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Journal Articles

Effect of Dispensing Type on Void Formation Using Convolutional Neural Network

Muhammad Taufik Azahari, Calvin Ling, Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011006.
Paper No: EP-23-1004
https://doi.org/10.1115/1.4065078
Published Online: August 9, 2024
View Article titled, Effect of Dispensing Type on Void Formation Using Convolutional Neural Network
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Topics: Convolutional neural networks, Epoxy adhesives, Epoxy resins, Flip-chip devices, Flip-chip, Flow (Dynamics), Image processing
Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031014.
Paper No: EP-21-1121
https://doi.org/10.1115/1.4053889
Published Online: March 8, 2022
View Article titled, Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading
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Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability
Journal Articles

Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip

Zhankun Li, Zhekun Fan, Long Dou, Zhong Jin, Zhan Liu, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031007.
Paper No: EP-21-1039
https://doi.org/10.1115/1.4051468
Published Online: September 15, 2021
View Article titled, Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip
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Topics: Flip-chip, Flip-chip devices, Reliability, Thermal conductivity, Temperature, Current density
Journal Articles

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Bo Wu, Shuanghai Zhang, Fuliang Wang, Zhuo Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044502.
Paper No: EP-18-1015
https://doi.org/10.1115/1.4040794
Published Online: August 6, 2018
View Article titled, Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding
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Topics: Bonding, Columns (Structural), Flip-chip, Copper, Flip-chip devices
Journal Articles

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Yasuo Takahashi, Hiroki Fukuda, Yasuhiro Yoneshima, Hideki Kitamura, Masakatsu Maeda
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041010.
Paper No: EP-17-1026
https://doi.org/10.1115/1.4038143
Published Online: October 25, 2017
View Article titled, Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding
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Topics: Bonding, Vibration, Flip-chip, Flip-chip devices
Journal Articles

Recent Advances and New Trends in Flip Chip Technology

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2016, 138(3): 030802.
Paper No: EP-16-1052
https://doi.org/10.1115/1.4034037
Published Online: July 25, 2016
View Article titled, Recent Advances and New Trends in Flip Chip Technology
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Topics: Bonding, Flip-chip, Flip-chip assemblies, Flip-chip devices, Manufacturing, Semiconductor wafers, Solders, Columns (Structural), Silicon, Packaging
Journal Articles

Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates

C. Y. Khor, M. Z. Abdullah, M. Abdul Mujeebu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011003.
https://doi.org/10.1115/1.4005914
Published Online: March 19, 2012
View Article titled, Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates
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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Non-Newtonian flow, Plates (structures), Fluids, Simulation, Computational fluid dynamics, Finite volume methods, Pressure drop
Journal Articles

Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

P. Borgesen, D. Blass, M. Meilunas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011010.
https://doi.org/10.1115/1.4005904
Published Online: March 19, 2012
View Article titled, Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies
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Topics: Ball-Grid-Array packaging, Bonding, Corners (Structural elements), Fracture (Materials), Solder joints, Solders, Cycles, Manufacturing, Cracking (Materials), Fracture (Process)
Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
https://doi.org/10.1115/1.4003992
Published Online: June 23, 2011
View Article titled, Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
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Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging
Journal Articles

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Z. Kornain, A. Jalar, R. Rasid, S. Abdullah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041012.
https://doi.org/10.1115/1.4002741
Published Online: December 8, 2010
View Article titled, Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package
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Topics: Absorption, Adhesion, Flip-chip, Flip-chip devices, Fracture toughness, Packaging, Reliability, Shear (Mechanics), Temperature, Young's modulus
Journal Articles

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

Brett Fennell, Sangil Lee, Daniel F. Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041013.
https://doi.org/10.1115/1.4002825
Published Online: December 8, 2010
View Article titled, Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid
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Topics: Flip-chip devices, Flow (Dynamics), Solders, Modeling, Springs, Surface tension, Viscosity, Fluids, Dampers
Journal Articles

Interactions Between Flip Chip Underfill and Solder Alloy

D. Blass, P. Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031008.
https://doi.org/10.1115/1.4002010
Published Online: September 9, 2010
View Article titled, Interactions Between Flip Chip Underfill and Solder Alloy
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Topics: Alloys, Flip-chip, Flip-chip devices, Solders, Thermal shock, Thermal expansion, Testing, Adhesion, Reliability, Cycles
Journal Articles

Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package

Hu Guojun, Andrew A. O. Tay, Luan Jing-En, Ma Yiyi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
https://doi.org/10.1115/1.4001145
Published Online: March 19, 2010
View Article titled, Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package
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Topics: Ball-Grid-Array packages, Delamination, Flip-chip, Flip-chip devices, Fracture (Materials), Shrinkage (Materials), Stress, Temperature, Epoxy resins, Molding
Journal Articles

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

Sangil Lee, M. J. Yim, Daniel Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
https://doi.org/10.1115/1.3153369
Published Online: July 31, 2009
View Article titled, Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill
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Topics: Flip-chip devices, Flow (Dynamics), Solders, Hardening (Curing), Chemical reactions, Wetting, Temperature, Flip-chip, Manufacturing
Journal Articles

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

Satoru Katsurayama, Hironori Tohmyoh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031005.
https://doi.org/10.1115/1.3144153
Published Online: June 23, 2009
View Article titled, Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability
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Topics: Flip-chip packages, Hardening (Curing), Manufacturing, Reliability, Temperature, Warping, Flow (Dynamics), Flip-chip devices
Journal Articles

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Jin Yang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
https://doi.org/10.1115/1.3068301
Published Online: February 18, 2009
View Article titled, Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals
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Topics: Electronic packages, Flip-chip devices, Lasers, Signals, Solders, Tin, Ultrasound, Vehicles, X-rays, Inspection
Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
https://doi.org/10.1115/1.2993146
Published Online: November 17, 2008
View Article titled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
Open the PDF for Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling in another window
Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints
Journal Articles

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

Jin Yang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031009.
https://doi.org/10.1115/1.2957328
Published Online: August 1, 2008
View Article titled, Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses
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Topics: Flip-chip, Flip-chip devices, Inspection, Lasers, Modal analysis, Solders, Ultrasound, Mode shapes
Journal Articles

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

Cheng-fu Chen, Pramod C. Karulkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031005.
https://doi.org/10.1115/1.2957324
Published Online: July 30, 2008
View Article titled, Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages
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Topics: Fillers (Materials), Stress, Particulate matter, Flip-chip packages, Flip-chip devices
Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
https://doi.org/10.1115/1.2912209
Published Online: May 9, 2008
View Article titled, On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials
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Topics: Damage, Epoxy resins, Failure mechanisms, Flip-chip, Flip-chip devices, Reliability, Solder joints, Solders, Viscoelasticity, Waves