Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 20

Sort by

Sort Order Select

Journal Articles

Numerical Study of Two-Stage Temperature Control Strategy for High Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Kaifeng Chang, Yunze Li, Weishu Wang

J. Electron. Packag.

Paper No: EP-22-1097

DOI: https://doi.org/10.1115/1.4062108

Published Online: March 11, 2023

View Article

Topics: Fibers, High temperature, Satellites, Stability, Temperature control, Temperature, Control systems, Engineering systems and industry applications, Errors, Space vehicles

Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer

J. Electron. Packag. June 2022, 144(2): 021109.

Paper No: EP-21-1016

DOI: https://doi.org/10.1115/1.4052536

Published Online: October 14, 2021

View Article

Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables

Journal Articles

Design for Reliability Applied to Packaging of a MOEMS Switch

Abiodun A. Fasoro, Manoj Mittal, Dan O. Popa, Dereje A. Agonafer, Harry E. Stephanou

J. Electron. Packag. December 2008, 130(4): 041003.

DOI: https://doi.org/10.1115/1.2993142

Published Online: November 17, 2008

View Article

Topics: Design, Fibers, Microelectromechanical systems, Microoptoelectromechanical systems, Packaging, Reliability, Sealing (Process), Switches, Shear (Mechanics), Solders

Journal Articles

Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

Wei Zhang, Chunqing Wang, Yanhong Tian

J. Electron. Packag. March 2008, 130(1): 011009.

DOI: https://doi.org/10.1115/1.2837518

Published Online: February 12, 2008

View Article

Topics: Fibers, Solder joints, Soldering, Solders, Surface tension, Geometry, Shapes, Equilibrium (Physics), Yaw

Journal Articles

Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS Packaging

Z. W. Zhong, S. C. Lim, A. Asundi

J. Electron. Packag. March 2005, 127(1): 25–28.

DOI: https://doi.org/10.1115/1.1846063

Published Online: March 21, 2005

View Article

Topics: Epoxy adhesives, Fibers, Finite element analysis, Optical fiber, Shear (Mechanics), Silicon, Temperature, MEMS packaging, Epoxy resins

Journal Articles

Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing

Ben Ting, Vincent P. Manno

J. Electron. Packag. September 2005, 127(3): 299–305.

DOI: https://doi.org/10.1115/1.1938206

Published Online: November 1, 2004

View Article

Topics: Fibers, Lasers, Simulation, Transients (Dynamics), Temperature, Manufacturing, Thermomechanics, Geometry, Displacement, Materials properties

Journal Articles

Corrosion Analysis of a Fiber-Optic Transceiver Housing

J. H. Lau, Fellow ASME, C. L. Jiaa, S. J. Erasmus

J. Electron. Packag. December 2002, 124(4): 379–384.

DOI: https://doi.org/10.1115/1.1510862

Published Online: December 12, 2002

View Article

Topics: Corrosion, Fibers, Weight (Mass)

Journal Articles

Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure

Samuel I-En Lin, Mem. ASME,

J. Electron. Packag. March 2002, 124(1): 54–59.

DOI: https://doi.org/10.1115/1.1414135

Published Online: July 7, 2000

View Article

Topics: Diffraction gratings, Fiber Bragg gratings, Fibers, Packaging, Temperature, Wavelength, Optical fiber, Deformation

Journal Articles

The Maximum Stress in Optical Glass Fibers Under Two-Point Bending

Mikio Muraoka

J. Electron. Packag. March 2001, 123(1): 70–73.

DOI: https://doi.org/10.1115/1.1324674

Published Online: June 28, 2000

View Article

Topics: Bending (Stress), Fibers, Optical glass, Stress, Stress-strain relations, Optical fiber

Journal Articles

A Statistical Mechanical Model of Electrical Carbon Fiber Contacts

J. Xie, M. Pecht, A. Dasgupta, J. A. Swift, S. J. Wallace

J. Electron. Packag. December 1999, 121(4): 286–290.

DOI: https://doi.org/10.1115/1.2793854

Published Online: December 1, 1999

View Article

Topics: Carbon fibers, Contact resistance, Fibers, Geometry

Journal Articles

Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

N. R. Sottos, J. M. Ockers, M. Swindeman

J. Electron. Packag. March 1999, 121(1): 37–43.

DOI: https://doi.org/10.1115/1.2792659

Published Online: March 1, 1999

View Article

Topics: Composite materials, Printed circuit boards, Thermoelasticity, Textiles, Geometry, Lumber, Elastic moduli, Epoxy adhesives, Epoxy resins, Fibers

Journal Articles

A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces

C. K. Gurumurthy, J. Jiao, L. G. Norris, C.-Y. Hui, E. J. Kramer

J. Electron. Packag. December 1998, 120(4): 372–378.

DOI: https://doi.org/10.1115/1.2792649

Published Online: December 1, 1998

View Article

Topics: Fatigue testing, Polymers, Thermomechanics, Fracture (Materials), Displacement, Cycles, Fatigue, Cantilever beams, Delamination, Failure

Journal Articles

Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers

W. W. King, C. J. Aloisio, Jr.

J. Electron. Packag. June 1997, 119(2): 133–137.

DOI: https://doi.org/10.1115/1.2792219

Published Online: June 1, 1997

View Article

Topics: Coatings, Delamination, Optical fiber, Polymers, Thermomechanics, Tension, Fibers, Compressive stress, Composite materials, Hydrostatics

Journal Articles

Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design

E. Suhir

J. Electron. Packag. December 1995, 117(4): 261–265.

DOI: https://doi.org/10.1115/1.2792102

Published Online: December 1, 1995

View Article

Topics: Design, Fibers, Lasers, Optimization, Stress, Rotation, Buckling, Compressive stress, Deformation, Optical instruments

Journal Articles

Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages

Mary J. Li, Michael Pecht

J. Electron. Packag. September 1995, 117(3): 225–229.

DOI: https://doi.org/10.1115/1.2792096

Published Online: September 1, 1995

View Article

Topics: Electronic packages, Electrons, Failure mechanisms, Bonding, Failure, Fibers, Microcracks, Printed circuit boards, Resins, Scanning electron microscopy

Journal Articles

Closed-Form Solutions for the Large Deflections of Curved Optical Glass Fibers Under Combined Loads

J. H. Lau

J. Electron. Packag. September 1993, 115(3): 337–339.

DOI: https://doi.org/10.1115/1.2909337

Published Online: September 1, 1993

View Article

Topics: Deflection, Fibers, Optical glass, Stress

Journal Articles

Displacement-Limited Buckling of an Optical Fiber

W. W. King

J. Electron. Packag. March 1993, 115(1): 39–43.

DOI: https://doi.org/10.1115/1.2909300

Published Online: March 1, 1993

View Article

Topics: Buckling, Displacement, Optical fiber, Fibers, Stress, Deflection

Journal Articles

The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber

M. Muraoka, H. Abe´, N. Aizawa

J. Electron. Packag. December 1992, 114(4): 403–406.

DOI: https://doi.org/10.1115/1.2905472

Published Online: December 1, 1992

View Article

Topics: Fibers, Fracture (Materials), Optical glass, Stress, Boundary element methods, Geometry, Optical fiber

Journal Articles

Effect of the Nonlinear Behavior of the Material on Two-Point Bending of Optical Glass Fibers

E. Suhir

J. Electron. Packag. June 1992, 114(2): 246–250.

DOI: https://doi.org/10.1115/1.2906425

Published Online: June 1, 1992

View Article

Topics: Fibers, Optical glass, Compression, Stress, Stress-strain relations, Tension, Coatings, Deformation

Journal Articles

Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors

Mingguang Zhu, D. D. L. Chung

J. Electron. Packag. December 1991, 113(4): 417–420.

DOI: https://doi.org/10.1115/1.2905429

Published Online: December 1, 1991

View Article

Topics: Composite materials, Fibers, Nickel, Silicones, Electrical resistivity, Compression, Copper, Electromagnetic interference, Gaskets, Heating

Journal citation

NARROW

Manuscript

Numerical Study of Two-Stage Temperature Control Strategy for High Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Design for Reliability Applied to Packaging of a MOEMS Switch

Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS Packaging

Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing

Corrosion Analysis of a Fiber-Optic Transceiver Housing

Tunable Athermal Multi-FBG Package Using a Bending Bimetal Structure

The Maximum Stress in Optical Glass Fibers Under Two-Point Bending

A Statistical Mechanical Model of Electrical Carbon Fiber Contacts

Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces

Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers

Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design

Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages

Closed-Form Solutions for the Large Deflections of Curved Optical Glass Fibers Under Combined Loads

Displacement-Limited Buckling of an Optical Fiber

The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber

Effect of the Nonlinear Behavior of the Material on Two-Point Bending of Optical Glass Fibers

Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only