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Journal Articles

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

Mahdi Farahikia, Ping-Chuan Wang, Louis Reyes, Matthew Krumholtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034501.
Paper No: EP-23-1066
https://doi.org/10.1115/1.4064523
Published Online: February 7, 2024
View Article titled, A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots
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Topics: Coolants, Fins, Numerical analysis, Plates (structures), Pumps, Temperature, Temperature distribution, Thermal management, Thermal resistance, Flow (Dynamics)
Journal Articles

Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit

Ping Sun, Bing-Huan Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011005.
Paper No: EP-22-1080
https://doi.org/10.1115/1.4062531
Published Online: June 6, 2023
View Article titled, Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit
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Topics: Flow (Dynamics), Heat transfer, Microchannels, Shapes, Temperature, Fins, Circuits, Cooling, Integrated circuits
Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
https://doi.org/10.1115/1.4052790
Published Online: November 9, 2021
View Article titled, Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces
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Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)
Includes: Supplementary data
Journal Articles

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Yuanchen Hu, Md Obaidul Hossen, Zhimin Wan, Muhannad S. Bakir, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031007.
Paper No: EP-20-1045
https://doi.org/10.1115/1.4049814
Published Online: February 19, 2021
View Article titled, Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
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Topics: Computational fluid dynamics, Cooling, Integrated circuits, Leakage, Simulation, Temperature, Transients (Dynamics), Fins, Steady state, Heat
Journal Articles

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Jie Liu, Jinglong Zou, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011003.
Paper No: EP-19-1078
https://doi.org/10.1115/1.4046762
Published Online: June 4, 2020
View Article titled, Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp
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Topics: Energy dissipation, Heat, Light-emitting diodes, Optimization, Phosphors, Temperature, Junctions, Natural convection, Thermal analysis, Fins
Journal Articles

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
https://doi.org/10.1115/1.4043406
Published Online: May 8, 2019
View Article titled, Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages
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Topics: Cooling, Flow (Dynamics), Heat, Heat sinks, Temperature, Geometry, Coolants, Fins, Silicon, Electronic packages
Journal Articles

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
https://doi.org/10.1115/1.4039475
Published Online: May 9, 2018
View Article titled, Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
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Topics: Fins, Flow (Dynamics), Fluids, Friction, Heat transfer, Pressure drop, Reynolds number, Water, Heat, Temperature
Journal Articles

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

C. Falsetti, M. Magnini, J. R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031008.
Paper No: EP-17-1023
https://doi.org/10.1115/1.4037152
Published Online: July 10, 2017
View Article titled, Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator
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Topics: Boiling, Flow (Dynamics), Heat flux, Heat transfer, Heat transfer coefficients, Pressure drop, Temperature, Vapors, Fins, Heat
Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010910.
Paper No: EP-15-1107
https://doi.org/10.1115/1.4032496
Published Online: March 10, 2016
View Article titled, Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
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Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing
Journal Articles

Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime

Gongnan Xie, Masoud Asadi, Bengt Sunden, Shaofei Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031013.
Paper No: EP-13-1138
https://doi.org/10.1115/1.4027728
Published Online: June 10, 2014
View Article titled, Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime
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Topics: Design, Flow (Dynamics), Geometry, Heat transfer, Optimization, Reynolds number, Thermal resistance, Vortices, Wavelength, Degrees of freedom
Journal Articles

Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated Circuits

Daniel Lorenzini-Gutierrez, Satish G. Kandlikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021007.
Paper No: EP-13-1082
https://doi.org/10.1115/1.4027091
Published Online: April 29, 2014
View Article titled, Variable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three-Dimensional Integrated Circuits
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Topics: Density, Flow (Dynamics), Pressure drop, Temperature, Cooling, Fins
Journal Articles

Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins

A. Tamayol, F. McGregor, M. Bahrami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2012, 134(3): 034501.
https://doi.org/10.1115/1.4007077
Published Online: July 24, 2012
View Article titled, Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins
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Topics: Fins, Heat transfer, Natural convection, Radiation (Physics), Temperature
Journal Articles

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Derek Gateman, Anthony G. Straatman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
https://doi.org/10.1115/1.4002724
Published Online: November 24, 2010
View Article titled, The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks
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Topics: Contact resistance, Heat sinks, Heat transfer, Metal foams, Fluids, Fins, Aluminum, Convection, Heat conduction, Epoxy adhesives
Journal Articles

Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

Giulio Lorenzini, Simone Moretti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
https://doi.org/10.1115/1.3144152
Published Online: July 31, 2009
View Article titled, Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules
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Topics: Fins, Heat, Heat exchangers, Pressure, Shapes, Temperature, Thermal conductivity, Ducts, Reynolds number, Optimization
Journal Articles

Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins

V. Egan, P. A. Walsh, E. Walsh, R. Grimes
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031004.
https://doi.org/10.1115/1.3144150
Published Online: June 23, 2009
View Article titled, Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins
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Topics: Design, Flow (Dynamics), Heat sinks, Cooling, Thermal resistance, Fans, Fins
Journal Articles

Experimental Study of Water Liquid-Vapor Two-Phase Pressure Drop Across an Array of Staggered Micropin-Fins

Christopher A. Konishi, Weilin Qu, Frank E. Pfefferkorn
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021010.
https://doi.org/10.1115/1.3104028
Published Online: April 3, 2009
View Article titled, Experimental Study of Water Liquid-Vapor Two-Phase Pressure Drop Across an Array of Staggered Micropin-Fins
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Topics: Fins, Flow (Dynamics), Pressure drop, Vapors, Water, Friction, Two-phase flow
Journal Articles

Modeling Forced Convection in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Anthony G. Straatman, Lee J. Betchen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
https://doi.org/10.1115/1.3103934
Published Online: March 27, 2009
View Article titled, Modeling Forced Convection in Finned Metal Foam Heat Sinks
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Topics: Aluminum, Computational fluid dynamics, Fins, Heat sinks, Heat transfer, Thermal conductivity, Fluids, Flow (Dynamics), Metal foams, Forced convection
Journal Articles

Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces

Karl J. L. Geisler, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041002.
https://doi.org/10.1115/1.2993135
Published Online: November 14, 2008
View Article titled, Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces
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Topics: Aluminum, Boiling, Heat sinks, Heat, Fins, Thermal conductivity, Critical heat flux, Silicon, Energy dissipation, Heat transfer coefficients
Journal Articles

A Numerical Study of a Heat Sink Fin Under a Laminar Impinging Jet

Z. Q. Lou, C. Yap, A. S. Mujumdar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2008, 130(3): 034501.
https://doi.org/10.1115/1.2809447
Published Online: August 8, 2008
View Article titled, A Numerical Study of a Heat Sink Fin Under a Laminar Impinging Jet
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Topics: Heat sinks, Heat transfer, Pressure drop, Reynolds number, Thermal resistance, Fluids, Fins
Journal Articles

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

K. Lafdi, O. Mesalhy, A. Elgafy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021004.
https://doi.org/10.1115/1.2912185
Published Online: April 25, 2008
View Article titled, Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications
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Topics: Cooling, Design, Fins, Heat, Heat sinks, Phase change materials, Porosity, Shapes, Temperature, Thermal conductivity