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Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey

J. Electron. Packag. March 2023, 145(1): 010301.

Paper No: EP-22-1094

https://doi.org/10.1115/1.4056558

Published Online: January 11, 2023

View Article titled, Special Section on InterPACK2021

Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices

Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen

J. Electron. Packag. June 2023, 145(2): 021003.

Paper No: EP-22-1036

https://doi.org/10.1115/1.4055125

Published Online: August 18, 2022

View Article titled, An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction

Journal Articles

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Shiva Farzinazar, Zongqing Ren, Jungyun Lim, Jae Choon Kim, Jaeho Lee

J. Electron. Packag. June 2022, 144(2): 021118.

Paper No: EP-21-1038

https://doi.org/10.1115/1.4053948

Published Online: March 28, 2022

View Article titled, Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Topics: Heat, Optimization, Thermomechanics, Topology, Design, Electronic packaging, Heat sinks

Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar

J. Electron. Packag. June 2022, 144(2): 020301.

Paper No: EP-21-1158

https://doi.org/10.1115/1.4053122

Published Online: January 4, 2022

View Article titled, Special Issue on InterPACK2020

Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling

Journal Articles

Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging

Ronald J. Warzoha

J. Electron. Packag. June 2021, 143(2): 020301.

Paper No: EP-21-1004

https://doi.org/10.1115/1.4050407

Published Online: March 19, 2021

View Article titled, Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging

Topics: Electronic packaging, Microscale devices, Nanoscale phenomena, Storage

Journal Articles

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Ardalan Nasiri, Simon Ang

J. Electron. Packag. June 2021, 143(2): 020902.

Paper No: EP-20-1060

https://doi.org/10.1115/1.4049292

Published Online: February 22, 2021

View Article titled, Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Topics: Bonding, Ceramics, Electronic packaging, Hardening (Curing), High temperature, Shear strength, Temperature, Fracture (Materials), Fourier transform infrared spectroscopy, Aluminum

Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang

J. Electron. Packag. September 2020, 142(3): 030301.

Paper No: EP-20-1092

https://doi.org/10.1115/1.4048039

Published Online: August 14, 2020

View Article titled, Special Issue on InterPACK 2019 – Part 1

Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers

Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee

J. Electron. Packag. March 2021, 143(1): 010801.

Paper No: EP-20-1051

https://doi.org/10.1115/1.4047414

Published Online: June 29, 2020

View Article titled, Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy

Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2020, 142(1): 011011.

Paper No: EP-19-1064

https://doi.org/10.1115/1.4045157

Published Online: November 8, 2019

View Article titled, Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability

Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li

J. Electron. Packag. September 2019, 141(3): 030301.

Paper No: EP-19-1036

https://doi.org/10.1115/1.4043484

Published Online: May 8, 2019

View Article titled, Special Issue on InterPACK 2018

Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers

Journal Articles

Special Section of Review Articles From Intel Corporation

Jin Yang

J. Electron. Packag. March 2019, 141(1): 010301.

Paper No: EP-18-1120

https://doi.org/10.1115/1.4042803

Published Online: March 6, 2019

View Article titled, Special Section of Review Articles From Intel Corporation

Topics: Data centers, Electronic packaging, Cooling, Design, Engineering teachers, Microelectronic packaging, Packaging, Semiconductor industry

Journal Articles

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

Hamoon Azizsoltani, Achintya Haldar

J. Electron. Packag. December 2018, 140(4): 041003.

Paper No: EP-17-1047

https://doi.org/10.1115/1.4040924

Published Online: August 20, 2018

View Article titled, Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

Topics: Failure, Finite element analysis, Modeling, Reliability, Solders, Thermomechanics, Lead-free solders, Electronic packaging, Uncertainty, Stress

Journal Articles

Special Section on InterPACK 2017—Part 2

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani

J. Electron. Packag. June 2018, 140(2): 020301.

Paper No: EP-18-1012

https://doi.org/10.1115/1.4039963

Published Online: May 9, 2018

View Article titled, Special Section on InterPACK 2017—Part 2

Topics: Batteries, Density, Electronic packaging, Microelectromechanical systems, Optoelectronic devices, Packaging, Semiconductor wafers, Sensors, Reliability

Journal Articles

Special Section on InterPACK 2017—Part 1

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani

J. Electron. Packag. March 2018, 140(1): 010301.

Paper No: EP-18-1005

https://doi.org/10.1115/1.4039090

Published Online: March 2, 2018

View Article titled, Special Section on InterPACK 2017—Part 1

Topics: Electronic packaging, Reliability

Journal Articles

Special Section on IMECE 2016

Justin A. Weibel, S. Ravi Annapragada

J. Electron. Packag. June 2017, 139(2): 020301.

Paper No: EP-17-1032

https://doi.org/10.1115/1.4036627

Published Online: June 12, 2017

View Article titled, Special Section on IMECE 2016

Topics: Failure analysis, Flexible electronics, Packaging, Reliability, Semiconductor wafers, Solders, Thermal analysis, Electronic packaging

Journal Articles

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar

J. Electron. Packag. June 2017, 139(2): 020912.

Paper No: EP-17-1010

https://doi.org/10.1115/1.4036661

Published Online: June 12, 2017

View Article titled, Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Topics: Failure, Fracture (Materials), Fracture toughness, Solder masks, Stress, Thin films, Membranes, Fracture (Process), Electronic packaging, Testing

Journal Articles

Reviewers Acknowledgment for the Journal of Electronic Packaging

J. Electron. Packag. September 2016, 138(3): 038001.

Paper No: EP-16-1065

https://doi.org/10.1115/1.4033688

Published Online: June 6, 2016

View Article titled, Reviewers Acknowledgment for the Journal of Electronic Packaging

Topics: Density, Electronic packaging, Failure analysis, Packaging

Journal Articles

Special Section on InterPACK 2015

Satish Chaparala, Ashish Gupta, Mehdi Asheghi, Jeffrey Suhling, Toru Ikeda, Xiaobing Luo

J. Electron. Packag. March 2016, 138(1): 010201.

Paper No: EP-16-1019

https://doi.org/10.1115/1.4032748

Published Online: March 10, 2016

View Article titled, Special Section on InterPACK 2015

Topics: Packaging, Thermal analysis, Electronic packaging, Electronics, Microchannels, Fluids, Printed circuit boards

Journal Articles

Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules

Soochan Lee, Patrick E. Phelan, Carole-Jean Wu

J. Electron. Packag. September 2015, 137(3): 031010.

Paper No: EP-14-1118

https://doi.org/10.1115/1.4030686

Published Online: September 1, 2015

View Article titled, Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules

Topics: Cooling, Energy generation, Temperature, Thermoelectric coolers, Waste heat, Heat, Reliability, Electronic packaging

Journal Articles

Reviewers Acknowledgment for the Journal of Electronic Packaging

J. Electron. Packag. September 2015, 137(3): 038001.

Paper No: EP-15-1031

https://doi.org/10.1115/1.4030195

Published Online: April 17, 2015

View Article titled, Reviewers Acknowledgment for the Journal of Electronic Packaging

Topics: Electronic packaging

Journal citation

NARROW

Special Section on InterPACK2021

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Special Issue on InterPACK2020

Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Special Issue on InterPACK 2019 – Part 1

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Special Issue on InterPACK 2018

Special Section of Review Articles From Intel Corporation

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

Special Section on InterPACK 2017—Part 2

Special Section on InterPACK 2017—Part 1

Special Section on IMECE 2016

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Reviewers Acknowledgment for the Journal of Electronic Packaging

Special Section on InterPACK 2015

Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules

Reviewers Acknowledgment for the Journal of Electronic Packaging

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