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Issues
March 2020
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Review Article
Packaging for Laser-Based White Lighting: Status and Perspectives
J. Electron. Packag. March 2020, 142(1): 010801.
doi: https://doi.org/10.1115/1.4044359
Topics:
Lasers
,
Packaging
,
Phosphors
,
Quenching (Metalworking)
,
Temperature
,
Laser beams
,
Brightness (Photometry)
Research Papers
Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development
J. Electron. Packag. March 2020, 142(1): 011001.
doi: https://doi.org/10.1115/1.4043704
Topics:
Package on package
,
Probability
,
Solders
,
Uncertainty
,
Warping
,
Manufacturing
Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model
J. Electron. Packag. March 2020, 142(1): 011002.
doi: https://doi.org/10.1115/1.4044218
Topics:
Corners (Structural elements)
,
Density
,
Package on package
,
Probability
,
Solders
,
Uncertainty
,
Warping
,
Manufacturing
,
Solder joints
Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems
J. Electron. Packag. March 2020, 142(1): 011003.
doi: https://doi.org/10.1115/1.4044476
Topics:
Bonding
,
Electronics
,
High temperature
,
Manufacturing
,
Stress
,
Tension-leg platforms
,
Thermal stresses
,
Tin
,
Transients (Dynamics)
,
Temperature
Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging
J. Electron. Packag. March 2020, 142(1): 011004.
doi: https://doi.org/10.1115/1.4044625
Topics:
Semiconductor wafers
,
Shrinkage (Materials)
,
Temperature
,
Warping
,
Molding
,
Manufacturing
,
Epoxy resins
,
Packaging
,
Epoxy adhesives
Empirical High Cycle Fatigue Assessment Model of MEMS Devices
J. Electron. Packag. March 2020, 142(1): 011005.
doi: https://doi.org/10.1115/1.4044278
Topics:
Design
,
Fatigue life
,
High cycle fatigue
,
Microelectromechanical systems
,
Silicon-on-insulator
,
Simulation
,
Stress
,
Torsion
,
Cycles
,
Damage
Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging
J. Electron. Packag. March 2020, 142(1): 011006.
doi: https://doi.org/10.1115/1.4044626
Topics:
Epoxy adhesives
,
Epoxy resins
,
Porosity
Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling
J. Electron. Packag. March 2020, 142(1): 011007.
doi: https://doi.org/10.1115/1.4044489
Topics:
Cycles
,
Fatigue life
,
Semiconductor wafers
,
Simulation models
,
Solders
,
Stress
,
Temperature
,
Creep
,
Assembly lines
,
Simulation results
Impact of Overhead Air Supply Layout on the Thermal Performance of a Container Data Center
J. Electron. Packag. March 2020, 142(1): 011008.
doi: https://doi.org/10.1115/1.4044775
Topics:
Air flow
,
Computational fluid dynamics
,
Containers
,
Data centers
,
Temperature
,
Ceilings
,
Cooling
Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions
J. Electron. Packag. March 2020, 142(1): 011009.
doi: https://doi.org/10.1115/1.4044648
Topics:
Grain size
,
Shear (Mechanics)
,
Simulation
,
Deformation
,
Reliability
,
Atoms
,
Simulation results
,
Copper
Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time
J. Electron. Packag. March 2020, 142(1): 011010.
doi: https://doi.org/10.1115/1.4045156
Topics:
Fluids
,
Pumps
,
Temperature
,
Thermocouples
,
Low temperature
,
Energy consumption
Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
J. Electron. Packag. March 2020, 142(1): 011011.
doi: https://doi.org/10.1115/1.4045157
Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink
J. Electron. Packag. March 2020, 142(1): 011012.
doi: https://doi.org/10.1115/1.4044960
Topics:
Aerosols
,
Electrical conductivity
,
Flow (Dynamics)
,
Gas flow
,
Inks
,
Magnification
,
Nanoparticles
,
Printing
,
Silver
,
Agglomeration (Materials)
Thermal Fatigue Evaluation Model of a Microelectronic Chip in Terms of Interfacial Singularity
J. Electron. Packag. March 2020, 142(1): 011013.
doi: https://doi.org/10.1115/1.4045255
Topics:
Fatigue
,
Stress
,
Fatigue testing
,
Solders
,
Cycles
Technical Briefs
Additive-Manufactured Organic Interposers
J. Electron. Packag. March 2020, 142(1): 014501.
doi: https://doi.org/10.1115/1.4044279
Topics:
Additive manufacturing
,
Manufacturing
,
Printing
Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy
J. Electron. Packag. March 2020, 142(1): 014502.
doi: https://doi.org/10.1115/1.4044774
Topics:
Contact resistance
,
Melting
,
Optical fiber
,
Temperature
,
Pressure
,
Alloys
,
Stress
,
Heating
,
Surface roughness
,
Heat sinks
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