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Journal Articles

An Investigation of Flat-Plate Oscillating Heat Pipes

Peng Cheng, Scott Thompson, Joe Boswell, H. B. Ma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
https://doi.org/10.1115/1.4002726
Published Online: November 24, 2010
View Article titled, An Investigation of Flat-Plate Oscillating Heat Pipes
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Topics: Diamonds, Flat plates, Fluids, Heat pipes, Heat transfer, Nanofluids, Temperature, Thermal resistance, Water, Operating temperature
Journal Articles

Squeezing Flow of a Power Law Fluid Between Grooved Plates

Drew A. Davidson, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031007.
https://doi.org/10.1115/1.3144158
Published Online: June 23, 2009
View Article titled, Squeezing Flow of a Power Law Fluid Between Grooved Plates
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Topics: Flow (Dynamics), Fluids, Microchannels, Plates (structures), Flat plates
Journal Articles

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

D. H. Lee, Y. S. Chung, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 221–228.
https://doi.org/10.1115/1.2753884
Published Online: October 30, 2006
View Article titled, Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
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Topics: Flow (Dynamics), Flow separation, Flow visualization, Jets, Nozzles, Pressure, Fins, Temperature, Impingement cooling, Reynolds number
Journal Articles

An Experimental Study of the Enhancement of Air-Cooling Limits for Telecom/Datacom Heat Sink Applications Using an Impinging Air Jet

Eric Sansoucy, Patrick H. Oosthuizen, Gamal Refai-Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 166–171.
https://doi.org/10.1115/1.2164848
Published Online: August 24, 2005
View Article titled, An Experimental Study of the Enhancement of Air-Cooling Limits for Telecom/Datacom Heat Sink Applications Using an Impinging Air Jet
Open the PDF for An Experimental Study of the Enhancement of Air-Cooling Limits for Telecom/Datacom Heat Sink Applications Using an Impinging Air Jet in another window
Topics: Heat sinks, Heat transfer, Air jets, Flow (Dynamics), Cooling, Flat plates, Nozzles, Temperature, Computer simulation
Journal Articles

Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins

Y. S. Chung, D. H. Lee, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 106–112.
https://doi.org/10.1115/1.1849235
Published Online: June 3, 2005
View Article titled, Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins
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Topics: Flat plates, Flow (Dynamics), Flow visualization, Nozzles, Pressure, Liquid crystals, Temperature distribution, Fins, Jets, Testing
Journal Articles

A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements

Reena Cole, Mark Davies, Jeff Punch
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 480–489.
https://doi.org/10.1115/1.1604811
Published Online: December 15, 2003
View Article titled, A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements
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Topics: Flat plates, Flow (Dynamics), Temperature, Thermal conductivity, Thermal resistance, Vehicles, Reynolds number, Boundary layers, Junctions, Measurement systems
Journal Articles

Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape

J. R. Culham, Associate Professor and Director, Mem. ASME, M. M. Yovanovich, Distinguished Professor Emeritus, Fellow ASME, P. Teertstra, Research Associate, C.-S. Wang, G. Refai-Ahmed, Mem. ASME, Ra-Min Tain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 182–188.
https://doi.org/10.1115/1.1347993
Published Online: October 13, 2000
View Article titled, Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape
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Topics: Boundary layers, Dimensions, Flat plates, Flow (Dynamics), Forced convection, Reynolds number, Shapes, Computer simulation, Heat transfer, Computational fluid dynamics
Journal Articles

Thermal Math Modeling and Analysis of an Electronic Assembly

K. N. Shukla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 372–378.
https://doi.org/10.1115/1.1388561
Published Online: May 5, 2000
View Article titled, Thermal Math Modeling and Analysis of an Electronic Assembly
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Topics: Finite element methods, Heat, Heat transfer coefficients, Manufacturing, Mathematics, Modeling, Temperature, Temperature distribution, Thermal analysis, Printed circuit boards
Journal Articles

Investigation of a Heat Pipe Array for Convective Cooling

A. H. Howard, G. P. Peterson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 208–214.
https://doi.org/10.1115/1.2792093
Published Online: September 1, 1995
View Article titled, Investigation of a Heat Pipe Array for Convective Cooling
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Topics: Cooling, Heat pipes, Heat, Copper, Electrical measurement, Fins, Flow (Dynamics), Pressure drop, Thermal resistance, Water
Journal Articles

A Preliminary Investigation of the Cooling of Electronic Components With Flat Plate Heat Sinks

I. Ahmed, R. J. Krane, J. R. Parsons
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 60–67.
https://doi.org/10.1115/1.2905495
Published Online: March 1, 1994
View Article titled, A Preliminary Investigation of the Cooling of Electronic Components With Flat Plate Heat Sinks
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Topics: Cooling, Electronic components, Flat plates, Heat sinks, Computer simulation, Natural convection, Temperature, Algorithms, Coatings, Emissivity
Journal Articles

Conjugate Heat Transfer From a Vertical Plate With Discrete Heat Sources Under Natural Convection

S. Lee, M. M. Yovanovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 261–267.
https://doi.org/10.1115/1.3226545
Published Online: December 1, 1989
View Article titled, Conjugate Heat Transfer From a Vertical Plate With Discrete Heat Sources Under Natural Convection
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Topics: Heat, Heat transfer, Natural convection, Vertical plates, Fluids, Radiation (Physics), Temperature, Boundary layers, Clearances (Engineering), Convection