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Journal Articles

Edge Trimming Induced Defects on Direct Bonded Wafers

Fumihiro Inoue, Anne Jourdain, Lan Peng, Alain Phommahaxay, Daisuke Kosemura, Ingrid De Wolf, Kenneth June Rebibis, Andy Miller, Erik Sleeckx, Eric Beyne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031004.
Paper No: EP-17-1127
https://doi.org/10.1115/1.4040002
Published Online: May 11, 2018
View Article titled, Edge Trimming Induced Defects on Direct Bonded Wafers
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Topics: Damage, Grinding, Semiconductor wafers, Stress, Bonding
Journal Articles

Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

X. J. Xin, Z. J. Pei, Wenjie Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 177–185.
https://doi.org/10.1115/1.1649243
Published Online: July 8, 2004
View Article titled, Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers
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Topics: Grinding, Semiconductor wafers, Wire
Journal Articles

Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die

Neil McLellan, Nelson Fan, Shilai Liu, Kim Lau, Jingshen Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 110–114.
https://doi.org/10.1115/1.1647123
Published Online: April 30, 2004
View Article titled, Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die
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Topics: Fracture toughness, Grinding, Semiconductor wafers, Surface roughness, Polishing, Plasma etching
Journal Articles

The Strength of the Silicon Die in Flip-Chip Assemblies

B. Cotterell, Z. Chen, J.-B. Han, N.-X. Tan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 114–119.
https://doi.org/10.1115/1.1535934
Published Online: March 14, 2003
View Article titled, The Strength of the Silicon Die in Flip-Chip Assemblies
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Topics: Fracture (Materials), Fracture (Process), Probability, Reliability, Silicon, Stress, Grinding, Flip-chip assemblies