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Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi

J. Electron. Packag. September 2021, 143(3): 031006.

Paper No: EP-19-1118

DOI: https://doi.org/10.1115/1.4049564

Published Online: February 19, 2021

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Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)

Journal Articles

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Hua Zhu, Wei Li, Junye Li, Kuang Sheng, Shuai Shao, Haiwang Li, Zhi Tao

J. Electron. Packag. September 2019, 141(3): 031006.

Paper No: EP-18-1092

DOI: https://doi.org/10.1115/1.4043476

Published Online: May 17, 2019

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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Subcooling, Temperature, Heat flux, Bubbles, Nucleate boiling, Flux (Metallurgy)

Journal Articles

Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization

Houxue Huang, Navid Borhani, John Richard Thome

J. Electron. Packag. September 2016, 138(3): 031004.

Paper No: EP-16-1037

DOI: https://doi.org/10.1115/1.4033487

Published Online: May 17, 2016

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Topics: Boiling, Flow (Dynamics), Fluids, Heat, Heat flux, Microchannels, Stress, Temperature, Transients (Dynamics), Subcooling

Journal Articles

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

D. H. Lee, Y. S. Chung, P. M. Ligrani

J. Electron. Packag. September 2007, 129(3): 221–228.

DOI: https://doi.org/10.1115/1.2753884

Published Online: October 30, 2006

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Topics: Flow (Dynamics), Flow separation, Flow visualization, Jets, Nozzles, Pressure, Fins, Temperature, Impingement cooling, Reynolds number

Journal Articles

Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins

Y. S. Chung, D. H. Lee, P. M. Ligrani

J. Electron. Packag. June 2005, 127(2): 106–112.

DOI: https://doi.org/10.1115/1.1849235

Published Online: June 3, 2005

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Topics: Flat plates, Flow (Dynamics), Flow visualization, Nozzles, Pressure, Liquid crystals, Temperature distribution, Fins, Jets, Testing

Journal Articles

Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages

Y. Kondo, H. Matsushima, T. Komatsu

J. Electron. Packag. September 2000, 122(3): 240–246.

DOI: https://doi.org/10.1115/1.1289761

Published Online: February 15, 2000

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Topics: Cooling, Heat sinks, Optimization, Pins (Engineering), Pressure drop, Thermal resistance, Impingement cooling, Flow (Dynamics), Fins, Flow visualization

Journal Articles

Flow-Field Prediction in Submerged and Confined Jet Impingement Using the Reynolds Stress Model

G. K. Morris, S. V. Garimella, J. A. Fitzgerald

J. Electron. Packag. December 1999, 121(4): 255–262.

DOI: https://doi.org/10.1115/1.2793849

Published Online: December 1, 1999

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Topics: Flow (Dynamics), Stress, Nozzles, Reynolds number, Confined flow, Errors, Flow visualization, Outflow, Renormalization (Physics)

Journal Articles

Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks

Y. Asako, Y. Yamaguchi, M. Faghri

J. Electron. Packag. September 1999, 121(3): 202–208.

DOI: https://doi.org/10.1115/1.2792685

Published Online: September 1, 1999

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Topics: Flow (Dynamics), Heat transfer, Ducts, Reynolds number, Computation, Flow visualization, Fluid dynamics, Numerical analysis, Plates (structures), Prandtl number

Journal Articles

Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct

A. Gupta, Y. Jaluria

J. Electron. Packag. September 1998, 120(3): 243–252.

DOI: https://doi.org/10.1115/1.2792629

Published Online: September 1, 1998

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Topics: Cooling, Ducts, Heat, Reynolds number, Heat transfer, Water, Algebra, Buoyancy, Flow (Dynamics), Flow visualization

Journal Articles

Orifice and Impingement Flow Fields in Confined Jet Impingement

G. K. Morris, S. V. Garimella

J. Electron. Packag. March 1998, 120(1): 68–72.

DOI: https://doi.org/10.1115/1.2792288

Published Online: March 1, 1998

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Topics: Flow (Dynamics), Pressure drop, Design, Electronic packaging, Flow visualization, Heat transfer, Outflow, Renormalization (Physics), Reynolds number, Separation (Technology)

Journal Articles

Numerical Simulation of Impingement Air Cooling From LSI Packages With Large Plate Fins by the Penalty Finite Element Method

T. Tanaka, H. Matsushima, A. Ueki, T. Atarashi

J. Electron. Packag. March 1997, 119(1): 73–77.

DOI: https://doi.org/10.1115/1.2792204

Published Online: March 1, 1997

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Topics: Computer simulation, Cooling, Finite element methods, Fins, Gradient methods, Algebra, Computers, Flow (Dynamics), Flow visualization, Industrial research

Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen

J. Electron. Packag. September 1995, 117(3): 220–224.

DOI: https://doi.org/10.1115/1.2792095

Published Online: September 1, 1995

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Topics: Computer simulation, Hardening (Curing), Jets, Ovens, Pressure, Vapors, Design, Contamination, Flow visualization, Heat

Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

K. J. Zwick, I. M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. September 1995, 117(3): 215–219.

DOI: https://doi.org/10.1115/1.2792094

Published Online: September 1, 1995

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Topics: Flow visualization, Hardening (Curing), Jets, Ovens, Vapors, Vortices, Condensation, Contamination, Flow (Dynamics), Bonding

Journal Articles

Onset of Transition in the Flow Over a Three-Dimensional Array of Rectangular Obstacles

S. V. Garimella, P. A. Eibeck

J. Electron. Packag. June 1992, 114(2): 251–255.

DOI: https://doi.org/10.1115/1.2906426

Published Online: June 1, 1992

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Topics: Flow (Dynamics), Reynolds number, Computers, Dimensions, Flow visualization, Geometry, Heat transfer, Printed circuit boards, Turbulence, Water

Journal Articles

Fluid Dynamic Characteristics of the Flow Over an Array of Large Roughness Elements

S. V. Garimella, P. A. Eibeck

J. Electron. Packag. December 1991, 113(4): 367–373.

DOI: https://doi.org/10.1115/1.2905422

Published Online: December 1, 1991

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Topics: Flow (Dynamics), Fluids, Surface roughness, Cavities, Flow separation, Flow visualization, Laser Doppler anemometry, Reynolds number, Separation (Technology), Shear (Mechanics)

Journal Articles

Effect of Component Layout and Geometry on the Flow Distribution in Electronics Circuit Packs

K. Azar, E. T. Russell

J. Electron. Packag. March 1991, 113(1): 50–57.

DOI: https://doi.org/10.1115/1.2905366

Published Online: March 1, 1991

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Topics: Circuits, Electronics, Flow (Dynamics), Geometry, Aluminum, Electronic components, Flow visualization, Inks, Reynolds number, Vehicles

Journal Articles

An Investigation of the Passive Cooling of Table Model Television Receivers

M. S. Yuki, J. R. Parsons, R. J. Krane

J. Electron. Packag. December 1990, 112(4): 279–287.

DOI: https://doi.org/10.1115/1.2904380

Published Online: December 1, 1990

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Topics: Cooling, Vents, Natural convection, Design, Engineers, Flow (Dynamics), Computer simulation, Electronic products, Flow visualization, Heat transfer

Journal Articles

Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water

Y. Joshi, D. L. Knight

J. Electron. Packag. December 1990, 112(4): 367–374.

DOI: https://doi.org/10.1115/1.2904391

Published Online: December 1, 1990

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Topics: Heat, Natural convection, Water, Heat transfer, Temperature measurement, Accounting, Computation, Flow visualization, Heating, Temperature

Journal Articles

Free Convection in a Discretely Heated Vertical Enclosure: Effects of Prandtl Number and Cavity Size

V. Prasad, M. Keyhani, R. Shen

J. Electron. Packag. March 1990, 112(1): 63–74.

DOI: https://doi.org/10.1115/1.2904343

Published Online: March 1, 1990

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Topics: Cavities, Natural convection, Prandtl number, Flow (Dynamics), Temperature, Flow visualization, Dielectric liquids, Heat, Heat transfer coefficients, Rayleigh number

Journal Articles

The Cavity Width Effect on Immersion Cooling of Discrete Flush-Heaters on One Vertical Wall of an Enclosure Cooled from the Top

R. Carmona, M. Keyhani

J. Electron. Packag. December 1989, 111(4): 268–276.

DOI: https://doi.org/10.1115/1.3226546

Published Online: December 1, 1989

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Topics: Cavities, Cooling, Heat transfer coefficients, Flow (Dynamics), Heat flux, Heat transfer, Flow visualization, Fluids, Natural convection, Prandtl number

Journal citation

NARROW

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins

Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages

Flow-Field Prediction in Submerged and Confined Jet Impingement Using the Reynolds Stress Model

Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks

Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct

Orifice and Impingement Flow Fields in Confined Jet Impingement

Numerical Simulation of Impingement Air Cooling From LSI Packages With Large Plate Fins by the Penalty Finite Element Method

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

Onset of Transition in the Flow Over a Three-Dimensional Array of Rectangular Obstacles

Fluid Dynamic Characteristics of the Flow Over an Array of Large Roughness Elements

Effect of Component Layout and Geometry on the Flow Distribution in Electronics Circuit Packs

An Investigation of the Passive Cooling of Table Model Television Receivers

Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water

Free Convection in a Discretely Heated Vertical Enclosure: Effects of Prandtl Number and Cavity Size

The Cavity Width Effect on Immersion Cooling of Discrete Flush-Heaters on One Vertical Wall of an Enclosure Cooled from the Top

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