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Journal Articles

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2023, 145(2): 021008.

Paper No: EP-22-1046

DOI: https://doi.org/10.1115/1.4055468

Published Online: September 28, 2022

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Topics: Flow (Dynamics), Manifolds, Microchannels, Silicon, Pressure, Temperature, Intake manifolds, Pressure drop

Journal Articles

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Zhigang Gao, Tianhu Wang, Yuxin Yang, Xiaolong Shang, Junhua Bai, Peng Li

J. Electron. Packag. December 2022, 144(4): 041014.

Paper No: EP-21-1134

DOI: https://doi.org/10.1115/1.4053433

Published Online: February 7, 2022

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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Methane, Microchannels, Pressure, Electromechanical actuators

Journal Articles

Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel

D. Sathish Kumar, S. Jayavel

J. Electron. Packag. December 2022, 144(4): 041007.

Paper No: EP-21-1084

DOI: https://doi.org/10.1115/1.4052537

Published Online: November 22, 2021

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Topics: Bifurcation, Flow (Dynamics), Heat transfer, Microchannels, Fluids, Entropy, Pressure drop

Journal Articles

The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling

Ankur Miglani, Anali Soto, Justin A. Weibel, Suresh V. Garimella

J. Electron. Packag. December 2021, 143(4): 041107.

Paper No: EP-21-1114

DOI: https://doi.org/10.1115/1.4052532

Published Online: October 14, 2021

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Topics: Flow (Dynamics), Heating, Microchannels, Boiling

Journal Articles

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Qi Jin, John T. Wen, Shankar Narayanan

J. Electron. Packag. December 2021, 143(4): 041102.

Paper No: EP-21-1081

DOI: https://doi.org/10.1115/1.4051942

Published Online: August 20, 2021

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Topics: Compressors, Design, Flow (Dynamics), Heat, Oscillations, Pressure drop, Secondary cells, Stability, Stress, Valves

Journal Articles

A Review on Transient Thermal Management of Electronic Devices

John Mathew, Shankar Krishnan

J. Electron. Packag. March 2022, 144(1): 010801.

Paper No: EP-20-1113

DOI: https://doi.org/10.1115/1.4050002

Published Online: August 6, 2021

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Topics: Cooling, Heat, Heat pipes, Phase change materials, Temperature, Thermal management, Transients (Dynamics), Vapors, Boiling, Steady state

Journal Articles

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia

J. Electron. Packag. June 2021, 143(2): 020904.

Paper No: EP-20-1119

DOI: https://doi.org/10.1115/1.4049928

Published Online: March 5, 2021

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Topics: Boiling, Coolants, Cooling, Data centers, Density, Flow (Dynamics), Fluids, Heat flux, Heat transfer coefficients, Plates (structures)

Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi

J. Electron. Packag. September 2021, 143(3): 031006.

Paper No: EP-19-1118

DOI: https://doi.org/10.1115/1.4049564

Published Online: February 19, 2021

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Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)

Journal Articles

Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks

Yaser Hadad, Vahideh Radmard, Srikanth Rangarajan, Mahdi Farahikia, Gamal Refai-Ahmed, Paul R. Chiarot, Bahgat Sammakia

J. Electron. Packag. June 2021, 143(2): 021007.

Paper No: EP-19-1111

DOI: https://doi.org/10.1115/1.4048590

Published Online: October 30, 2020

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Topics: Design, Electrical resistivity, Flow (Dynamics), Pumps, Temperature, Optimization, Microchannels, Coolants, Pareto optimization, Heat flux

Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031117.

Paper No: EP-20-1030

DOI: https://doi.org/10.1115/1.4047846

Published Online: August 17, 2020

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Topics: Flow (Dynamics), Fluids, Heat, Heat flux, Manifolds, Microchannels, Pressure drop, Temperature, Uncertainty, Cooling

Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031119.

Paper No: EP-20-1022

DOI: https://doi.org/10.1115/1.4047847

Published Online: August 17, 2020

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Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching

Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Michael Degner, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031118.

Paper No: EP-20-1032

DOI: https://doi.org/10.1115/1.4047883

Published Online: August 17, 2020

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Topics: Computational fluid dynamics, Design, Fluids, Manifolds, Microchannels, Pressure drop, Simulation, Coolers

Journal Articles

A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel

Zengchao Chen, Wei Li, Junye Li, Kan Zhou, Zhaozan Feng

J. Electron. Packag. March 2021, 143(1): 014501.

Paper No: EP-19-1083

DOI: https://doi.org/10.1115/1.4046755

Published Online: June 4, 2020

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Topics: Boiling, Flow (Dynamics), Fluids, Heat transfer, Microchannels, Subcooling, Water

Journal Articles

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Hua Zhu, Wei Li, Junye Li, Kuang Sheng, Shuai Shao, Haiwang Li, Zhi Tao

J. Electron. Packag. September 2019, 141(3): 031006.

Paper No: EP-18-1092

DOI: https://doi.org/10.1115/1.4043476

Published Online: May 17, 2019

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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Subcooling, Temperature, Heat flux, Bubbles, Nucleate boiling, Flux (Metallurgy)

Journal Articles

Numerical Study on Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink: Channels Variable Width Versus Variable Height Approach

Ritunesh Kumar, Gurjeet Singh, Dariusz Mikielewicz

J. Electron. Packag. June 2019, 141(2): 021009.

Paper No: EP-18-1111

DOI: https://doi.org/10.1115/1.4043158

Published Online: April 10, 2019

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Topics: Flow (Dynamics), Heat sinks, Microchannels, Temperature, Design, Heat transfer, Fluids

Journal Articles

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi

J. Electron. Packag. September 2018, 140(3): 031003.

Paper No: EP-17-1081

DOI: https://doi.org/10.1115/1.4039264

Published Online: May 11, 2018

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Topics: Coolers, Cooling, Electronics, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Manifolds, Microchannels

Journal Articles

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Houxue Huang, Nicolas Lamaison, John R. Thome

J. Electron. Packag. March 2017, 139(1): 011005.

Paper No: EP-16-1083

DOI: https://doi.org/10.1115/1.4035386

Published Online: January 5, 2017

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Topics: Boiling, Flow (Dynamics), Fluids, Heat conduction, Heat flux, Heat transfer, Heat transfer coefficients, Microchannels, Pressure drop, Temperature

Journal Articles

Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling

Gunjan Agarwal, Thomas Kazior, Thomas Kenny, Dana Weinstein

J. Electron. Packag. March 2017, 139(1): 011001.

Paper No: EP-16-1073

DOI: https://doi.org/10.1115/1.4035064

Published Online: November 10, 2016

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Topics: Cooling, Flow (Dynamics), Fluids, Gallium nitride, Microchannels, Microfluidics, Silicon, Temperature, Heat, Geometry

Journal Articles

Double-Layer Microchannel Heat Sinks With Transverse-Flow Configurations

Danish Ansari, Kwang-Yong Kim

J. Electron. Packag. September 2016, 138(3): 031005.

Paper No: EP-16-1041

DOI: https://doi.org/10.1115/1.4033558

Published Online: May 19, 2016

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Topics: Flow (Dynamics), Heat sinks, Microchannels, Temperature, Thermal resistance, Design, Fluids

Journal Articles

Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization

Houxue Huang, Navid Borhani, John Richard Thome

J. Electron. Packag. September 2016, 138(3): 031004.

Paper No: EP-16-1037

DOI: https://doi.org/10.1115/1.4033487

Published Online: May 17, 2016

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Topics: Boiling, Flow (Dynamics), Fluids, Heat, Heat flux, Microchannels, Stress, Temperature, Transients (Dynamics), Subcooling

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Journal citation

NARROW

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel

The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

A Review on Transient Thermal Management of Electronic Devices

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Numerical Study on Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink: Channels Variable Width Versus Variable Height Approach

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling

Double-Layer Microchannel Heat Sinks With Transverse-Flow Configurations

Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization

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