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Journal Articles

Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation

Zuraihana Bachok, Mohamad Aizat Abas, Muhammad Zaim Hanif Nazarudin, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani

J. Electron. Packag. December 2022, 144(4): 041018.

Paper No: EP-21-1157

DOI: https://doi.org/10.1115/1.4054132

Published Online: April 22, 2022

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Topics: Lasers, Soldering, Solders

Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. December 2022, 144(4): 041012.

Paper No: EP-21-1136

DOI: https://doi.org/10.1115/1.4053365

Published Online: January 28, 2022

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Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries

Journal Articles

Influence of Laser Soldering Temperatures on Through-Hole Component

Saifulmajdy A. Zahiri, Aizat Abas, M. F. M. Sharif, Fakhrozi Che Ani

J. Electron. Packag. December 2022, 144(4): 041006.

Paper No: EP-21-1075

DOI: https://doi.org/10.1115/1.4052175

Published Online: November 22, 2021

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Topics: Flow (Dynamics), Lasers, Soldering, Solders, Temperature, Lead-free solders, Finite volume methods, Pressure

Journal Articles

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Vishnu V. B. Reddy, Saurabh Gupta, Jaimal Williamson, Suresh K. Sitaraman

J. Electron. Packag. March 2022, 144(1): 011009.

Paper No: EP-20-1126

DOI: https://doi.org/10.1115/1.4050898

Published Online: August 6, 2021

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Topics: Cycles, Damage, Finite element analysis, Inspection, Lasers, Modeling, Natural language interfaces, Solders, Accelerated life testing, Density

Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031119.

Paper No: EP-20-1022

DOI: https://doi.org/10.1115/1.4047847

Published Online: August 17, 2020

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Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching

Journal Articles

Design of Diffractive Optical Elements by Direct and Indirect Construction of Diffraction Pattern: A Comparative Study

Hui Xiong, Liaoxin Sun

J. Electron. Packag. December 2020, 142(4): 041101.

Paper No: EP-19-1128

DOI: https://doi.org/10.1115/1.4047190

Published Online: June 4, 2020

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Topics: Design, Diffraction, Diffraction patterns, Optical elements, Lasers, Construction

Journal Articles

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Yi Yang, Tao Long, Songlin Zhuang, Lai Wang, Yi Luo

J. Electron. Packag. September 2020, 142(3): 031101.

Paper No: EP-19-1109

DOI: https://doi.org/10.1115/1.4046763

Published Online: April 17, 2020

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Topics: Coating processes, Coatings, Composite materials, Crystals, Density, Particulate matter, Phosphors, Power density, Lasers, Aluminum

Journal Articles

Packaging for Laser-Based White Lighting: Status and Perspectives

Yupu Ma, Xiaobing Luo

J. Electron. Packag. March 2020, 142(1): 010801.

Paper No: EP-18-1105

DOI: https://doi.org/10.1115/1.4044359

Published Online: September 19, 2019

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Topics: Lasers, Packaging, Phosphors, Quenching (Metalworking), Temperature, Laser beams, Brightness (Photometry)

Journal Articles

Challenges in Three-Dimensional Printing of High-Conductivity Copper

Tahany I. El-Wardany, Ying She, Vijay N. Jagdale, Jacquelynn K. Garofano, Joe J. Liou, Wayde R. Schmidt

J. Electron. Packag. June 2018, 140(2): 020907.

Paper No: EP-17-1104

DOI: https://doi.org/10.1115/1.4039974

Published Online: May 9, 2018

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Topics: Copper, Copper powders, Lasers, Porosity, Electrical conductivity, Additive manufacturing, Density, Modeling, Thermal conductivity

Journal Articles

A Review on Laser Processing in Electronic and MEMS Packaging

Kaysar Rahim, Ahsan Mian

J. Electron. Packag. September 2017, 139(3): 030801.

Paper No: EP-16-1146

DOI: https://doi.org/10.1115/1.4036239

Published Online: June 14, 2017

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Topics: Lasers, Packaging

Journal Articles

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Dongliang Zhao, Xin Qian, Xiaokun Gu, Saad Ayub Jajja, Ronggui Yang

J. Electron. Packag. December 2016, 138(4): 040802.

Paper No: EP-16-1067

DOI: https://doi.org/10.1115/1.4034605

Published Online: October 6, 2016

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Topics: Temperature, Thermal conductivity, Thin films, Transients (Dynamics), Heat, Steady state, Sensors, Bulk solids, Thermoreflectance, Lasers

Journal Articles

Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis

Yanyi Xiao, Wen Wang, Jianhua Zhang

J. Electron. Packag. June 2016, 138(2): 021006.

Paper No: EP-15-1051

DOI: https://doi.org/10.1115/1.4033106

Published Online: April 15, 2016

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Topics: Bonding, Glass, Lasers, Temperature, Temperature distribution, Fittings, Sealing (Process)

Journal Articles

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume

J. Electron. Packag. September 2014, 136(3): 031007.

Paper No: EP-13-1074

DOI: https://doi.org/10.1115/1.4027425

Published Online: May 12, 2014

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Topics: Diffraction gratings, Lasers, Resolution (Optics), Warping, Printed circuit boards, Accuracy and precision

Journal Articles

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

Rui Zhang, Jian Cai, Qian Wang, Jingwei Li, Yang Hu, Hongda Du, Liangliang Li

J. Electron. Packag. March 2014, 136(1): 011012.

Paper No: EP-13-1045

DOI: https://doi.org/10.1115/1.4026616

Published Online: February 18, 2014

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Topics: Electronics, Solders, Thermal resistance, Tin, Plates (structures), Lasers

Journal Articles

Investigation on Laser Direct Welding of Quad Flat Pack Components

Jianwen Yuan, Chao Huang, Jimin Chen, Furong Liu, Yi Qiu

J. Electron. Packag. December 2013, 135(4): 044501.

Paper No: EP-13-1024

DOI: https://doi.org/10.1115/1.4025251

Published Online: September 6, 2013

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Topics: Lasers, Temperature, Tensile strength, Welding, Solders, Laser welding, Tin

Journal Articles

Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

Yi Yan, Youliang Guan, Xu Chen, Guo-Quan Lu

J. Electron. Packag. December 2013, 135(4): 041003.

Paper No: EP-13-1030

DOI: https://doi.org/10.1115/1.4025247

Published Online: September 4, 2013

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Topics: High power lasers, Lasers, Silver, Thermal stresses, Finite element analysis, Temperature, Wavelength, Currents, Simulation, Manufacturing

Journal Articles

Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste

Yi Yan, Xu Chen, Xingsheng Liu, Yunhui Mei, Guo-Quan Lu

J. Electron. Packag. December 2012, 134(4): 041003.

DOI: https://doi.org/10.1115/1.4007271

Published Online: August 29, 2012

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Topics: Lasers, Bonding

Journal Articles

Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment

Sushma Madduri, Bahgat G. Sammakia, William Infantolino, Satish C. Chaparala, Lawrence C. Hughes, J. Micheal Harris

J. Electron. Packag. March 2012, 134(1): 011008.

DOI: https://doi.org/10.1115/1.4005910

Published Online: March 19, 2012

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Topics: Condensation, Lasers, Temperature, Cycles

Journal Articles

Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model

Wei Han, Marc Rensing, Peter O’Brien, Frank H. Peters

J. Electron. Packag. December 2011, 133(4): 044502.

DOI: https://doi.org/10.1115/1.4005292

Published Online: December 9, 2011

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Topics: Lasers, Manufacturing, Microwaves, Optimization, Packaging, Reflection, Resonance, Strip transmission lines, Simulation results, Simulation

Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee

J. Electron. Packag. September 2011, 133(3): 031010.

DOI: https://doi.org/10.1115/1.4004861

Published Online: September 26, 2011

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Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat

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Journal citation

NARROW

Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Influence of Laser Soldering Temperatures on Through-Hole Component

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Design of Diffractive Optical Elements by Direct and Indirect Construction of Diffraction Pattern: A Comparative Study

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Packaging for Laser-Based White Lighting: Status and Perspectives

Challenges in Three-Dimensional Printing of High-Conductivity Copper

A Review on Laser Processing in Electronic and MEMS Packaging

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Accurate Predetermination of the Process Parameters for Glass/Glass Laser Bonding Based on the Temperature Distribution Analysis

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

Investigation on Laser Direct Welding of Quad Flat Pack Components

Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste

Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment

Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

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