. Electron. Packag. June 2014, 136(2): 024501.

Paper No: EP-13-1058

DOI: https://doi.org/10.1115/1.4026538

Published Online: April 29, 2014

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Topics: Cooling, Heat, Heat sinks, Strips, Temperature, Thermal analysis, Thermal resistance, Electrical conductance, Invar, Temperature distribution

Journal Articles

A Novel Low Cost Package for Radio Frequency Applications

Sandeep Chaturvedi, Shiban K. Koul

J. Electron. Packag. June 2013, 135(2): 024501.

Paper No: EP-11-1096

DOI: https://doi.org/10.1115/1.4023041

Published Online: March 28, 2013

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Topics: Design, Laminates, Manufacturing, Simulation, Strip transmission lines, Strips

Journal Articles

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

X. Zhao, M. Saka, M. Yamashita, F. Togoh

J. Electron. Packag. June 2010, 132(2): 021003.

DOI: https://doi.org/10.1115/1.4001687

Published Online: June 11, 2010

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Topics: Current density, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion, Grain size, Temperature, Sputtering (Irradiation), Circuits, Damage, Strips

Journal Articles

Flip-Chip Interconnect for Coplanar Strip Lines

Young K. Song, Chin C. Lee

J. Electron. Packag. December 2008, 130(4): 044501.

DOI: https://doi.org/10.1115/1.2993140

Published Online: November 17, 2008

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Topics: Flip-chip, Strips, Circuits, Solders, Signals, Waveguides

Journal Articles

Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

Brian Smith, Cristina Amon

J. Electron. Packag. December 2007, 129(4): 504–511.

DOI: https://doi.org/10.1115/1.2804101

Published Online: August 19, 2007

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Topics: Heat, Manufacturing, Sensors, Temperature, Thermal conductivity, Thermal diffusion, Thermal properties, Boundary-value problems, Microsensors, Strips

Journal Articles

Singulation of Electronic Packages With Abrasive Waterjets

Mohamed Hashish

J. Electron. Packag. December 2006, 128(4): 479–483.

DOI: https://doi.org/10.1115/1.2353328

Published Online: February 9, 2006

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Topics: Cutting, Strips, Nozzles, Machinery, Flow (Dynamics)

Journal Articles

Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

Man-Lung Sham, Jang-Kyo Kim

J. Electron. Packag. March 2005, 127(1): 47–51.

DOI: https://doi.org/10.1115/1.1849232

Published Online: March 21, 2005

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Topics: Residual stresses, Resins, Strips, Numerical analysis, Temperature, Finite element analysis, Stress

Journal Articles

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

Mitul Modi, Suresh K. Sitaraman

J. Electron. Packag. September 2004, 126(3): 301–307.

DOI: https://doi.org/10.1115/1.1772410

Published Online: October 6, 2004

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Topics: Fracture toughness, Stress, Titanium, Silicon, Fracture (Materials), Delamination, Metals, Adhesion, Strips, Adhesives

Journal Articles

Submodeling Analysis for Path-Dependent Thermomechanical Problems

Tong Hong Wang, Yi-Shao Lai

J. Electron. Packag. June 2005, 127(2): 135–140.

DOI: https://doi.org/10.1115/1.1869513

Published Online: September 28, 2004

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Topics: Fatigue, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Strips, Electronic packages

Journal Articles

Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill

Ji Eun Park, Iwona Jasiuk, Aleksander Zubelewicz

J. Electron. Packag. September 2003, 125(3): 400–413.

DOI: https://doi.org/10.1115/1.1602480

Published Online: September 17, 2003

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Topics: Particulate matter, Stress, Fracture (Materials), Fracture (Process), Strips

Journal Articles

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

Alfonso Ortega, Shankar Ramanathan

J. Electron. Packag. June 2003, 125(2): 226–234.

DOI: https://doi.org/10.1115/1.1569506

Published Online: June 10, 2003

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Topics: Cooling, Flow (Dynamics), Heat, Strips, Temperature, Wakes, Electronic components, Turbulence

Journal Articles

Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies

Ji Eun Park, Iwona Jasiuk, Mem. ASME,, Alek Zubelewicz

J. Electron. Packag. March 2003, 125(1): 44–52.

DOI: https://doi.org/10.1115/1.1527656

Published Online: March 14, 2003

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Topics: Fracture (Materials), Fracture (Process), Particulate matter, Stress, Strips, Flip-chip assemblies

Journal Articles

Damage Accumulation During Stress Relaxation of Polymer Films in Bending

D. Ingman, Y. Michlin

J. Electron. Packag. September 2002, 124(3): 260–265.

DOI: https://doi.org/10.1115/1.1463731

Published Online: July 26, 2002

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Topics: Damage, Relaxation (Physics), Stress, Strips, Deformation, Polymer films

Journal Articles

Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array

Wataru Nakayama, Masud Behnia, Hiroaki Mishima

J. Electron. Packag. June 2000, 122(2): 132–137.

DOI: https://doi.org/10.1115/1.483145

Published Online: February 18, 2000

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Topics: Boiling, Coolants, Critical heat flux, Flow (Dynamics), Forced convection, Heat transfer, Strips, Subcooling, Temperature, Nozzles

Journal Articles

Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens

W. Ren, Z. Qian, M. Lu, S. Liu, D. Shangguan

J. Electron. Packag. December 1999, 121(4): 271–274.

DOI: https://doi.org/10.1115/1.2793851

Published Online: December 1, 1999

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Topics: Alloys, Lead-free solders, Strips, Fatigue, Computers, Creep, Electronic packaging, Solders, Testing, Thermomechanics

Journal Articles

Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading

J. W. Tierney, J. W. Eischen

J. Electron. Packag. December 1997, 119(4): 281–287.

DOI: https://doi.org/10.1115/1.2792250

Published Online: December 1, 1997

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Topics: Algebra, Equilibrium (Physics), Finite element analysis, Microelectronic devices, Stress, Stress analysis (Engineering), Stress concentration, Strips

Journal citation

NARROW

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Investigation of Strip Warpage Behavior in Wire Bonding Process

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

A Novel Low Cost Package for Radio Frequency Applications

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

Flip-Chip Interconnect for Coplanar Strip Lines

Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

Singulation of Electronic Packages With Abrasive Waterjets

Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

Submodeling Analysis for Path-Dependent Thermomechanical Problems

Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies

Damage Accumulation During Stress Relaxation of Polymer Films in Bending

Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array

Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens

Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading

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