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Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011003.
Paper No: EP-20-1083
https://doi.org/10.1115/1.4050696
Published Online: August 6, 2021
View Article titled, Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011001.
Paper No: EP-19-1028
https://doi.org/10.1115/1.4043704
Published Online: August 1, 2019
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development
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Topics: Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011002.
Paper No: EP-19-1029
https://doi.org/10.1115/1.4044218
Published Online: August 1, 2019
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model
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Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints
Journal Articles

Impact of Self-Assembly Process Errors on Thermoelectric Performance

Nathan B. Crane, Patrick McKnight
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031001.
https://doi.org/10.1115/1.4006709
Published Online: July 18, 2012
View Article titled, Impact of Self-Assembly Process Errors on Thermoelectric Performance
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Topics: Errors, Manufacturing, Self-assembly, Thermal conductivity, Probability, Redundancy (Engineering), Simulation, Temperature, Junctions, Heat
Journal Articles

The Strength of the Silicon Die in Flip-Chip Assemblies

B. Cotterell, Z. Chen, J.-B. Han, N.-X. Tan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 114–119.
https://doi.org/10.1115/1.1535934
Published Online: March 14, 2003
View Article titled, The Strength of the Silicon Die in Flip-Chip Assemblies
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Topics: Fracture (Materials), Fracture (Process), Probability, Reliability, Silicon, Stress, Grinding, Flip-chip assemblies
Journal Articles

Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 281–291.
https://doi.org/10.1115/1.1486470
Published Online: July 26, 2002
View Article titled, Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests
Open the PDF for Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests in another window
Topics: Failure, Failure mechanisms, Lasers, Life testing, Probability, Reliability, Stress, Temperature, Design, Microelectronic devices
Journal Articles

J-Lead Solder Joint Thermal Fatigue Life Model

T. E. Wong, L. A. Kachatorian, H. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 186–190.
https://doi.org/10.1115/1.2792682
Published Online: September 1, 1999
View Article titled, J-Lead Solder Joint Thermal Fatigue Life Model
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Topics: Fatigue life, Solder joints, Cycles, Finite element analysis, NASA, Damage, Failure, Fracture (Materials), Probability, Computers
Journal Articles

Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package

B. Nagaraj, M. Mahalingam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 290–295.
https://doi.org/10.1115/1.2792635
Published Online: September 1, 1998
View Article titled, Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package
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Topics: Reliability, Temperature, Solders, Cycles, Finite element methods, Simulation, Creep, Failure, Simulation results, Ball-Grid-Array packaging
Journal Articles

Applied Probability for Engineers and Scientists

Ephraim Suhir, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1997, 119(3): 213–214.
https://doi.org/10.1115/1.2792237
Published Online: September 1, 1997
View Article titled, Applied Probability for Engineers and Scientists
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Topics: Engineers, Probability
Journal Articles

Translation of Stress States Into Reliability Terms for Single Chip Ceramic Packages

Boris Mirman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 258–264.
https://doi.org/10.1115/1.2905696
Published Online: December 1, 1994
View Article titled, Translation of Stress States Into Reliability Terms for Single Chip Ceramic Packages
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Topics: Ceramics, Reliability, Stress, Failure, Probability
Journal Articles

Modeling Complex Inelastic Deformation Processes in IC Packages’ Solder Joints

E. P. Busso, M. Kitano, T. Kumazawa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 6–15.
https://doi.org/10.1115/1.2905496
Published Online: March 1, 1994
View Article titled, Modeling Complex Inelastic Deformation Processes in IC Packages’ Solder Joints
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Topics: Deformation, Modeling, Solder joints, Cycles, Fatigue life, Stress, Temperature, Constitutive equations, Failure, Finite element analysis
Journal Articles

Stress and Tolerance Analysis for Zero Insertion Force (ZIF) Connector

P. A. Engel, S. E. Nemier, M. D. Toda
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 9–15.
https://doi.org/10.1115/1.3226513
Published Online: March 1, 1989
View Article titled, Stress and Tolerance Analysis for Zero Insertion Force (ZIF) Connector
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Topics: Circuits, Deformation, Design, Finite element analysis, Friction, Plasticity, Probability, Springs, Stress, Stress analysis (Engineering)