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Journal Articles

Numerical Study of Two-Stage Temperature Control Strategy for High Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Kaifeng Chang, Yunze Li, Weishu Wang

J. Electron. Packag.

Paper No: EP-22-1097

DOI: https://doi.org/10.1115/1.4062108

Published Online: March 11, 2023

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Topics: Fibers, High temperature, Satellites, Stability, Temperature control, Temperature, Control systems, Engineering systems and industry applications, Errors, Space vehicles

Journal Articles

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Yuqian Xu, Qiwen Zeng, Yuexing Wang, Mingyong Wu, Xiangyu Chen, Gang Chen

J. Electron. Packag. March 2023, 145(1): 011205.

Paper No: EP-22-1001

DOI: https://doi.org/10.1115/1.4054821

Published Online: August 3, 2022

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Topics: Algebra, Deformation, Differential equations, Genetic algorithms, Stress, Errors, Solders

Journal Articles

Electrothermal Analysis of System in Package for Aerospace Application

Hao-hang Su, Shuai Fu, Su-yuan Li, Jiang Bian

J. Electron. Packag. March 2023, 145(1): 011202.

Paper No: EP-22-1014

DOI: https://doi.org/10.1115/1.4054462

Published Online: July 7, 2022

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Topics: Aerospace industry, Design, Heat, Joules, Reliability, Simulation, System-in-package, Temperature, Vacuum, Errors

Journal Articles

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Patrick Krane, David Gonzalez Cuadrado, Francisco Lozano, Guillermo Paniagua, Amy Marconnet

J. Electron. Packag. March 2022, 144(1): 011008.

Paper No: EP-20-1121

DOI: https://doi.org/10.1115/1.4050200

Published Online: August 6, 2021

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Topics: Electronic packages, Heat, Temperature, Errors, Heat conduction

Journal Articles

Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Ismail Turkmen, Cem Ahmet Mercan, Hamza Salih Erden

J. Electron. Packag. September 2020, 142(3): 031116.

Paper No: EP-20-1018

DOI: https://doi.org/10.1115/1.4047845

Published Online: August 5, 2020

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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Temperature, Tiles, Potential energy, Stress, Leakage

Journal Articles

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

Aditya Chandramohan, Sara K. Lyons, Justin A. Weibel, Suresh V. Garimella

J. Electron. Packag. December 2018, 140(4): 041008.

Paper No: EP-18-1028

DOI: https://doi.org/10.1115/1.4041360

Published Online: October 1, 2018

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Topics: Emissivity, Errors, Resolution (Optics), Temperature, Thermography, Uncertainty

Journal Articles

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

Michael J. Ellsworth, Jr., Randy J. Zoodsma, Frank Cascio, Eileen Behrendt

J. Electron. Packag. December 2014, 136(4): 041009.

Paper No: EP-13-1124

DOI: https://doi.org/10.1115/1.4028119

Published Online: September 19, 2014

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Topics: Design, Flow (Dynamics), Pumps, Reservoirs, Sensors, Temperature, Water, Valves, Algorithms, Electronics

Journal Articles

A Stepped-Bar Apparatus for Thermal Resistance Measurements

Dakotah R. Thompson, Sameer R. Rao, Baratunde A. Cola

J. Electron. Packag. December 2013, 135(4): 041002.

Paper No: EP-13-1019

DOI: https://doi.org/10.1115/1.4025116

Published Online: August 13, 2013

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Topics: Heat, Measurement uncertainty, Temperature, Thermal resistance, Thermocouples, Uncertainty, Thermal conductivity, Errors, Design, ASTM International

Journal Articles

Impact of Self-Assembly Process Errors on Thermoelectric Performance

Nathan B. Crane, Patrick McKnight

J. Electron. Packag. September 2012, 134(3): 031001.

DOI: https://doi.org/10.1115/1.4006709

Published Online: July 18, 2012

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Topics: Errors, Manufacturing, Self-assembly, Thermal conductivity, Probability, Redundancy (Engineering), Simulation, Temperature, Junctions, Heat

Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl

J. Electron. Packag. December 2011, 133(4): 041004.

DOI: https://doi.org/10.1115/1.4005289

Published Online: December 9, 2011

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Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling

Journal Articles

Simplified Thermal Model of a Stacked Ball Grid Array Package

Luigi P. M. Colombo, Alexey Petrushin, Davide Paleari

J. Electron. Packag. June 2011, 133(2): 021006.

DOI: https://doi.org/10.1115/1.4003991

Published Online: June 23, 2011

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Topics: Ball-Grid-Array packages, Solders, Temperature, Thermal resistance, Ball-Grid-Array packaging, Heat, Errors, Boundary-value problems, Junctions

Journal Articles

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, John Janssen, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz

J. Electron. Packag. March 2011, 133(1): 011003.

DOI: https://doi.org/10.1115/1.4003217

Published Online: March 3, 2011

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Topics: Boundary-value problems, Errors, Flow (Dynamics), Heat, Junctions, Natural convection, Temperature, Computational fluid dynamics, Optimization, Forced convection

Journal Articles

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards

J. Electron. Packag. March 2010, 132(1): 011005.

DOI: https://doi.org/10.1115/1.4000754

Published Online: March 4, 2010

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Topics: Constitutive equations, Creep, Density, Fatigue, Finite element methods, Hardening, Lead-free solders, Modeling, Reliability, Semiconductor wafers

Journal Articles

An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip

Cheng-Hung Huang, Wei-Lun Chang

J. Electron. Packag. March 2010, 132(1): 011004.

DOI: https://doi.org/10.1115/1.4000720

Published Online: March 4, 2010

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Topics: Heat, Inverse problems, Temperature, Heat conduction, Errors

Journal Articles

Design of a Static TIM Tester

V. Székely, E. Kollár, G. Somlay, P. G. Szabó, M. Rencz

J. Electron. Packag. March 2010, 132(1): 011001.

DOI: https://doi.org/10.1115/1.4000715

Published Online: February 25, 2010

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Topics: Design, Errors, Flow (Dynamics), Heat, Heat flux, Sensors, Temperature, Thermal resistance

Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

Mohamed-Nabil Sabry

J. Electron. Packag. September 2007, 129(3): 256–259.

DOI: https://doi.org/10.1115/1.2753908

Published Online: April 16, 2007

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Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability

Journal Articles

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling

J. Electron. Packag. December 2007, 129(4): 373–381.

DOI: https://doi.org/10.1115/1.2804085

Published Online: March 25, 2007

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Topics: Ball-Grid-Array packaging, Displacement, Errors, Finite element model, Reliability, Shells, Shock (Mechanics), Transients (Dynamics), Dynamics (Mechanics), Modeling

Journal Articles

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Brian H. Dennis, Zhen-xue Han, George S. Dulikravich

J. Electron. Packag. December 2004, 126(4): 457–464.

DOI: https://doi.org/10.1115/1.1827261

Published Online: January 24, 2005

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Topics: Ball-Grid-Array packaging, Boundary-value problems, Errors, Flux (Metallurgy), Heat, Heat conduction, Temperature, Temperature distribution, Finite element analysis, Finite element methods

Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang

J. Electron. Packag. December 2005, 127(4): 530–536.

DOI: https://doi.org/10.1115/1.2070092

Published Online: December 22, 2004

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Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics

Journal Articles

A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks

Tzer-Ming Jeng, Li-Kang Liu, Ying-Huei Hung

J. Electron. Packag. September 2005, 127(3): 223–234.

DOI: https://doi.org/10.1115/1.1997159

Published Online: May 8, 2004

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Topics: Aluminum, Fluids, Heat sinks, Heat transfer, Liquid crystals, Metal foams, Porosity, Reynolds number, Steady state, Temperature

Journal citation

NARROW

Manuscript

Numerical Study of Two-Stage Temperature Control Strategy for High Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Electrothermal Analysis of System in Package for Aerospace Application

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

A Stepped-Bar Apparatus for Thermal Resistance Measurements

Impact of Self-Assembly Process Errors on Thermoelectric Performance

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Simplified Thermal Model of a Stacked Ball Grid Array Package

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip

Design of a Static TIM Tester

Flexible Profile Compact Thermal Models for Practical Geometries

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks

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