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Journal Articles

Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

Pradeep Lall, Hyesoo Jang, Curtis Hill
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041114.
Paper No: EP-24-1002
https://doi.org/10.1115/1.4065940
Published Online: August 17, 2024
View Article titled, Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition
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Topics: Capacitance, Sensors, Temperature, Water, Simulation, Reliability, Printing
Journal Articles

Convection Cooling of Power Electronics Operating in Deep-Space

Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041111.
Paper No: EP-24-1027
https://doi.org/10.1115/1.4065947
Published Online: August 9, 2024
View Article titled, Convection Cooling of Power Electronics Operating in Deep-Space
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Topics: Design, Electronics, Fans, Forced convection, Heat, Simulation, Temperature, Thermal management, Packaging, Cooling
Journal Articles

Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning

Calvin Ling, Muhammad Taufik Azahari, Mohamad Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011001.
Paper No: EP-22-1076
https://doi.org/10.1115/1.4065077
Published Online: April 5, 2024
View Article titled, Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
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Topics: Ball-Grid-Array packaging, Computer simulation, Machine learning, Pressure, Solders, Valves, Epoxy adhesives, Epoxy resins, Simulation, Temperature
Journal Articles

Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform

Ziyang Wang, Haibo Zhou, Linjiao Xiao, Lian Duan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031005.
Paper No: EP-23-1069
https://doi.org/10.1115/1.4064704
Published Online: February 28, 2024
View Article titled, Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform
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Topics: Errors, Kinematics, Packaging, Particle swarm optimization, Artificial neural networks, Design, Particulate matter, Trajectories (Physics), Simulation, Displacement
Journal Articles

Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application

Utsav Gupta, Andras Vass-Varnai, Voon Hon Wong, Ayman Fayed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041106.
Paper No: EP-23-1031
https://doi.org/10.1115/1.4063883
Published Online: November 1, 2023
View Article titled, Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application
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Topics: Design, Electric vehicles, Silicon carbide, Simulation, Modeling, Temperature
Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

Reece Whitt, Rafael Estrella, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041103.
Paper No: EP-23-1032
https://doi.org/10.1115/1.4063484
Published Online: October 9, 2023
View Article titled, Converging Jet Impingement for Enhanced Liquid Cooling
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Topics: Additive manufacturing, Cooling, Electronics, Fluids, Heat transfer, Jets, Nozzles, Pressure, Reynolds number, Simulation
Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Article titled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031007.
Paper No: EP-22-1070
https://doi.org/10.1115/1.4056886
Published Online: March 7, 2023
View Article titled, A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress
Journal Articles

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Behnam Garakani, Udara S. Somarathna, Ashraf Umar, Gurvinder Singh Khinda, Mohamed Youssef M. Abdelatty, El Mehdi Abbara, Sari Al Zerey, Mike Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, Mark Ronay, Mark D. Poliks
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031006.
Paper No: EP-22-1008
https://doi.org/10.1115/1.4056640
Published Online: February 1, 2023
View Article titled, Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics
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Topics: Fatigue, Liquid metals, Tension, Transmission lines, Cycles, Fatigue testing, Reliability, Wearable devices, Metals, Simulation
Journal Articles

Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications

Giuseppe Mauromicale, Michele Calabretta, Giuseppe Scarcella, Giacomo Scelba, Alessandro Sitta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031003.
Paper No: EP-22-1049
https://doi.org/10.1115/1.4056413
Published Online: December 23, 2022
View Article titled, Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications
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Topics: Power semiconductor devices, Simulation, Design, Automotive industry, System-in-package, Thermomechanics, Cycles
Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
https://doi.org/10.1115/1.4056445
Published Online: December 23, 2022
View Article titled, Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles
Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
https://doi.org/10.1115/1.4055591
Published Online: September 28, 2022
View Article titled, Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems
Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Han-Ling Li, Yang Shen, Yu-Chao Hua, S. L. Sobolev, Bing-Yang Cao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011203.
Paper No: EP-22-1007
https://doi.org/10.1115/1.4054698
Published Online: July 13, 2022
View Article titled, Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs
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Topics: Diffusion (Physics), Gallium nitride, Heat, Heating, Modeling, Phonons, Simulation, Temperature, Heat conduction, Junctions
Journal Articles

Electrothermal Analysis of System in Package for Aerospace Application

Hao-hang Su, Shuai Fu, Su-yuan Li, Jiang Bian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011202.
Paper No: EP-22-1014
https://doi.org/10.1115/1.4054462
Published Online: July 7, 2022
View Article titled, Electrothermal Analysis of System in Package for Aerospace Application
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Topics: Aerospace industry, Design, Heat, Joules, Reliability, Simulation, System-in-package, Temperature, Vacuum, Errors
Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Michael Deckard, Darin J. Sharar, Michael Fish, Patrick J. Shamberger
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011201.
Paper No: EP-21-1153
https://doi.org/10.1115/1.4054651
Published Online: July 7, 2022
View Article titled, Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat
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Topics: Heat, Phase change materials, Steady state, Temperature, Transients (Dynamics), Melting, Copper, Heat sinks, Tradeoffs, Simulation
Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
https://doi.org/10.1115/1.4054183
Published Online: April 22, 2022
View Article titled, Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress
Includes: Supplementary data
Journal Articles

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024501.
Paper No: EP-21-1070
https://doi.org/10.1115/1.4053363
Published Online: January 28, 2022
View Article titled, Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics
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Topics: Computational fluid dynamics, Data centers, Heat sinks, Particulate matter, Simulation, Contamination, Flow (Dynamics), Particle flow
Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
View Article titled, A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging
Journal Articles

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041109.
Paper No: EP-21-1087
https://doi.org/10.1115/1.4052814
Published Online: November 5, 2021
View Article titled, Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging
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Topics: Algorithms, Artificial neural networks, Bridges (Structures), Cooling, Heat sinks, Junctions, Machine learning, Machinery, Simulation, Steady state
Includes: Supplementary data
Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021106.
Paper No: EP-21-1010
https://doi.org/10.1115/1.4052070
Published Online: October 6, 2021
View Article titled, Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping