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Journal Articles

Simulation of Secondary Contact to Generate Very High Accelerations

Stuart T. Douglas, Moustafa Al-Bassyiouni, Abhijit Dasgupta, Kevin Gilman, Aaron Brown
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031011.
Paper No: EP-13-1121
https://doi.org/10.1115/1.4030685
Published Online: September 1, 2015
View Article titled, Simulation of Secondary Contact to Generate Very High Accelerations
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Topics: Damping, Elastomers, Finite element analysis, Simulation, Springs, Stiffness, Modeling, Manufacturing, Clearances (Engineering)
Journal Articles

Variable-Length Link-Spring Model for Kink Formation During Wire Bonding

Fuliang Wang, Weidong Tang, Junhui Li, Lei Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041004.
Paper No: EP-12-1061
https://doi.org/10.1115/1.4025308
Published Online: September 19, 2013
View Article titled, Variable-Length Link-Spring Model for Kink Formation During Wire Bonding
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Topics: Springs, Wire, Wire bonding, Deformation
Journal Articles

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

Brett Fennell, Sangil Lee, Daniel F. Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041013.
https://doi.org/10.1115/1.4002825
Published Online: December 8, 2010
View Article titled, Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid
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Topics: Flip-chip devices, Flow (Dynamics), Solders, Modeling, Springs, Surface tension, Viscosity, Fluids, Dampers
Journal Articles

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Fang Liu, Guang Meng, Mei Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 266–272.
https://doi.org/10.1115/1.2753910
Published Online: March 15, 2007
View Article titled, Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
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Topics: Damping, Deflection, Dynamics (Mechanics), Springs, Viscoelasticity, Viscosity, Dynamic analysis
Journal Articles

Board Level Drop Impact—Fundamental and Parametric Analysis

E. H. Wong, Y-W Mai, S. K. W. Seah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
https://doi.org/10.1115/1.2065747
Published Online: March 30, 2005
View Article titled, Board Level Drop Impact—Fundamental and Parametric Analysis
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Topics: Stress, Dynamics (Mechanics), Springs, Manufacturing
Journal Articles

Dynamics Of Board-Level Drop Impact

E. H. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 200–207.
https://doi.org/10.1115/1.1938987
Published Online: July 17, 2004
View Article titled, Dynamics Of Board-Level Drop Impact
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Topics: Corners (Structural elements), Deflection, Dynamics (Mechanics), Finite element analysis, Springs, Stress, Electronic packaging, Impact testing
Journal Articles

Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Mudasir Ahmad, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 411–418.
https://doi.org/10.1115/1.1512296
Published Online: December 12, 2002
View Article titled, Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications
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Topics: Springs, Stress
Journal Articles

Shape Optimal Design of Contact Springs of Electronic Connectors

Yeh-Liang Hsu, Yuan-Chan Hsu, Ming-Sho Hsu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 178–183.
https://doi.org/10.1115/1.1463730
Published Online: July 26, 2002
View Article titled, Shape Optimal Design of Contact Springs of Electronic Connectors
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Topics: Design, Springs, Shapes
Journal Articles

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

K. N. Chiang, Associate Professor, C. W. Chang, Graduate Student, C. T. Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 331–337.
https://doi.org/10.1115/1.1389847
Published Online: May 10, 2001
View Article titled, Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages
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Topics: Adhesives, Finite element analysis, Flip-chip devices, Manufacturing, Modeling, Particulate matter, Pressure, Springs, Mechanical behavior, Flip-chip packages
Journal Articles

An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

J. A. Swanson, S. M. Heinrich, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 303–311.
https://doi.org/10.1115/1.2793857
Published Online: December 1, 1999
View Article titled, An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects
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Topics: Solders, Shear (Mechanics), Deflection, Stiffness, Stress, Deformation, Die cutting, Displacement, Fatigue life, Finite element model
Journal Articles

Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration

G. H. Lim, J. H. Ong, J. E. T. Penny
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1999, 121(2): 122–126.
https://doi.org/10.1115/1.2792666
Published Online: June 1, 1999
View Article titled, Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration
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Topics: Printed circuit boards, Vibration, Wedges, Boundary-value problems, Dynamic response, Springs, Vibration tests
Journal Articles

Finding the Constitutive Relation for a Specific Elastomer

Yun Ling, Peter A. Engel, Wm. L. Brodskey, Yifan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 329–336.
https://doi.org/10.1115/1.2909336
Published Online: September 1, 1993
View Article titled, Finding the Constitutive Relation for a Specific Elastomer
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Topics: Elastomers, Compression, Deflection, Deformation, Finite element analysis, Natural rubber, Polynomials, Shear (Mechanics), Springs, Stress
Journal Articles

Modeling the Vibration Restraints of Wedge Lock Card Guides

D. B. Barker, Y. S. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 189–194.
https://doi.org/10.1115/1.2909316
Published Online: June 1, 1993
View Article titled, Modeling the Vibration Restraints of Wedge Lock Card Guides
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Topics: Locks (Waterways), Modeling, Vibration, Wedges, Boundary-value problems, Deflection, Elastic constants, Frequency response, Rotation, Springs
Journal Articles

Sensor Technology for ZIF Connectors

T. Chikazawa, C. K. Lim, H. V. Luu, M. D. Toda, J. T. Vogelmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 187–191.
https://doi.org/10.1115/1.2904365
Published Online: September 1, 1990
View Article titled, Sensor Technology for ZIF Connectors
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Topics: Sensors, Circuits, Design, Springs, Steel
Journal Articles

Stress and Tolerance Analysis for Zero Insertion Force (ZIF) Connector

P. A. Engel, S. E. Nemier, M. D. Toda
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 9–15.
https://doi.org/10.1115/1.3226513
Published Online: March 1, 1989
View Article titled, Stress and Tolerance Analysis for Zero Insertion Force (ZIF) Connector
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Topics: Circuits, Deformation, Design, Finite element analysis, Friction, Plasticity, Probability, Springs, Stress, Stress analysis (Engineering)