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Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal Finegan, Sreekant Narumanchi

J. Electron. Packag. September 2023, 145(3): 034501.

Paper No: EP-22-1053

DOI: https://doi.org/10.1115/1.4056306

Published Online: December 9, 2022

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Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)

Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Swapnil S. Salvi, Ankur Jain

J. Electron. Packag. June 2021, 143(2): 020901.

Paper No: EP-20-1058

DOI: https://doi.org/10.1115/1.4049291

Published Online: February 22, 2021

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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits

Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury

J. Electron. Packag. December 2020, 142(4): 041107.

Paper No: EP-19-1131

DOI: https://doi.org/10.1115/1.4047409

Published Online: June 26, 2020

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Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)

Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou

J. Electron. Packag. June 2019, 141(2): 020801.

Paper No: EP-18-1026

DOI: https://doi.org/10.1115/1.4041813

Published Online: February 25, 2019

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Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry

Journal Articles

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Bongtae Han, Dae-Suk Kim

J. Electron. Packag. March 2017, 139(1): 010802.

Paper No: EP-16-1107

DOI: https://doi.org/10.1115/1.4035598

Published Online: January 16, 2017

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Topics: Diffusion (Physics), Polymers, Temperature, Cavities, Semiconductors (Materials), Packaging, Water, Vapor pressure

Journal Articles

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

K. S. Siow, Y. T. Lin

J. Electron. Packag. June 2016, 138(2): 020804.

Paper No: EP-16-1006

DOI: https://doi.org/10.1115/1.4033069

Published Online: April 21, 2016

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Topics: Patents, Pressure, Sintering, Bonding, Semiconductors (Materials)

Journal Articles

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

C. L. Gan, U. Hashim

J. Electron. Packag. June 2013, 135(2): 021010.

Paper No: EP-12-1099

DOI: https://doi.org/10.1115/1.4024013

Published Online: April 12, 2013

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Topics: High temperature, Packaging, Reliability, Stress, Wire, Failure mechanisms, Temperature, Semiconductors (Materials), Nanoscale phenomena, Nanoelectronics

Journal Articles

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

Yutaka Kumano, Tetsuyoshi Ogura, Toru Yamada

J. Electron. Packag. June 2009, 131(2): 021007.

DOI: https://doi.org/10.1115/1.3103947

Published Online: April 2, 2009

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Topics: Computational fluid dynamics, Junctions, Semiconductors (Materials), Temperature, Thermal conductivity, Modeling, Thermal analysis, Anisotropy

Journal Articles

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Samson Yoon, Changsoo Jang, Bongtae Han

J. Electron. Packag. June 2008, 130(2): 024502.

DOI: https://doi.org/10.1115/1.2912181

Published Online: May 14, 2008

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Topics: Diffusion (Physics), Finite element analysis, Heat transfer, Modeling, Semiconductors (Materials), Stress, Stress analysis (Engineering), Temperature, Deformation, Thermal expansion

Journal Articles

Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

Brian Smith, Cristina Amon

J. Electron. Packag. December 2007, 129(4): 504–511.

DOI: https://doi.org/10.1115/1.2804101

Published Online: August 19, 2007

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Topics: Heat, Manufacturing, Sensors, Temperature, Thermal conductivity, Thermal diffusion, Thermal properties, Boundary-value problems, Microsensors, Strips

Journal Articles

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya

J. Electron. Packag. December 2002, 124(4): 323–327.

DOI: https://doi.org/10.1115/1.1501304

Published Online: December 12, 2002

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Topics: Fracture (Materials), Fracture (Process), Fracture toughness, Resins, Semiconductors (Materials), Stress, Temperature, Stress concentration, Finite element analysis, Delamination

Journal Articles

IGBT Package Design for High Power Aircraft Electronic Systems

Farhad Sarvar, David C. Whalley, Ming K. Low

J. Electron. Packag. December 2001, 123(4): 338–343.

DOI: https://doi.org/10.1115/1.1390341

Published Online: September 3, 2001

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Topics: Design, Electronic systems, Fins, Heat conduction, Heat transfer, Modeling, Steady state, Temperature, Transients (Dynamics), Aircraft

Journal Articles

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Sejin Han, K. K. Wang

J. Electron. Packag. March 2000, 122(1): 20–27.

DOI: https://doi.org/10.1115/1.483127

Published Online: August 17, 1999

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Topics: Cavities, Flow (Dynamics), Hardening (Curing), Molding, Packing (Shipments), Packings (Cushioning), Pressure, Semiconductors (Materials), Temperature, Viscosity

Journal Articles

Failure Estimation of Semiconductor Chip During Wire Bonding Process

T. Ikeda, N. Miyazaki, K. Kudo, K. Arita, H. Yakiyama

J. Electron. Packag. June 1999, 121(2): 85–91.

DOI: https://doi.org/10.1115/1.2792672

Published Online: June 1, 1999

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Topics: Failure, Semiconductors (Materials), Wire bonding, Gallium arsenide, Pressure, Wire, Cycles, Deformation, Electronic packaging, Metals

Journal Articles

Flow Analysis in a Chip Cavity During Semiconductor Encapsulation

S. Han, K. K. Wang

J. Electron. Packag. June 2000, 122(2): 160–167.

DOI: https://doi.org/10.1115/1.483149

Published Online: January 11, 1999

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Topics: Cavities, Cross-flow, Flow (Dynamics), Molding, Epoxy adhesives, Epoxy resins, Semiconductors (Materials)

Journal Articles

Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

S. Han, K. K. Wang, D. L. Crouthamel

J. Electron. Packag. December 1997, 119(4): 247–254.

DOI: https://doi.org/10.1115/1.2792245

Published Online: December 1, 1997

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Topics: Semiconductors (Materials), Wire, Cavities, Epoxy adhesives, Epoxy resins, Manufacturing, Materials properties, Molding, Shapes, Temperature

Journal Articles

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

S. M. You, T. W. Simon, A. Bar-Cohen

J. Electron. Packag. March 1997, 119(1): 17–25.

DOI: https://doi.org/10.1115/1.2792195

Published Online: March 1, 1997

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Topics: Heat transfer, Pool boiling, Boiling, Bubbles, Fluids, Heat, Heating, Aluminum, Computer cooling, Platinum

Journal Articles

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Sejin Han, K. K. Wang

J. Electron. Packag. September 1995, 117(3): 178–184.

DOI: https://doi.org/10.1115/1.2792089

Published Online: September 1, 1995

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Topics: Semiconductors (Materials), Wire, Deformation, Flow (Dynamics), Bubbles, Cavities, Fluids, Model development, Shapes, Transfer molding

Journal Articles

Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection

S. V. Garimella, D. J. Schlitz

J. Electron. Packag. December 1993, 115(4): 410–415.

DOI: https://doi.org/10.1115/1.2909350

Published Online: December 1, 1993

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Topics: Computers, Forced convection, Generators, Temperature, Vortices, Flow (Dynamics), Pressure drop, Reynolds number, Coolants, Cooling

Journal Articles

Heat Pipes for Cooling High Flux/High Power Semiconductor Chips

M. T. North, C. T. Avedisian

J. Electron. Packag. March 1993, 115(1): 112–117.

DOI: https://doi.org/10.1115/1.2909290

Published Online: March 1, 1993

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Topics: Cooling, Heat pipes, Power semiconductor devices, Heat, Condensers (steam plant), Flux (Metallurgy), Temperature, Water, Copper powders, Design

Journal citation

NARROW

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

IGBT Package Design for High Power Aircraft Electronic Systems

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Failure Estimation of Semiconductor Chip During Wire Bonding Process

Flow Analysis in a Chip Cavity During Semiconductor Encapsulation

Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection

Heat Pipes for Cooling High Flux/High Power Semiconductor Chips

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