1-4 of 4
Bifurcation
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel

D. Sathish Kumar, S. Jayavel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041007.
Paper No: EP-21-1084
https://doi.org/10.1115/1.4052537
Published Online: November 22, 2021
View Article titled, Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel
Open the PDF for Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel in another window
Topics: Bifurcation, Flow (Dynamics), Heat transfer, Microchannels, Fluids, Entropy, Pressure drop
Journal Articles

Steady-State Behavior of a Three-Dimensional Pool-Boiling System

Michel Speetjens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041102.
https://doi.org/10.1115/1.2993147
Published Online: November 13, 2008
View Article titled, Steady-State Behavior of a Three-Dimensional Pool-Boiling System
Open the PDF for Steady-State Behavior of a Three-Dimensional Pool-Boiling System in another window
Topics: Bifurcation, Boiling, Cooling, Fluids, Heat, Heat flux, Pool boiling, Steady state, Temperature, Heat transfer
Journal Articles

Forced Convective Cooling Enhancement of Electronic Package Configurations Through Self-Sustained Oscillatory Flows

J. S. Nigen, C. H. Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 356–365.
https://doi.org/10.1115/1.2909344
Published Online: December 1, 1993
View Article titled, Forced Convective Cooling Enhancement of Electronic Package Configurations Through Self-Sustained Oscillatory Flows
Open the PDF for Forced Convective Cooling Enhancement of Electronic Package Configurations Through Self-Sustained Oscillatory Flows in another window
Topics: Cooling, Electronic packages, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Bifurcation, Computer simulation, Design, Heat, Poiseuille flow
Journal Articles

A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics

S. Russell, R. Caroselli, J. Mason, M. Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 122–127.
https://doi.org/10.1115/1.2906408
Published Online: June 1, 1992
View Article titled, A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics
Open the PDF for A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics in another window
Topics: Fatigue, Nonlinear dynamics, Solders, Creep, Bifurcation, Chaos theory, Deformation, Engineering disciplines, Grain boundaries, Grain size