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Journal Articles

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Reece Whitt, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041104.
Paper No: EP-24-1025
https://doi.org/10.1115/1.4065944
Published Online: July 25, 2024
View Article titled, Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics
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Topics: Electronics, Flow (Dynamics), Heat transfer, Junctions, Nozzles, Temperature, Temperature control, Testing, Transients (Dynamics), Actuators
Journal Articles

Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning

Calvin Ling, Muhammad Taufik Azahari, Mohamad Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011001.
Paper No: EP-22-1076
https://doi.org/10.1115/1.4065077
Published Online: April 5, 2024
View Article titled, Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
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Topics: Ball-Grid-Array packaging, Computer simulation, Machine learning, Pressure, Solders, Valves, Epoxy adhesives, Epoxy resins, Simulation, Temperature
Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

Reece Whitt, Rafael Estrella, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041103.
Paper No: EP-23-1032
https://doi.org/10.1115/1.4063484
Published Online: October 9, 2023
View Article titled, Converging Jet Impingement for Enhanced Liquid Cooling
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Topics: Additive manufacturing, Cooling, Electronics, Fluids, Heat transfer, Jets, Nozzles, Pressure, Reynolds number, Simulation
Journal Articles

Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets

Prabhakar Subrahmanyam, B. K. Gnanavel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031009.
Paper No: EP-20-1104
https://doi.org/10.1115/1.4049579
Published Online: February 19, 2021
View Article titled, Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets
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Topics: Flow (Dynamics), Heat transfer, Heat transfer coefficients, Jets, Nozzles, Reynolds-averaged Navier–Stokes equations, Silicon, Reynolds number, Turbulence, Temperature
Journal Articles

Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies

Rajiv L. Iyer, Daryl L. Santos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
https://doi.org/10.1115/1.4037144
Published Online: July 14, 2017
View Article titled, Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies
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Topics: Adhesives, Drops, Nozzles, Pistons, Experimental design, Manufacturing, Experimental analysis, Fluids
Journal Articles

Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031015.
Paper No: EP-15-1041
https://doi.org/10.1115/1.4030953
Published Online: September 1, 2015
View Article titled, Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements
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Topics: Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Nozzles, Reynolds number, Jets, Temperature, Heat flux
Journal Articles

Confined, Milliscale Unsteady Laminar Impinging Slot Jets: Effects of Slot Width on Surface Stagnation Point Nusselt Numbers

Dae Hee Lee, Jong Ryeol Bae, Mira Ryu, Phil Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041004.
https://doi.org/10.1115/1.4007317
Published Online: September 4, 2012
View Article titled, Confined, Milliscale Unsteady Laminar Impinging Slot Jets: Effects of Slot Width on Surface Stagnation Point Nusselt Numbers
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Topics: Jets, Nozzles, Reynolds number, Flow (Dynamics)
Journal Articles

A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing

Matthew Sweetland, John H. Lienhard, V, Alexander H. Slocum
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031012.
https://doi.org/10.1115/1.2966437
Published Online: August 12, 2008
View Article titled, A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing
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Topics: Convection, Cooling, Lasers, Nozzles, Radiation (Physics), Temperature, Temperature control, Testing, Manifolds, Pressure
Journal Articles

A Systematic Approach to Predicting Critical Heat Flux for Inclined Sprays

Milan Visaria, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 452–459.
https://doi.org/10.1115/1.2804095
Published Online: March 26, 2007
View Article titled, A Systematic Approach to Predicting Critical Heat Flux for Inclined Sprays
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Topics: Critical heat flux, Nozzles, Sprays, Flow (Dynamics)
Journal Articles

Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

Y. C. Lee, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
https://doi.org/10.1115/1.2804089
Published Online: January 25, 2007
View Article titled, Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
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Topics: Design, Disks, Heat transfer, Multi-chip modules, Nozzles, Optimization, Reynolds number, Sensitivity analysis
Journal Articles

Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement

C. J. Fang, M. C. Wu, Y. M. Kuo, C. Y. Lee, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 400–410.
https://doi.org/10.1115/1.2804087
Published Online: December 28, 2006
View Article titled, Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement
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Topics: Disks, Heat transfer, Nozzles, Reynolds number, Transients (Dynamics), Turbulence, Heat flux, Steady state, Jets, Rotation
Journal Articles

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

D. H. Lee, Y. S. Chung, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 221–228.
https://doi.org/10.1115/1.2753884
Published Online: October 30, 2006
View Article titled, Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
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Topics: Flow (Dynamics), Flow separation, Flow visualization, Jets, Nozzles, Pressure, Fins, Temperature, Impingement cooling, Reynolds number
Journal Articles

Singulation of Electronic Packages With Abrasive Waterjets

Mohamed Hashish
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2006, 128(4): 479–483.
https://doi.org/10.1115/1.2353328
Published Online: February 9, 2006
View Article titled, Singulation of Electronic Packages With Abrasive Waterjets
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Topics: Cutting, Strips, Nozzles, Machinery, Flow (Dynamics)
Journal Articles

An Experimental Study of the Enhancement of Air-Cooling Limits for Telecom/Datacom Heat Sink Applications Using an Impinging Air Jet

Eric Sansoucy, Patrick H. Oosthuizen, Gamal Refai-Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 166–171.
https://doi.org/10.1115/1.2164848
Published Online: August 24, 2005
View Article titled, An Experimental Study of the Enhancement of Air-Cooling Limits for Telecom/Datacom Heat Sink Applications Using an Impinging Air Jet
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Topics: Heat sinks, Heat transfer, Air jets, Flow (Dynamics), Cooling, Flat plates, Nozzles, Temperature, Computer simulation
Journal Articles

Cooling Performance of Using a Confined Slot Jet Impinging onto Heated Heat Sinks

Ta-Wei Lin, Ming-Chang Wu, Li-Kang Liu, Chun-Jen Fang, Ying-Huei Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 82–91.
https://doi.org/10.1115/1.2161426
Published Online: June 4, 2005
View Article titled, Cooling Performance of Using a Confined Slot Jet Impinging onto Heated Heat Sinks
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Topics: Cooling, Heat sinks, Heat transfer, Reynolds number, Steady state, Transients (Dynamics), Nozzles, Composite materials, Temperature distribution
Journal Articles

Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins

Y. S. Chung, D. H. Lee, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 106–112.
https://doi.org/10.1115/1.1849235
Published Online: June 3, 2005
View Article titled, Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins
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Topics: Flat plates, Flow (Dynamics), Flow visualization, Nozzles, Pressure, Liquid crystals, Temperature distribution, Fins, Jets, Testing
Journal Articles

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Siddharth Bhopte, Musa S. Alshuqairi, Dereje Agonafer, Fellow ASME, Gamal Refai-Ahmed, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 519–523.
https://doi.org/10.1115/1.1827267
Published Online: January 24, 2005
View Article titled, Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application
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Topics: Heat sinks, Mixed convection, Reynolds number, Nozzles, Cooling, Computer simulation, Heat, Flow (Dynamics), Rayleigh number
Journal Articles

Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array

Wataru Nakayama, Masud Behnia, Hiroaki Mishima
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 132–137.
https://doi.org/10.1115/1.483145
Published Online: February 18, 2000
View Article titled, Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array
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Topics: Boiling, Coolants, Critical heat flux, Flow (Dynamics), Forced convection, Heat transfer, Strips, Subcooling, Temperature, Nozzles
Journal Articles

Flow-Field Prediction in Submerged and Confined Jet Impingement Using the Reynolds Stress Model

G. K. Morris, S. V. Garimella, J. A. Fitzgerald
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 255–262.
https://doi.org/10.1115/1.2793849
Published Online: December 1, 1999
View Article titled, Flow-Field Prediction in Submerged and Confined Jet Impingement Using the Reynolds Stress Model
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Topics: Flow (Dynamics), Stress, Nozzles, Reynolds number, Confined flow, Errors, Flow visualization, Outflow, Renormalization (Physics)
Journal Articles

Heat Transfer From a Finned Surface in Ducted Air Jet Suction and Impingement

Luis A. Brignoni, Suresh V. Garimella, Mem ASME, Associate Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2000, 122(3): 282–285.
https://doi.org/10.1115/1.1286106
Published Online: December 1, 1999
View Article titled, Heat Transfer From a Finned Surface in Ducted Air Jet Suction and Impingement
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Topics: Air jets, Heat sinks, Heat transfer, Nozzles, Suction, Thermal resistance, Flow (Dynamics), Heat transfer coefficients, Reynolds number