Topics: Temperature , Thermal conductivity , Thin films , Transients (Dynamics) , Heat , Steady state , Sensors , Bulk solids , Thermoreflectance , Lasers

Research Papers

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Sharan Kallolimath, Jiang Jenny Zhou

J. Electron. Packag. December 2016, 138(4): 041001. doi: https://doi.org/10.1115/1.4034187

Abstract

View articletitled, Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

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Topics: Electrons , Finite element analysis , Lumber , Shock (Mechanics) , Simulation , Stress , Solder joints , Modeling , Symmetry (Physics) , Boundary-value problems

Modular Microfluidic Filters Based on Transparent Membranes

E. Archibong, H. Tuazon, H. Wang, J. Winskas, A. L. Pyayt

J. Electron. Packag. December 2016, 138(4): 041002. doi: https://doi.org/10.1115/1.4034369

Abstract

View articletitled, Modular Microfluidic Filters Based on Transparent Membranes

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Topics: Filters , Filtration , Membranes , Microfluidics , Particulate matter , Transparency , Manufacturing , Microparticles

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

Kenny Mahan, David Rosen, Bongtae Han

J. Electron. Packag. December 2016, 138(4): 041003. doi: https://doi.org/10.1115/1.4034454

Abstract

View articletitled, Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

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Topics: Adhesion , Deflection , Pressure , Testing , Polymer films , Copper , Delamination

Modeling of a Smart Heat Pump Made of Laminated Thermoelectric and Electrocaloric Materials

Dudong Feng, Shi-Chune Yao, Tian Zhang, Qiming Zhang

J. Electron. Packag. December 2016, 138(4): 041004. doi: https://doi.org/10.1115/1.4034751

Abstract

View articletitled, Modeling of a Smart Heat Pump Made of Laminated Thermoelectric and Electrocaloric Materials

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Topics: Cooling , Heat , Heat pumps , Temperature , Insulation , Wave functions

Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging

Yan Zhu, Fenglian Sun

J. Electron. Packag. December 2016, 138(4): 041005. doi: https://doi.org/10.1115/1.4034819

Abstract

View articletitled, Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging

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Topics: Solder joints , Solders , Tin , Diluents , Intermetallic compounds

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Shou-Jen Hsu, Chin C. Lee

J. Electron. Packag. December 2016, 138(4): 041006. doi: https://doi.org/10.1115/1.4034842

Abstract

View articletitled, Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

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Topics: Annealing , Intermetallic compounds , Solders , Temperature , Tin , Diffusion (Physics) , Carbon , Steel

Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

Joshua Gess, Sushil Bhavnani, R. Wayne Johnson

J. Electron. Packag. December 2016, 138(4): 041007. doi: https://doi.org/10.1115/1.4034854

Abstract

View articletitled, Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

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Topics: Coolants , Electronics , Flow (Dynamics) , Fluids , Particulate matter , Design , Boiling , Fluid dynamics , Cooling

A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

Cheng Chen, James Geer, Bahgat Sammakia

J. Electron. Packag. December 2016, 138(4): 041008. doi: https://doi.org/10.1115/1.4034856

Abstract

View articletitled, A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

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Topics: Diffusion (Physics) , Heat conduction , Lattice Boltzmann methods , Phonons , Silicon , Temperature , Thermal conductivity , Density , Heat , Equilibrium (Physics)

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle

J. Electron. Packag. December 2016, 138(4): 041009. doi: https://doi.org/10.1115/1.4034927

Abstract

View articletitled, Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

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Topics: Fillers (Materials) , Particulate matter , Cavities , Nanoparticles

Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink Temperature

Matthew R. Pearson, Charles E. Lents

J. Electron. Packag. December 2016, 138(4): 041010. doi: https://doi.org/10.1115/1.4034861

Abstract

View articletitled, Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink Temperature

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Topics: Heat , Stress , Temperature , Thermoelectric coolers , Thermal conductivity , Cycles , Electrical conductance

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Review Article

Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Research Papers

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Modular Microfluidic Filters Based on Transparent Membranes

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

Modeling of a Smart Heat Pump Made of Laminated Thermoelectric and Electrocaloric Materials

Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink Temperature

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