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Journal Articles

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Ali Nematollahisarvestani, Yung-Cheng “Y. C.” Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020802.
Paper No: EP-20-1043
https://doi.org/10.1115/1.4048011
Published Online: September 3, 2020
View Article titled, A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones
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Topics: Buckling, Deformation, Delamination, Failure, Fracture (Materials), Fracture (Process), Patents, Stress, Coatings
Journal Articles

Stretchable Thin Film Materials: Fabrication, Application, and Mechanics

Yu Wang, Zhengwei Li, Jianliang Xiao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2016, 138(2): 020801.
Paper No: EP-15-1122
https://doi.org/10.1115/1.4032984
Published Online: April 18, 2016
View Article titled, Stretchable Thin Film Materials: Fabrication, Application, and Mechanics
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Topics: Buckling, Manufacturing, Thin films, Deformation, Plasma desorption mass spectrometry, Electronics, Design
Journal Articles

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

C. J. Liu, L. J. Ernst, G. Wisse, G. Q. Zhang, M. Vervoort
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 512–519.
https://doi.org/10.1115/1.1604152
Published Online: December 15, 2003
View Article titled, Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate
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Topics: Buckling, Ceramics, Copper, Delamination, Finite element methods, Finite element model, Simulation, Stress, Temperature, Deformation
Journal Articles

Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach

T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 82–88.
https://doi.org/10.1115/1.2792290
Published Online: March 1, 1998
View Article titled, Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach
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Topics: Accelerated life testing, Coating processes, Coatings, Manufacturing, Deflection, Pumps, Laser beams, Probes, Temperature, Thermal stresses
Journal Articles

Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 261–265.
https://doi.org/10.1115/1.2792102
Published Online: December 1, 1995
View Article titled, Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design
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Topics: Design, Fibers, Lasers, Optimization, Stress, Rotation, Buckling, Compressive stress, Deformation, Optical instruments
Journal Articles

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

A. Dasgupta, V. Ramappan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 141–146.
https://doi.org/10.1115/1.2792081
Published Online: June 1, 1995
View Article titled, Simulation of the Influence of Manufacturing Quality on Reliability of Vias
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Topics: Manufacturing, Reliability, Simulation, Plating, Buckling, Cycles, Design, Design engineering, Electronic packages, Failure
Journal Articles

Displacement-Limited Buckling of an Optical Fiber

W. W. King
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 39–43.
https://doi.org/10.1115/1.2909300
Published Online: March 1, 1993
View Article titled, Displacement-Limited Buckling of an Optical Fiber
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Topics: Buckling, Displacement, Optical fiber, Fibers, Stress, Deflection
Journal Articles

Stress Relief in Solder Joints Due to the Application of a Flex Circuit

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 240–243.
https://doi.org/10.1115/1.2905401
Published Online: September 1, 1991
View Article titled, Stress Relief in Solder Joints Due to the Application of a Flex Circuit
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Topics: Flexible electronics, Solder joints, Stress, Buckling, Design, Fatigue life, Stress analysis (Engineering), Thermal expansion
Journal Articles

Mechanical Evaluation of the “Euler” Test Probe

E. Suhir, W. E. Benedetto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1990, 112(1): 75–77.
https://doi.org/10.1115/1.2904344
Published Online: March 1, 1990
View Article titled, Mechanical Evaluation of the “Euler” Test Probe
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Topics: Probes, Wire, Stress, Buckling, Deflection, Design, Mechanical behavior
Journal Articles

Application of an Epoxy Cap in a Flip-Chip Package Design

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 16–20.
https://doi.org/10.1115/1.3226501
Published Online: March 1, 1989
View Article titled, Application of an Epoxy Cap in a Flip-Chip Package Design
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Topics: Design, Epoxy adhesives, Epoxy resins, Flip-chip packages, Stress, Buckling, Thermal expansion, Compression, Diluents, Low temperature