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Journal Articles

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041109.
Paper No: EP-21-1087
DOI: https://doi.org/10.1115/1.4052814
Published Online: November 5, 2021
View Article titled, Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging
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Topics: Algorithms, Artificial neural networks, Bridges (Structures), Cooling, Heat sinks, Junctions, Machine learning, Machinery, Simulation, Steady state
Includes: Supplementary data
Journal Articles

Singulation of Electronic Packages With Abrasive Waterjets

Mohamed Hashish
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. December 2006, 128(4): 479–483.
DOI: https://doi.org/10.1115/1.2353328
Published Online: February 9, 2006
View Article titled, Singulation of Electronic Packages With Abrasive Waterjets
Click here to open pdf in another window PDF for Singulation of Electronic Packages With Abrasive Waterjets
Topics: Cutting, Strips, Nozzles, Machinery, Flow (Dynamics)
Journal Articles

Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers

W. W. King, C. J. Aloisio, Jr.
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 133–137.
DOI: https://doi.org/10.1115/1.2792219
Published Online: June 1, 1997
View Article titled, Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers
Click here to open pdf in another window PDF for Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers
Topics: Coatings, Delamination, Optical fiber, Polymers, Thermomechanics, Tension, Fibers, Compressive stress, Composite materials, Hydrostatics
Journal Articles

Fine Pitch Stencil Printing Process Modeling and Optimization

Y. Li, R. L. Mahajan, N. Nikmanesh
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 1996, 118(1): 1–6.
DOI: https://doi.org/10.1115/1.2792121
Published Online: March 1, 1996
View Article titled, Fine Pitch Stencil Printing Process Modeling and Optimization
Click here to open pdf in another window PDF for Fine Pitch Stencil Printing Process Modeling and Optimization
Topics: Modeling, Optimization, Printing, Solders, Design, Neural network models, Algorithms, Assembly lines, Engineering simulation, Machinery
Journal Articles

A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

Yu-Wen Huang, K. Srihari, Jim Adriance, George Westby
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 282–289.
DOI: https://doi.org/10.1115/1.2905699
Published Online: December 1, 1994
View Article titled, A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem
Click here to open pdf in another window PDF for A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem
Topics: Surface mount packaging, Engineering prototypes, Lumber, Machinery, Manufacturing, Nozzles, Printed circuit boards, Surface mount components, Tooling
Journal Articles

Planning of Component Placement/Insertion Sequence and Feeder Setup in PCB Assembly Using Genetic Algorithm

M. C. Leu, H. Wong, Z. Ji
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 424–432.
DOI: https://doi.org/10.1115/1.2909352
Published Online: December 1, 1993
View Article titled, Planning of Component Placement/Insertion Sequence and Feeder Setup in PCB Assembly Using Genetic Algorithm
Click here to open pdf in another window PDF for Planning of Component Placement/Insertion Sequence and Feeder Setup in PCB Assembly Using Genetic Algorithm
Topics: Genetic algorithms, Printed circuit board assemblies, Algorithms, Manufacturing, Machinery
Journal Articles

Drill Wear Monitoring in Circuit Board Manufacturing: An Experimental Study

Ciro N. Ramirez, R. Joe Thornhill
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 1992, 114(3): 360–364.
DOI: https://doi.org/10.1115/1.2905465
Published Online: September 1, 1992
View Article titled, Drill Wear Monitoring in Circuit Board Manufacturing: An Experimental Study
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Topics: Drills (Tools), Manufacturing, Printed circuit boards, Wear, Drilling, Machinery, Sensors, Torque, Vibration
Journal Articles

Automated Measurement of Flank Wear of Circuit Board Drills

Ciro N. Ramirez, P.E., R. Joe Thornhill, P.E.
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. March 1992, 114(1): 93–96.
DOI: https://doi.org/10.1115/1.2905448
Published Online: March 1, 1992
View Article titled, Automated Measurement of Flank Wear of Circuit Board Drills
Click here to open pdf in another window PDF for Automated Measurement of Flank Wear of Circuit Board Drills
Topics: Drills (Tools), Printed circuit boards, Wear, Drilling, Machinery
Journal Articles

Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints

D. T. Read, G. K. Lucey, Jr.
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 178–185.
DOI: https://doi.org/10.1115/1.2905384
Published Online: June 1, 1991
View Article titled, Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints
Click here to open pdf in another window PDF for Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints
Topics: Finite element analysis, Mesh generation, Solder joints, Surface mount technology, X-rays, Computer software, Failure, Inspection, Machinery, Modeling