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Critical heat flux
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011104.
Paper No: EP-22-1019
Published Online: October 22, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. December 2022, 144(4): 040801.
Paper No: EP-21-1129
Published Online: April 28, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041011.
Paper No: EP-21-1119
Published Online: January 28, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041113.
Paper No: EP-21-1108
Published Online: November 9, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
Published Online: November 9, 2021
Topics:
Boiling,
Bubbles,
Critical heat flux,
Electrodeposition,
Heat transfer,
Copper,
Dynamics (Mechanics),
Microscale devices,
Fins,
Flow (Dynamics)
Includes: Supplementary data
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
Published Online: September 24, 2021
Journal Articles
Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041103.
Paper No: EP-21-1083
Published Online: August 27, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010802.
Paper No: EP-20-1114
Published Online: August 6, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021012.
Paper No: EP-19-1087
Published Online: April 6, 2020
Journal Articles
Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020906.
Paper No: EP-18-1003
Published Online: May 9, 2018
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041002.
Published Online: December 8, 2011
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011002.
Published Online: March 3, 2011
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021013.
Published Online: April 21, 2009
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041002.
Published Online: November 14, 2008
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 452–459.
Published Online: March 26, 2007
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 267–272.
Published Online: August 15, 2005
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 317–324.
Published Online: October 6, 2004
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 431–441.
Published Online: September 17, 2003
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 132–137.
Published Online: February 18, 2000
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 95–105.
Published Online: June 1, 1997