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Journal Articles

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

Mahdi Farahikia, Ping-Chuan Wang, Louis Reyes, Matthew Krumholtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034501.
Paper No: EP-23-1066
https://doi.org/10.1115/1.4064523
Published Online: February 7, 2024
View Article titled, A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots
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Topics: Coolants, Fins, Numerical analysis, Plates (structures), Pumps, Temperature, Temperature distribution, Thermal management, Thermal resistance, Flow (Dynamics)
Journal Articles

Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling

Jimil M. Shah, Thomas Crandall, Phillip E. Tuma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041101.
Paper No: EP-22-1089
https://doi.org/10.1115/1.4062403
Published Online: May 15, 2023
View Article titled, Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
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Topics: Boilers, Boiling, Bose-Einstein condensates, Cooling, Fluids, Junctions, Slug flows, Temperature, Thermal resistance, Vehicles
Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021001.
Paper No: EP-22-1003
https://doi.org/10.1115/1.4054972
Published Online: August 8, 2022
View Article titled, Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
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Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)
Journal Articles

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020904.
Paper No: EP-20-1119
https://doi.org/10.1115/1.4049928
Published Online: March 5, 2021
View Article titled, Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
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Topics: Boiling, Coolants, Cooling, Data centers, Density, Flow (Dynamics), Fluids, Heat flux, Heat transfer coefficients, Plates (structures)
Journal Articles

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Rajesh Kasukurthy, Amruthavalli Rachakonda, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031001.
Paper No: EP-20-1016
https://doi.org/10.1115/1.4049018
Published Online: January 19, 2021
View Article titled, Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
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Topics: Computational fluid dynamics, Coolants, Cooling, Flow (Dynamics), Flow control, Matlab, Optimization, Plates (structures), Temperature, Testing
Journal Articles

Liquid Cooling of Compute System

Jessica Gullbrand, Mark J. Luckeroth, Mark E. Sprenger, Casey Winkel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010802.
Paper No: EP-18-1054
https://doi.org/10.1115/1.4042802
Published Online: March 1, 2019
View Article titled, Liquid Cooling of Compute System
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Topics: Cooling, Design, Fluids, Plates (structures), Flow (Dynamics), Manifolds, Temperature
Journal Articles

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010906.
Paper No: EP-15-1094
https://doi.org/10.1115/1.4032493
Published Online: March 10, 2016
View Article titled, Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability
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Topics: Gaskets, Geometry, Heat, Manifolds, Reliability, Silicon, Stress, Topology, Vehicles, Warping
Journal Articles

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

Rui Zhang, Jian Cai, Qian Wang, Jingwei Li, Yang Hu, Hongda Du, Liangliang Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011012.
Paper No: EP-13-1045
https://doi.org/10.1115/1.4026616
Published Online: February 18, 2014
View Article titled, Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications
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Topics: Electronics, Solders, Thermal resistance, Tin, Plates (structures), Lasers
Journal Articles

Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates

C. Y. Khor, M. Z. Abdullah, M. Abdul Mujeebu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011003.
https://doi.org/10.1115/1.4005914
Published Online: March 19, 2012
View Article titled, Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates
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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Non-Newtonian flow, Plates (structures), Fluids, Simulation, Computational fluid dynamics, Finite volume methods, Pressure drop
Journal Articles

Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

D. Sujan, Dereje E. Woldemichael, M. V. V. Murthy, K. N. Seetharamu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
https://doi.org/10.1115/1.4005294
Published Online: December 21, 2011
View Article titled, Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change
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Topics: Manufacturing, Plates (structures), Shear (Mechanics), Shear stress, Solders, Stress, Temperature, Die cutting, Shearing (Deformation), Copper
Journal Articles

Squeezing Flow of a Power Law Fluid Between Grooved Plates

Drew A. Davidson, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031007.
https://doi.org/10.1115/1.3144158
Published Online: June 23, 2009
View Article titled, Squeezing Flow of a Power Law Fluid Between Grooved Plates
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Topics: Flow (Dynamics), Fluids, Microchannels, Plates (structures), Flat plates
Journal Articles

Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System

Cheng-Wei Tien, Kun-Huang Yu, Wen-Junn Sheu, Chi-Chuan Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024501.
https://doi.org/10.1115/1.3103940
Published Online: March 27, 2009
View Article titled, Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System
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Topics: Heating, Plates (structures), Refrigerants, Stress, Cooling, Vapors, Superheating, Two-phase flow, Pressure drop, Pressure
Journal Articles

Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance

Yen-Shu Chen, Kuo-Hsiang Chien, Yung-Shin Tseng, Yea-Kuang Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011004.
https://doi.org/10.1115/1.3068299
Published Online: February 11, 2009
View Article titled, Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance
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Topics: Approximation, Heat, Heat sinks, Plates (structures), Thermal conductivity, Thermal resistance, Temperature distribution, Heat conduction, Design
Journal Articles

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Yen-Shu Chen, Kuo-Hsiang Chien, Chi-Chuan Wang, Tzu-Chen Hung, Yuh-Ming Ferng, Bau-Shei Pei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 348–355.
https://doi.org/10.1115/1.2753970
Published Online: December 19, 2006
View Article titled, Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber
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Topics: Heat, Heat conduction, Plates (structures), Temperature, Temperature distribution, Thermal resistance, Vapors, Heat transfer, Flat heat pipes, Computer simulation
Journal Articles

A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps

Chyi-Lang Lai, Wen-Bin Young
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 186–194.
https://doi.org/10.1115/1.1649244
Published Online: July 8, 2004
View Article titled, A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps
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Topics: Flow (Dynamics), Flow simulation, Permeability, Plates (structures), Porous materials, Simulation, Solders, Shapes, Cylinders
Journal Articles

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Ning Zheng, R. A. Wirtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 1–7.
https://doi.org/10.1115/1.1646419
Published Online: April 30, 2004
View Article titled, A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology
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Topics: Design, Engineering prototypes, Heat, Heat sinks, Latent heat, Storage, Temperature, Thermal conductivity, Thermal energy storage, Interfacial thermal resistance
Journal Articles

Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages

Hideo Koguchi, Chie Sasaki, Kazuto Nishida
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 414–419.
https://doi.org/10.1115/1.1602705
Published Online: September 17, 2003
View Article titled, Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages
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Topics: Deflection, Temperature, Finite element methods, Plates (structures)
Journal Articles

Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection

Adrian Bejan, Fellow ASME, J. A. Jones Professor of Mechanical Engineering,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 200–207.
https://doi.org/10.1115/1.1566970
Published Online: June 10, 2003
View Article titled, Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection
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Topics: Boundary layers, Cooling, Flow (Dynamics), Forced convection, Heat, Natural convection, Temperature, Fluids, Design, Plates (structures)
Journal Articles

Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending

Yibin Xue, Vivek A. Jairazbhoy, Xiaoting Niu, Jianmin Qu, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 53–58.
https://doi.org/10.1115/1.1527892
Published Online: March 14, 2003
View Article titled, Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending
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Topics: Boundary-value problems, Deflection, Deformation, Finite element analysis, Plates (structures)
Journal Articles

Heat Transfer and Flow Friction Characteristics for Compact Cold Plates

Chang-Yuan Liu, Graduate Student, Ying-Huei Hung, Professor and Chairman, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 104–113.
https://doi.org/10.1115/1.1536170
Published Online: March 14, 2003
View Article titled, Heat Transfer and Flow Friction Characteristics for Compact Cold Plates
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Topics: Flow (Dynamics), Heat transfer, Plates (structures), Temperature, Thermal resistance, Heat flux, Pressure drop, Friction, Heat, Reynolds number