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Journal Articles

Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module

Accepted Manuscript
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, Kenneth Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1093
DOI: https://doi.org/10.1115/1.4062384
Published Online: April 21, 2023
View Article titled, Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module
Click here to open pdf in another window PDF for Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module
Topics: Copper, Heat sinks, Manifolds, Microchannels, Bonding, Computer simulation, Heat, Lasers, Power density, Pressure drop
Journal Articles

Modular Heat Sinks for Enhanced Thermal Management of Electronics

Muhammad Jahidul Hoque, Alperen Günay, Andrew Stillwell, Yashraj Gurumukhi, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020903.
Paper No: EP-20-1081
DOI: https://doi.org/10.1115/1.4049294
Published Online: February 22, 2021
View Article titled, Modular Heat Sinks for Enhanced Thermal Management of Electronics
Click here to open pdf in another window PDF for Modular Heat Sinks for Enhanced Thermal Management of Electronics
Topics: Electronics, Gallium nitride, Heat sinks, Thermal management, Power density, Design, Temperature, Power converters, Manufacturing
Journal Articles

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Yi Yang, Tao Long, Songlin Zhuang, Lai Wang, Yi Luo
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031101.
Paper No: EP-19-1109
DOI: https://doi.org/10.1115/1.4046763
Published Online: April 17, 2020
View Article titled, High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting
Click here to open pdf in another window PDF for High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting
Topics: Coating processes, Coatings, Composite materials, Crystals, Density, Particulate matter, Phosphors, Power density, Lasers, Aluminum
Journal Articles

Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics

R. A. Wirtz, K. Swanson, M. Yaquinto
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011002.
DOI: https://doi.org/10.1115/1.4005915
Published Online: March 19, 2012
View Article titled, Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics
Click here to open pdf in another window PDF for Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics
Topics: Electronics, Heat, Phase transitions, Power density, Skin, Temperature, Thermal energy storage, Transients (Dynamics), Thermal management, Cooling
Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
DOI: https://doi.org/10.1115/1.2912209
Published Online: May 9, 2008
View Article titled, On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials
Click here to open pdf in another window PDF for On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials
Topics: Damage, Epoxy resins, Failure mechanisms, Flip-chip, Flip-chip devices, Reliability, Solder joints, Solders, Viscoelasticity, Waves
Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021008.
DOI: https://doi.org/10.1115/1.2912188
Published Online: May 9, 2008
View Article titled, On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion
Click here to open pdf in another window PDF for On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion
Topics: Damage, Failure, Failure mechanisms, Flip-chip devices, High cycle fatigue, Power density, Solders, Stress, Thermal expansion, Wave motion
Journal Articles

Investigation of a Heat Pipe Array for Convective Cooling

A. H. Howard, G. P. Peterson
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 208–214.
DOI: https://doi.org/10.1115/1.2792093
Published Online: September 1, 1995
View Article titled, Investigation of a Heat Pipe Array for Convective Cooling
Click here to open pdf in another window PDF for Investigation of a Heat Pipe Array for Convective Cooling
Topics: Cooling, Heat pipes, Heat, Copper, Electrical measurement, Fins, Flow (Dynamics), Pressure drop, Thermal resistance, Water
Journal Articles

Optimization of Extruded Type External Heat Sink for Multichip Module

A. Mertol
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. December 1993, 115(4): 440–444.
DOI: https://doi.org/10.1115/1.2909354
Published Online: December 1, 1993
View Article titled, Optimization of Extruded Type External Heat Sink for Multichip Module
Click here to open pdf in another window PDF for Optimization of Extruded Type External Heat Sink for Multichip Module
Topics: Heat sinks, Multi-chip modules, Optimization, Junctions, Dimensions, Temperature, Air flow, Design, Finite element analysis, Finite element model
Journal Articles

Heat Pipes for Cooling High Flux/High Power Semiconductor Chips

M. T. North, C. T. Avedisian
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 112–117.
DOI: https://doi.org/10.1115/1.2909290
Published Online: March 1, 1993
View Article titled, Heat Pipes for Cooling High Flux/High Power Semiconductor Chips
Click here to open pdf in another window PDF for Heat Pipes for Cooling High Flux/High Power Semiconductor Chips
Topics: Cooling, Heat pipes, Power semiconductor devices, Heat, Condensers (steam plant), Flux (Metallurgy), Temperature, Water, Copper powders, Design
Journal Articles

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

D. A. Bittle, J. C. Suhling, R. E. Beaty, R. C. Jaeger, R. W. Johnson
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 203–215.
DOI: https://doi.org/10.1115/1.2905397
Published Online: September 1, 1991
View Article titled, Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages
Click here to open pdf in another window PDF for Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages
Topics: Electronic packages, Sensors, Stress, Structural analysis, Semiconductor wafers, Crystals, Design, Diamonds, Heat conduction, Integrated circuits