1-20 of 23
Flow visualization
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031006.
Paper No: EP-19-1118
https://doi.org/10.1115/1.4049564
Published Online: February 19, 2021
View Article titled, Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
Open the PDF for Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes in another window
Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)
Journal Articles

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Hua Zhu, Wei Li, Junye Li, Kuang Sheng, Shuai Shao, Haiwang Li, Zhi Tao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031006.
Paper No: EP-18-1092
https://doi.org/10.1115/1.4043476
Published Online: May 17, 2019
View Article titled, Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel
Open the PDF for Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel in another window
Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Subcooling, Temperature, Heat flux, Bubbles, Nucleate boiling, Flux (Metallurgy)
Journal Articles

Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization

Houxue Huang, Navid Borhani, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031004.
Paper No: EP-16-1037
https://doi.org/10.1115/1.4033487
Published Online: May 17, 2016
View Article titled, Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization
Open the PDF for Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization in another window
Topics: Boiling, Flow (Dynamics), Fluids, Heat, Heat flux, Microchannels, Stress, Temperature, Transients (Dynamics), Subcooling
Journal Articles

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

D. H. Lee, Y. S. Chung, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 221–228.
https://doi.org/10.1115/1.2753884
Published Online: October 30, 2006
View Article titled, Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
Open the PDF for Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins in another window
Topics: Flow (Dynamics), Flow separation, Flow visualization, Jets, Nozzles, Pressure, Fins, Temperature, Impingement cooling, Reynolds number
Journal Articles

Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins

Y. S. Chung, D. H. Lee, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 106–112.
https://doi.org/10.1115/1.1849235
Published Online: June 3, 2005
View Article titled, Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins
Open the PDF for Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins in another window
Topics: Flat plates, Flow (Dynamics), Flow visualization, Nozzles, Pressure, Liquid crystals, Temperature distribution, Fins, Jets, Testing
Journal Articles

Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages

Y. Kondo, H. Matsushima, T. Komatsu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 240–246.
https://doi.org/10.1115/1.1289761
Published Online: February 15, 2000
View Article titled, Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages
Open the PDF for Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages in another window
Topics: Cooling, Heat sinks, Optimization, Pins (Engineering), Pressure drop, Thermal resistance, Impingement cooling, Flow (Dynamics), Fins, Flow visualization
Journal Articles

Flow-Field Prediction in Submerged and Confined Jet Impingement Using the Reynolds Stress Model

G. K. Morris, S. V. Garimella, J. A. Fitzgerald
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 255–262.
https://doi.org/10.1115/1.2793849
Published Online: December 1, 1999
View Article titled, Flow-Field Prediction in Submerged and Confined Jet Impingement Using the Reynolds Stress Model
Open the PDF for Flow-Field Prediction in Submerged and Confined Jet Impingement Using the Reynolds Stress Model in another window
Topics: Flow (Dynamics), Stress, Nozzles, Reynolds number, Confined flow, Errors, Flow visualization, Outflow, Renormalization (Physics)
Journal Articles

Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks

Y. Asako, Y. Yamaguchi, M. Faghri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 202–208.
https://doi.org/10.1115/1.2792685
Published Online: September 1, 1999
View Article titled, Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks
Open the PDF for Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks in another window
Topics: Flow (Dynamics), Heat transfer, Ducts, Reynolds number, Computation, Flow visualization, Fluid dynamics, Numerical analysis, Plates (structures), Prandtl number
Journal Articles

Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct

A. Gupta, Y. Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 243–252.
https://doi.org/10.1115/1.2792629
Published Online: September 1, 1998
View Article titled, Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct
Open the PDF for Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct in another window
Topics: Cooling, Ducts, Heat, Reynolds number, Heat transfer, Water, Algebra, Buoyancy, Flow (Dynamics), Flow visualization
Journal Articles

Orifice and Impingement Flow Fields in Confined Jet Impingement

G. K. Morris, S. V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 68–72.
https://doi.org/10.1115/1.2792288
Published Online: March 1, 1998
View Article titled, Orifice and Impingement Flow Fields in Confined Jet Impingement
Open the PDF for Orifice and Impingement Flow Fields in Confined Jet Impingement in another window
Topics: Flow (Dynamics), Pressure drop, Design, Electronic packaging, Flow visualization, Heat transfer, Outflow, Renormalization (Physics), Reynolds number, Separation (Technology)
Journal Articles

Numerical Simulation of Impingement Air Cooling From LSI Packages With Large Plate Fins by the Penalty Finite Element Method

T. Tanaka, H. Matsushima, A. Ueki, T. Atarashi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 73–77.
https://doi.org/10.1115/1.2792204
Published Online: March 1, 1997
View Article titled, Numerical Simulation of Impingement Air Cooling From LSI Packages With Large Plate Fins by the Penalty Finite Element Method
Open the PDF for Numerical Simulation of Impingement Air Cooling From LSI Packages With Large Plate Fins by the Penalty Finite Element Method in another window
Topics: Computer simulation, Cooling, Finite element methods, Fins, Gradient methods, Algebra, Computers, Flow (Dynamics), Flow visualization, Industrial research
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 220–224.
https://doi.org/10.1115/1.2792095
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation
Open the PDF for Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation in another window
Topics: Computer simulation, Hardening (Curing), Jets, Ovens, Pressure, Vapors, Design, Contamination, Flow visualization, Heat
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

K. J. Zwick, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 215–219.
https://doi.org/10.1115/1.2792094
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization
Open the PDF for Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization in another window
Topics: Flow visualization, Hardening (Curing), Jets, Ovens, Vapors, Vortices, Condensation, Contamination, Flow (Dynamics), Bonding
Journal Articles

Onset of Transition in the Flow Over a Three-Dimensional Array of Rectangular Obstacles

S. V. Garimella, P. A. Eibeck
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 251–255.
https://doi.org/10.1115/1.2906426
Published Online: June 1, 1992
View Article titled, Onset of Transition in the Flow Over a Three-Dimensional Array of Rectangular Obstacles
Open the PDF for Onset of Transition in the Flow Over a Three-Dimensional Array of Rectangular Obstacles in another window
Topics: Flow (Dynamics), Reynolds number, Computers, Dimensions, Flow visualization, Geometry, Heat transfer, Printed circuit boards, Turbulence, Water
Journal Articles

Fluid Dynamic Characteristics of the Flow Over an Array of Large Roughness Elements

S. V. Garimella, P. A. Eibeck
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 367–373.
https://doi.org/10.1115/1.2905422
Published Online: December 1, 1991
View Article titled, Fluid Dynamic Characteristics of the Flow Over an Array of Large Roughness Elements
Open the PDF for Fluid Dynamic Characteristics of the Flow Over an Array of Large Roughness Elements in another window
Topics: Flow (Dynamics), Fluids, Surface roughness, Cavities, Flow separation, Flow visualization, Laser Doppler anemometry, Reynolds number, Separation (Technology), Shear (Mechanics)
Journal Articles

Effect of Component Layout and Geometry on the Flow Distribution in Electronics Circuit Packs

K. Azar, E. T. Russell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 50–57.
https://doi.org/10.1115/1.2905366
Published Online: March 1, 1991
View Article titled, Effect of Component Layout and Geometry on the Flow Distribution in Electronics Circuit Packs
Open the PDF for Effect of Component Layout and Geometry on the Flow Distribution in Electronics Circuit Packs in another window
Topics: Circuits, Electronics, Flow (Dynamics), Geometry, Aluminum, Electronic components, Flow visualization, Inks, Reynolds number, Vehicles
Journal Articles

An Investigation of the Passive Cooling of Table Model Television Receivers

M. S. Yuki, J. R. Parsons, R. J. Krane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 279–287.
https://doi.org/10.1115/1.2904380
Published Online: December 1, 1990
View Article titled, An Investigation of the Passive Cooling of Table Model Television Receivers
Open the PDF for An Investigation of the Passive Cooling of Table Model Television Receivers in another window
Topics: Cooling, Vents, Natural convection, Design, Engineers, Flow (Dynamics), Computer simulation, Electronic products, Flow visualization, Heat transfer
Journal Articles

Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water

Y. Joshi, D. L. Knight
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 367–374.
https://doi.org/10.1115/1.2904391
Published Online: December 1, 1990
View Article titled, Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water
Open the PDF for Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water in another window
Topics: Heat, Natural convection, Water, Heat transfer, Temperature measurement, Accounting, Computation, Flow visualization, Heating, Temperature
Journal Articles

Free Convection in a Discretely Heated Vertical Enclosure: Effects of Prandtl Number and Cavity Size

V. Prasad, M. Keyhani, R. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 63–74.
https://doi.org/10.1115/1.2904343
Published Online: March 1, 1990
View Article titled, Free Convection in a Discretely Heated Vertical Enclosure: Effects of Prandtl Number and Cavity Size
Open the PDF for Free Convection in a Discretely Heated Vertical Enclosure: Effects of Prandtl Number and Cavity Size in another window
Topics: Cavities, Natural convection, Prandtl number, Flow (Dynamics), Temperature, Flow visualization, Dielectric liquids, Heat, Heat transfer coefficients, Rayleigh number
Journal Articles

The Cavity Width Effect on Immersion Cooling of Discrete Flush-Heaters on One Vertical Wall of an Enclosure Cooled from the Top

R. Carmona, M. Keyhani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 268–276.
https://doi.org/10.1115/1.3226546
Published Online: December 1, 1989
View Article titled, The Cavity Width Effect on Immersion Cooling of Discrete Flush-Heaters on One Vertical Wall of an Enclosure Cooled from the Top
Open the PDF for The Cavity Width Effect on Immersion Cooling of Discrete Flush-Heaters on One Vertical Wall of an Enclosure Cooled from the Top in another window
Topics: Cavities, Cooling, Heat transfer coefficients, Flow (Dynamics), Heat flux, Heat transfer, Flow visualization, Fluids, Natural convection, Prandtl number