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Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

Reece Whitt, Rafael Estrella, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041103.
Paper No: EP-23-1032
https://doi.org/10.1115/1.4063484
Published Online: October 9, 2023
View Article titled, Converging Jet Impingement for Enhanced Liquid Cooling
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Topics: Additive manufacturing, Cooling, Electronics, Fluids, Heat transfer, Jets, Nozzles, Pressure, Reynolds number, Simulation
Journal Articles

Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets

Prabhakar Subrahmanyam, B. K. Gnanavel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031009.
Paper No: EP-20-1104
https://doi.org/10.1115/1.4049579
Published Online: February 19, 2021
View Article titled, Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets
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Topics: Flow (Dynamics), Heat transfer, Heat transfer coefficients, Jets, Nozzles, Reynolds-averaged Navier–Stokes equations, Silicon, Reynolds number, Turbulence, Temperature
Journal Articles

Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams

Varun Prasanna Rajamuthu, Sanskar S. Panse, Srinath Ekkad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031003.
Paper No: EP-20-1090
https://doi.org/10.1115/1.4049173
Published Online: January 19, 2021
View Article titled, Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams
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Topics: Density, Foams (Chemistry), Heat transfer, Porosity, Reynolds number, Metal foams, Copper, Flow (Dynamics), Jets
Journal Articles

Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling

Pablo A. de Oliveira, Jader R. Barbosa, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031005.
Paper No: EP-17-1008
https://doi.org/10.1115/1.4036817
Published Online: June 28, 2017
View Article titled, Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling
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Topics: Compressors, Cooling, Heat, Heat sinks, Heat transfer, Refrigeration, Stress, Temperature, Flow (Dynamics), Refrigerants
Journal Articles

Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031015.
Paper No: EP-15-1041
https://doi.org/10.1115/1.4030953
Published Online: September 1, 2015
View Article titled, Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements
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Topics: Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Nozzles, Reynolds number, Jets, Temperature, Heat flux
Journal Articles

A Computational and Experimental Investigation of Synthetic Jets for Cooling of Electronics

Mehmet Arik, Yogen V. Utturkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021005.
Paper No: EP-14-1018
https://doi.org/10.1115/1.4029067
Published Online: June 1, 2015
View Article titled, A Computational and Experimental Investigation of Synthetic Jets for Cooling of Electronics
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Topics: Computational fluid dynamics, Cooling, Dipoles (Electromagnetism), Electronics, Flow (Dynamics), Heat transfer, Jets, Vortices
Journal Articles

Confined, Milliscale Unsteady Laminar Impinging Slot Jets: Effects of Slot Width on Surface Stagnation Point Nusselt Numbers

Dae Hee Lee, Jong Ryeol Bae, Mira Ryu, Phil Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041004.
https://doi.org/10.1115/1.4007317
Published Online: September 4, 2012
View Article titled, Confined, Milliscale Unsteady Laminar Impinging Slot Jets: Effects of Slot Width on Surface Stagnation Point Nusselt Numbers
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Topics: Jets, Nozzles, Reynolds number, Flow (Dynamics)
Journal Articles

Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics

Myung Ki Sung, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021013.
https://doi.org/10.1115/1.3111253
Published Online: April 21, 2009
View Article titled, Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics
Open the PDF for Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics in another window
Topics: Cooling, Flow (Dynamics), Heat, Jets, Microchannels, Temperature, Coolants, Defense industry, Electronics, Thermal management
Journal Articles

Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement

C. J. Fang, M. C. Wu, Y. M. Kuo, C. Y. Lee, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 400–410.
https://doi.org/10.1115/1.2804087
Published Online: December 28, 2006
View Article titled, Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement
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Topics: Disks, Heat transfer, Nozzles, Reynolds number, Transients (Dynamics), Turbulence, Heat flux, Steady state, Jets, Rotation
Journal Articles

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

D. H. Lee, Y. S. Chung, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 221–228.
https://doi.org/10.1115/1.2753884
Published Online: October 30, 2006
View Article titled, Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
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Topics: Flow (Dynamics), Flow separation, Flow visualization, Jets, Nozzles, Pressure, Fins, Temperature, Impingement cooling, Reynolds number
Journal Articles

Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards

Yong Wang, Guang Yuan, Yong-Kyu Yoon, Mark G. Allen, Sue Ann Bidstrup
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 353–359.
https://doi.org/10.1115/1.2351900
Published Online: February 20, 2006
View Article titled, Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards
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Topics: Cooling, Dimensions, Heat transfer, Jets, Printed circuit boards, Diaphragms (Mechanical devices), Diaphragms (Structural), Thermal management, Flow (Dynamics), Fluid mechanics
Journal Articles

Investigation of Flow and Heat Transfer of an Impinging Jet in a Cross-Flow For Cooling of a Heated Cube

D. Rundström, B. Moshfegh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 150–156.
https://doi.org/10.1115/1.2188948
Published Online: November 30, 2005
View Article titled, Investigation of Flow and Heat Transfer of an Impinging Jet in a Cross-Flow For Cooling of a Heated Cube
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Topics: Channel flow, Cooling, Cross-flow, Flow (Dynamics), Heat transfer, Temperature, Boundary-value problems, Heat transfer coefficients, Jets
Journal Articles

Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins

Y. S. Chung, D. H. Lee, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 106–112.
https://doi.org/10.1115/1.1849235
Published Online: June 3, 2005
View Article titled, Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins
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Topics: Flat plates, Flow (Dynamics), Flow visualization, Nozzles, Pressure, Liquid crystals, Temperature distribution, Fins, Jets, Testing
Journal Articles

Meso Scale Pulsating Jets for Electronics Cooling

Jivtesh Garg, Mehmet Arik, Stanton Weaver, Todd Wetzel, Seyed Saddoughi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 503–511.
https://doi.org/10.1115/1.2065727
Published Online: April 20, 2005
View Article titled, Meso Scale Pulsating Jets for Electronics Cooling
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Topics: Heat, Heat flux, Heat transfer, Heat transfer coefficients, Jets, Natural convection, Temperature, Temperature measurement, Thermal management, Cooling
Journal Articles

Design and Thermal Characteristics of a Synthetic Jet Ejector Heat Sink

Raghav Mahalingam, Ari Glezer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 172–177.
https://doi.org/10.1115/1.1869509
Published Online: December 23, 2004
View Article titled, Design and Thermal Characteristics of a Synthetic Jet Ejector Heat Sink
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Topics: Ejectors, Heat sinks, Flow (Dynamics), Jets, Design, Thermal resistance, Temperature
Journal Articles

Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena

Sreekant V. J. Narumanchi, Cristina H. Amon, Fellow ASME, Jayathi Y. Murthy, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 354–361.
https://doi.org/10.1115/1.1572903
Published Online: September 17, 2003
View Article titled, Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena
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Topics: Heat transfer, Jets, Temperature, Capacitance, Reynolds number
Journal Articles

Local Heat Transfer Distributions in Confined Multiple Air Jet Impingement

Suresh V. Garimella, Vincent P. Schroeder
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 165–172.
https://doi.org/10.1115/1.1371923
Published Online: December 26, 2000
View Article titled, Local Heat Transfer Distributions in Confined Multiple Air Jet Impingement
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Topics: Air jets, Flow (Dynamics), Heat, Heat transfer, Heat transfer coefficients, Jets, Reynolds number
Journal Articles

Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays

Kurt A. Estes, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 323–332.
https://doi.org/10.1115/1.2792112
Published Online: December 1, 1995
View Article titled, Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays
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Topics: Computer cooling, Jets, Sprays, Cooling, Critical heat flux, Subcooling, Flow (Dynamics), Liquid films, Boiling, Coolants
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 220–224.
https://doi.org/10.1115/1.2792095
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation
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Topics: Computer simulation, Hardening (Curing), Jets, Ovens, Pressure, Vapors, Design, Contamination, Flow visualization, Heat
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

K. J. Zwick, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 215–219.
https://doi.org/10.1115/1.2792094
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization
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Topics: Flow visualization, Hardening (Curing), Jets, Ovens, Vapors, Vortices, Condensation, Contamination, Flow (Dynamics), Bonding