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Journal Articles

Investigation of the Mechanism of Temperature Rise in a Data Center With Cold Aisle Containment

Mingrui Zhang, Zhengwei Long, Qingsong An, Chao Sun, Hao Zhang, Xionglei Cheng, Xiaowei Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041002.
Paper No: EP-18-1059
https://doi.org/10.1115/1.4043157
Published Online: May 8, 2019
View Article titled, Investigation of the Mechanism of Temperature Rise in a Data Center With Cold Aisle Containment
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Topics: Containment, Data centers, Pressure, Temperature, Air flow, Flow (Dynamics)
Journal Articles

Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment

Sami A. Alkharabsheh, Bahgat G. Sammakia, Saurabh K. Shrivastava
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021010.
Paper No: EP-14-1016
https://doi.org/10.1115/1.4029344
Published Online: June 1, 2015
View Article titled, Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment
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Topics: Air flow, Calibration, Computational fluid dynamics, Containment, Data centers, Flow (Dynamics), Leakage, Stress, Temperature, Tiles
Journal Articles

Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers

Vikneshan Sundaralingam, Vaibhav K. Arghode, Yogendra Joshi, Wally Phelps
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011007.
Paper No: EP-13-1052
https://doi.org/10.1115/1.4028520
Published Online: October 7, 2014
View Article titled, Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers
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Topics: Air flow, Containment, Data centers, Flow (Dynamics), Stress, Temperature, Tiles, Uncertainty, Heat
Journal Articles

Room Level Modeling of Air Flow in a Contained Data Center Aisle

Vaibhav K. Arghode, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011011.
Paper No: EP-13-1087
https://doi.org/10.1115/1.4026540
Published Online: February 14, 2014
View Article titled, Room Level Modeling of Air Flow in a Contained Data Center Aisle
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Topics: Air entrainment, Air flow, Containment, Data centers, Flow (Dynamics), Modeling, Temperature, Tiles, Momentum, Resolution (Optics)
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Brandon Rubenstein, Scot Heath, Niru Kumari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041006.
https://doi.org/10.1115/1.4007110
Published Online: October 30, 2012
View Article titled, From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
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Topics: Containment, Data centers, Heat, Heat sinks, Temperature, Air flow