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Journal Articles

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Ali Nematollahisarvestani, Yung-Cheng “Y. C.” Lee
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020802.
Paper No: EP-20-1043
DOI: https://doi.org/10.1115/1.4048011
Published Online: September 3, 2020
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Topics: Buckling, Deformation, Delamination, Failure, Fracture (Materials), Fracture (Process), Patents, Stress, Coatings
Journal Articles

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. December 2020, 142(4): 040801.
Paper No: EP-19-1126
DOI: https://doi.org/10.1115/1.4047472
Published Online: June 29, 2020
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Topics: Architecture, Cooling, Design, Electric vehicles, Electronics, Patents, Hybrid electric vehicles, Traction, Coolants, Metals
Journal Articles

Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]

K. S. Siow, Y. T. Lin
Journal: Journal of Electronic Packaging
Article Type: Errata
J. Electron. Packag. September 2016, 138(3): 037001.
Paper No: EP-16-1057
DOI: https://doi.org/10.1115/1.4033633
Published Online: May 25, 2016
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Topics: Bonding, Electrons, Microelectronic packaging, Packaging, Patents, Silver, Solders
Journal Articles

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

K. S. Siow, Y. T. Lin
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 020804.
Paper No: EP-16-1006
DOI: https://doi.org/10.1115/1.4033069
Published Online: April 21, 2016
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Topics: Patents, Pressure, Sintering, Bonding, Semiconductors (Materials)