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Journal Articles

Transient Liquid Phase Bond Acceleration Using Copper Nanowires

Accepted Manuscript
John Harris, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1038
https://doi.org/10.1115/1.4066042
Published Online: July 20, 2024
View Article titled, Transient Liquid Phase Bond Acceleration Using Copper Nanowires
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Topics: Copper, Nanowires, Transients (Dynamics), Bonding, Solders, Intermetallic compounds, Temperature, Acoustic microscopy, Electroforming, Electronics
Journal Articles

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031010.
Paper No: EP-18-1096
https://doi.org/10.1115/1.4043479
Published Online: May 24, 2019
View Article titled, Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems
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Topics: Sensors, Circuits, Impact testing, Vibration, Polarization (Electricity), Polarization (Light), Polarization (Waves), Reflow soldering
Journal Articles

Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids

Youmin Yu, Victor Chiriac, Yingwei Jiang, Zhijie Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021013.
Paper No: EP-13-1015
https://doi.org/10.1115/1.4029569
Published Online: June 1, 2015
View Article titled, Sequential Reflow-Process Optimization to Reduce Die-Attach Solder Voids
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Topics: Heat transfer, Optimization, Solders, Strips, Reflow soldering
Journal Articles

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Zongjie Han, Songbai Xue, Jianxin Wang, Xin Zhang, Shenglin Yu, Liang Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021004.
https://doi.org/10.1115/1.3103932
Published Online: April 1, 2009
View Article titled, Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders
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Topics: Lasers, Lead-free solders, Mechanical properties, Soldering, Solders, Tin, Reflow soldering
Journal Articles

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

W. K. Chiang, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
https://doi.org/10.1115/1.1849236
Published Online: June 3, 2005
View Article titled, Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing
Open the PDF for Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing in another window
Topics: Contact resistance, Reflow soldering, Reliability, Bonding, Adhesives, Temperature, Anisotropy, Testing
Journal Articles

Hygrothermal Cracking Analysis of Plastic IC Package

Ji Hyuck Yang, Kang Yong Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
https://doi.org/10.1115/1.1870016
Published Online: June 8, 2004
View Article titled, Hygrothermal Cracking Analysis of Plastic IC Package
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Topics: Delamination, Fracture (Materials), Fracture (Process), Fracture mechanics, High temperature, Reflow soldering, Vapor pressure, Viscoelasticity, Low temperature, Design
Journal Articles

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Daijiao Wang, Ronald L. Panton
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 120–126.
https://doi.org/10.1115/1.1876472
Published Online: May 18, 2004
View Article titled, Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies
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Topics: Cooling, Flip-chip assemblies, Heating, Melting, Solder joints, Solders, Temperature, Bubbles, Flow (Dynamics), Reliability
Journal Articles

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki, Nobutaka Ito, Mami Nagatake, Mitsuru Sato
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 31–38.
https://doi.org/10.1115/1.1525244
Published Online: March 14, 2003
View Article titled, Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch
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Topics: Absorption, Corners (Structural elements), Fracture (Materials), Molding resins, Reflow soldering, Stress, Vapor pressure, Diffusion (Physics), Finite element methods
Journal Articles

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
https://doi.org/10.1115/1.1501304
Published Online: December 12, 2002
View Article titled, Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin
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Topics: Fracture (Materials), Fracture (Process), Fracture toughness, Resins, Semiconductors (Materials), Stress, Temperature, Stress concentration, Finite element analysis, Delamination
Journal Articles

The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

E. H. Wong, R. Rajoo, S. W. Koh, T. B. Lim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 122–126.
https://doi.org/10.1115/1.1461367
Published Online: May 2, 2002
View Article titled, The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging
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Topics: Flip-chip devices, Modeling, Packaging, Reflow soldering, Stress, Electronic packaging, Thermal stresses, Diffusion (Physics), Wire, Failure
Journal Articles

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Y. Polsky, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 263–270.
https://doi.org/10.1115/1.2793850
Published Online: December 1, 1999
View Article titled, Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation
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Topics: Circuits, Modeling, Printed circuit boards, Reflow soldering, Thermoelasticity, Warping, Copper, Elasticity, Lamination, Micromechanics (Engineering)
Journal Articles

Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process

Kang Yong Lee, Taek Sung Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 148–155.
https://doi.org/10.1115/1.2792677
Published Online: September 1, 1999
View Article titled, Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process
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Topics: Fracture (Materials), Fracture (Process), Reflow soldering, Delamination, Design, Finite difference methods, Fracture mechanics, Heating, Integrated circuits, Shapes
Journal Articles

A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads

Kuo-Ning Chiang, Associate Professor,, Chang-Ming Liu, Graduate Assistant,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 127–131.
https://doi.org/10.1115/1.1339196
Published Online: August 19, 1999
View Article titled, A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads
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Topics: Reliability, Shapes, Solders, Thermal stresses, Ball-Grid-Array packaging, Geometry, Reflow soldering, Finite element analysis, Design
Journal Articles

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

X. Wu, X. Dou, C.-P. Yeh, K. Waytt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 141–144.
https://doi.org/10.1115/1.2792601
Published Online: June 1, 1998
View Article titled, Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow
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Topics: Simulation, Solder joints, Solders, Geometry, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation
Journal Articles

System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage

M. R. Stiteler, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 1–7.
https://doi.org/10.1115/1.2792196
Published Online: March 1, 1997
View Article titled, System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage
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Topics: Printed circuit boards, Warping, Reflow soldering, Measurement systems, Shades and shadows, Soldering, Vehicles
Journal Articles

Experimental Investigation of the Formation of Surface Mount Solder Joints

P. P. Conway, M. R. Kalantary, D. J. Williams
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 223–228.
https://doi.org/10.1115/1.2792156
Published Online: December 1, 1996
View Article titled, Experimental Investigation of the Formation of Surface Mount Solder Joints
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Topics: Solder joints, Surface mount packaging, Solders, Computers, Manufacturing, Microscopy, Process design, Reflow soldering, Temperature, Wetting
Journal Articles

Ball Grid Array Thermomechanical Response During Reflow Assembly

T. E. Voth, T. L. Bergman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 214–222.
https://doi.org/10.1115/1.2792155
Published Online: December 1, 1996
View Article titled, Ball Grid Array Thermomechanical Response During Reflow Assembly
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Topics: Ball-Grid-Array packaging, Manufacturing, Thermomechanics, Computer simulation, Reflow soldering, Soldering, Thermal conductivity
Journal Articles

Cleaning and Reflow of Pb-Sn C4 Solder Bumps

Caroline S. Lee, Doug C. Crafts, T. W. Eagar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 281–287.
https://doi.org/10.1115/1.2792106
Published Online: December 1, 1995
View Article titled, Cleaning and Reflow of Pb-Sn C4 Solder Bumps
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Topics: Solders, Tin, Etching, Corrosion, Diffusion (Physics), Electroplating, Metallurgy, Reflow soldering, Sulfur, Water
Journal Articles

Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection

Y. S. Son, T. L. Bergman, M. T. Hyun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 317–322.
https://doi.org/10.1115/1.2792111
Published Online: December 1, 1995
View Article titled, Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection
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Topics: Heat transfer, Nitrogen, Ovens, Reflow soldering, Simulation, Buoyancy, Computer simulation, Cooling, Fluctuations (Physics), Heating
Journal Articles

Study of Print Release Process in Solder Paste Printing

C. Sahay, L. M. Head, R. Shereen, P. Dujari, J. H. Constable, G. Westby
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 230–234.
https://doi.org/10.1115/1.2792097
Published Online: September 1, 1995
View Article titled, Study of Print Release Process in Solder Paste Printing
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Topics: Printing, Solders, Shear strength, Boundary layers, Density, Dimensions, Reflow soldering, Separation (Technology), Shear (Mechanics), Surface mount technology