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Journal Articles

Simulation of Secondary Contact to Generate Very High Accelerations

Stuart T. Douglas, Moustafa Al-Bassyiouni, Abhijit Dasgupta, Kevin Gilman, Aaron Brown

J. Electron. Packag. September 2015, 137(3): 031011.

Paper No: EP-13-1121

DOI: https://doi.org/10.1115/1.4030685

Published Online: September 1, 2015

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Topics: Damping, Elastomers, Finite element analysis, Simulation, Springs, Stiffness, Modeling, Manufacturing, Clearances (Engineering)

Journal Articles

Variable-Length Link-Spring Model for Kink Formation During Wire Bonding

Fuliang Wang, Weidong Tang, Junhui Li, Lei Han

J. Electron. Packag. December 2013, 135(4): 041004.

Paper No: EP-12-1061

DOI: https://doi.org/10.1115/1.4025308

Published Online: September 19, 2013

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Topics: Springs, Wire, Wire bonding, Deformation

Journal Articles

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

Brett Fennell, Sangil Lee, Daniel F. Baldwin

J. Electron. Packag. December 2010, 132(4): 041013.

DOI: https://doi.org/10.1115/1.4002825

Published Online: December 8, 2010

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Topics: Flip-chip devices, Flow (Dynamics), Solders, Modeling, Springs, Surface tension, Viscosity, Fluids, Dampers

Journal Articles

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Fang Liu, Guang Meng, Mei Zhao

J. Electron. Packag. September 2007, 129(3): 266–272.

DOI: https://doi.org/10.1115/1.2753910

Published Online: March 15, 2007

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Topics: Damping, Deflection, Dynamics (Mechanics), Springs, Viscoelasticity, Viscosity, Dynamic analysis

Journal Articles

Board Level Drop Impact—Fundamental and Parametric Analysis

E. H. Wong, Y-W Mai, S. K. W. Seah

J. Electron. Packag. December 2005, 127(4): 496–502.

DOI: https://doi.org/10.1115/1.2065747

Published Online: March 30, 2005

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Topics: Stress, Dynamics (Mechanics), Springs, Manufacturing

Journal Articles

Dynamics Of Board-Level Drop Impact

E. H. Wong

J. Electron. Packag. September 2005, 127(3): 200–207.

DOI: https://doi.org/10.1115/1.1938987

Published Online: July 17, 2004

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Topics: Corners (Structural elements), Deflection, Dynamics (Mechanics), Finite element analysis, Springs, Stress, Electronic packaging, Impact testing

Journal Articles

Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Mudasir Ahmad, Suresh K. Sitaraman

J. Electron. Packag. December 2002, 124(4): 411–418.

DOI: https://doi.org/10.1115/1.1512296

Published Online: December 12, 2002

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Topics: Springs, Stress

Journal Articles

Shape Optimal Design of Contact Springs of Electronic Connectors

Yeh-Liang Hsu, Yuan-Chan Hsu, Ming-Sho Hsu

J. Electron. Packag. September 2002, 124(3): 178–183.

DOI: https://doi.org/10.1115/1.1463730

Published Online: July 26, 2002

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Topics: Design, Springs, Shapes

Journal Articles

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

K. N. Chiang, Associate Professor, C. W. Chang, Graduate Student, C. T. Lin, Graduate Student

J. Electron. Packag. December 2001, 123(4): 331–337.

DOI: https://doi.org/10.1115/1.1389847

Published Online: May 10, 2001

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Topics: Adhesives, Finite element analysis, Flip-chip devices, Manufacturing, Modeling, Particulate matter, Pressure, Springs, Mechanical behavior, Flip-chip packages

Journal Articles

An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

J. A. Swanson, S. M. Heinrich, P. S. Lee

J. Electron. Packag. December 1999, 121(4): 303–311.

DOI: https://doi.org/10.1115/1.2793857

Published Online: December 1, 1999

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Topics: Solders, Shear (Mechanics), Deflection, Stiffness, Stress, Deformation, Die cutting, Displacement, Fatigue life, Finite element model

Journal Articles

Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration

G. H. Lim, J. H. Ong, J. E. T. Penny

J. Electron. Packag. June 1999, 121(2): 122–126.

DOI: https://doi.org/10.1115/1.2792666

Published Online: June 1, 1999

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Topics: Printed circuit boards, Vibration, Wedges, Boundary-value problems, Dynamic response, Springs, Vibration tests

Journal Articles

Finding the Constitutive Relation for a Specific Elastomer

Yun Ling, Peter A. Engel, Wm. L. Brodskey, Yifan Guo

J. Electron. Packag. September 1993, 115(3): 329–336.

DOI: https://doi.org/10.1115/1.2909336

Published Online: September 1, 1993

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Topics: Elastomers, Compression, Deflection, Deformation, Finite element analysis, Natural rubber, Polynomials, Shear (Mechanics), Springs, Stress

Journal Articles

Modeling the Vibration Restraints of Wedge Lock Card Guides

D. B. Barker, Y. S. Chen

J. Electron. Packag. June 1993, 115(2): 189–194.

DOI: https://doi.org/10.1115/1.2909316

Published Online: June 1, 1993

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Topics: Locks (Waterways), Modeling, Vibration, Wedges, Boundary-value problems, Deflection, Elastic constants, Frequency response, Rotation, Springs

Journal Articles

Sensor Technology for ZIF Connectors

T. Chikazawa, C. K. Lim, H. V. Luu, M. D. Toda, J. T. Vogelmann

J. Electron. Packag. September 1990, 112(3): 187–191.

DOI: https://doi.org/10.1115/1.2904365

Published Online: September 1, 1990

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Topics: Sensors, Circuits, Design, Springs, Steel

Journal Articles

Stress and Tolerance Analysis for Zero Insertion Force (ZIF) Connector

P. A. Engel, S. E. Nemier, M. D. Toda

J. Electron. Packag. March 1989, 111(1): 9–15.

DOI: https://doi.org/10.1115/1.3226513

Published Online: March 1, 1989

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Topics: Circuits, Deformation, Design, Finite element analysis, Friction, Plasticity, Probability, Springs, Stress, Stress analysis (Engineering)

Journal citation

NARROW

Simulation of Secondary Contact to Generate Very High Accelerations

Variable-Length Link-Spring Model for Kink Formation During Wire Bonding

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Board Level Drop Impact—Fundamental and Parametric Analysis

Dynamics Of Board-Level Drop Impact

Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Shape Optimal Design of Contact Springs of Electronic Connectors

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration

Finding the Constitutive Relation for a Specific Elastomer

Modeling the Vibration Restraints of Wedge Lock Card Guides

Sensor Technology for ZIF Connectors

Stress and Tolerance Analysis for Zero Insertion Force (ZIF) Connector

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