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Journal Articles

Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO 2 /Graphite Bilayered Packaging Structure

Zong-Tao Li, Jun-Hao Wu, Zhi-yao Ren, Yao-xing Song, Jia-Sheng Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011010.
Paper No: EP-20-1129
https://doi.org/10.1115/1.4050202
Published Online: August 6, 2021
View Article titled, Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO 2 /Graphite Bilayered Packaging Structure
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Topics: Electromagnetic scattering, Graphite, Light-emitting diodes, Nanoparticles, Packaging, Radiation (Physics)
Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
View Article titled, Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
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Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Journal Articles

Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique

Zong-Tao Li, Jia-Yong Liang, Jia-Sheng Li, Jie-Xin Li, Yong Tang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021002.
Paper No: EP-20-1041
https://doi.org/10.1115/1.4048034
Published Online: August 27, 2020
View Article titled, Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique
Open the PDF for Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique in another window
Topics: Boron, Electromagnetic scattering, Light-emitting diodes, Nanoparticles, Radiation scattering, Reflection, Scattering (Physics), Quantum dots, Packaging, Geometry
Journal Articles

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee, Wei Xu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
https://doi.org/10.1115/1.4041064
Published Online: September 10, 2018
View Article titled, Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components
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Topics: Ball-Grid-Array packaging, Electromagnetic scattering, Materials properties, Radiation scattering, Scattering (Physics), Temperature, Thermal expansion, Warping, Simulation, Laminates
Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2005, 127(4): 530–536.
https://doi.org/10.1115/1.2070092
Published Online: December 22, 2004
View Article titled, State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
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Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics
Journal Articles

Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages

T. Winkler, A. Schubert, E. Kaulfersch, B. Michel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 282–285.
https://doi.org/10.1115/1.2793853
Published Online: December 1, 1999
View Article titled, Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages
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Topics: Electromagnetic scattering, Thermomechanics, Finite element analysis, Uncertainty, Simulation, Chaos, Electronic packages, Materials properties, Modeling, Optimization
Journal Articles

Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver

D. C. Whalley, P. P. Conway
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 134–141.
https://doi.org/10.1115/1.2792143
Published Online: September 1, 1996
View Article titled, Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver
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Topics: Simulation, Wetting, Solders, Surface tension, Electromagnetic scattering, Errors, Modeling, Shapes, Solder joints, Soldering