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Journal Articles

Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams

Varun Prasanna Rajamuthu, Sanskar S. Panse, Srinath Ekkad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031003.
Paper No: EP-20-1090
https://doi.org/10.1115/1.4049173
Published Online: January 19, 2021
View Article titled, Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams
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Topics: Density, Foams (Chemistry), Heat transfer, Porosity, Reynolds number, Metal foams, Copper, Flow (Dynamics), Jets
Journal Articles

A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2021, 143(3): 030801.
Paper No: EP-19-1124
https://doi.org/10.1115/1.4048861
Published Online: January 19, 2021
View Article titled, A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling
Open the PDF for A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling in another window
Topics: Heat sinks, Metal foams, Heat transfer
Journal Articles

Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011006.
Paper No: EP-19-1100
https://doi.org/10.1115/1.4046756
Published Online: June 4, 2020
View Article titled, Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling
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Topics: Heat flux, Heat sinks, Metal foams, Heat transfer, Temperature, Fluids
Journal Articles

Heat Transfer and Pressure Drop Characteristics of Finned Metal Foam Heat Sinks Under Uniform Impinging Flow

S. S. Feng, J. J. Kuang, T. J. Lu, K. Ichimiya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021014.
Paper No: EP-13-1131
https://doi.org/10.1115/1.4029722
Published Online: June 1, 2015
View Article titled, Heat Transfer and Pressure Drop Characteristics of Finned Metal Foam Heat Sinks Under Uniform Impinging Flow
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Metal foams, Pressure drop
Journal Articles

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Derek Gateman, Anthony G. Straatman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
https://doi.org/10.1115/1.4002724
Published Online: November 24, 2010
View Article titled, The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks
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Topics: Contact resistance, Heat sinks, Heat transfer, Metal foams, Fluids, Fins, Aluminum, Convection, Heat conduction, Epoxy adhesives
Journal Articles

An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction

Nihad Dukhan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034501.
https://doi.org/10.1115/1.3143947
Published Online: June 12, 2009
View Article titled, An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction
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Topics: Convection, Flow (Dynamics), Fluids, Heat conduction, Porous materials, Temperature, Graphite, Metal foams, Thermal conductivity
Journal Articles

Modeling Forced Convection in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Anthony G. Straatman, Lee J. Betchen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
https://doi.org/10.1115/1.3103934
Published Online: March 27, 2009
View Article titled, Modeling Forced Convection in Finned Metal Foam Heat Sinks
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Topics: Aluminum, Computational fluid dynamics, Fins, Heat sinks, Heat transfer, Thermal conductivity, Fluids, Flow (Dynamics), Metal foams, Forced convection
Journal Articles

Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks

Sheng-Chung Tzeng, Tzer-Ming Jeng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 113–119.
https://doi.org/10.1115/1.2721081
Published Online: August 11, 2006
View Article titled, Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks
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Topics: Heat transfer coefficients, Metal foams, Porosity, Thermal conductivity, Aluminum, Electrical conductivity, Heat sinks, Heat transfer, Flow (Dynamics), Foams (Chemistry)
Journal Articles

Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

A. Bhattacharya, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
https://doi.org/10.1115/1.2229225
Published Online: September 23, 2005
View Article titled, Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection
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Topics: Aluminum, Buoyancy, Computer cooling, Convection, Heat sinks, Metal foams, Porous materials
Journal Articles

Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?

Shankar Krishnan, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
https://doi.org/10.1115/1.1772411
Published Online: October 6, 2004
View Article titled, Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?
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Topics: Copper, Heat sinks, Junctions, Melting, Phase change materials, Temperature, Thermal conductivity, Transients (Dynamics), Thermal management, Energy storage
Journal Articles

A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks

Tzer-Ming Jeng, Li-Kang Liu, Ying-Huei Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 223–234.
https://doi.org/10.1115/1.1997159
Published Online: May 8, 2004
View Article titled, A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks
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Topics: Aluminum, Fluids, Heat sinks, Heat transfer, Liquid crystals, Metal foams, Porosity, Reynolds number, Steady state, Temperature
Journal Articles

Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

A. Bhattacharya, Research Assistant, R. L. Mahajan, Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 155–163.
https://doi.org/10.1115/1.1464877
Published Online: July 26, 2002
View Article titled, Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection
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Topics: Fins, Flow (Dynamics), Heat sinks, Heat transfer coefficients, Metal foams, Forced convection, Heat transfer