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Volume 136, Issue 1

March 2014

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Research Papers
Technology Review

Research Papers

Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints

Tong An, Fei Qin, Guofeng Xia

J. Electron. Packag. March 2014, 136(1): 011001. doi: https://doi.org/10.1115/1.4025863

Abstract

View articletitled, Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints

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Topics: Diffusion (Physics) , Stress , Tin , Atoms , Solders , Solder joints

Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules

Kyoung Joon Kim

J. Electron. Packag. March 2014, 136(1): 011002. doi: https://doi.org/10.1115/1.4025673

Abstract

View articletitled, Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules

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Topics: Forced convection , Heat sinks , Light-emitting diodes , Natural convection , Temperature , Heat

Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes

Chaoran Yang, Fubin Song, S. W. Ricky Lee

J. Electron. Packag. March 2014, 136(1): 011003. doi: https://doi.org/10.1115/1.4025915

Abstract

View articletitled, Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes

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Topics: Finishes , Solder joints , Solders , Tin , Temperature , Inspection

A Compact Modeling Approach to Enhance Collaborative Design of Thermal-Fluid Systems

Jason Stafford, David Newport, Ronan Grimes

J. Electron. Packag. March 2014, 136(1): 011004. doi: https://doi.org/10.1115/1.4026051

Abstract

View articletitled, A Compact Modeling Approach to Enhance Collaborative Design of Thermal-Fluid Systems

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Topics: Boundary-value problems , Design , Modeling , Thermofluids , Computational fluid dynamics , Temperature

Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill

Sangil Lee, Daniel F. Baldwin

J. Electron. Packag. March 2014, 136(1): 011005. doi: https://doi.org/10.1115/1.4026164

Abstract

View articletitled, Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill

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Topics: Flow (Dynamics) , Nucleation (Physics) , Temperature , Manufacturing , Solders

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Yuan-Yun Wu, Chin C. Lee

J. Electron. Packag. March 2014, 136(1): 011006. doi: https://doi.org/10.1115/1.4026171

Abstract

View articletitled, The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

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Topics: Alloys , Bonding , Copper , Design , High temperature , Low temperature , Shear (Mechanics) , Silver , Solid solutions , Temperature

A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices

J. H. L. Ling, A. A. O. Tay

J. Electron. Packag. March 2014, 136(1): 011007. doi: https://doi.org/10.1115/1.4026352

Abstract

View articletitled, A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices

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Topics: Gates (Closures) , Heat , Temperature , Temperature distribution , Junctions , Finite element analysis , Thermal conductivity

Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches

Jason Stafford, Florian Fortune

J. Electron. Packag. March 2014, 136(1): 011008. doi: https://doi.org/10.1115/1.4026351

Abstract

View articletitled, Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches

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Topics: Cooling , Design , Fans , Flow (Dynamics) , Heat sinks , Heat transfer , Thermal resistance , Computer simulation , Modeling , Air flow

Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone Oil

Shengfu Mei, Yunxia Gao, Zhongshan Deng, Jing Liu

J. Electron. Packag. March 2014, 136(1): 011009. doi: https://doi.org/10.1115/1.4026414

Abstract

View articletitled, Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone Oil

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Topics: Drops , Liquid metals , Silicones , Thermal conductivity

Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes

Sun-Min Kim, Kwang-Yong Kim

J. Electron. Packag. March 2014, 136(1): 011010. doi: https://doi.org/10.1115/1.4026536

Abstract

View articletitled, Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes

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Topics: Cooling , Cooling systems , Design , Impingement cooling , Light-emitting diodes , Optimization , Temperature , Numerical analysis , Flow (Dynamics) , Pressure

Room Level Modeling of Air Flow in a Contained Data Center Aisle

Vaibhav K. Arghode, Yogendra Joshi

J. Electron. Packag. March 2014, 136(1): 011011. doi: https://doi.org/10.1115/1.4026540

Abstract

View articletitled, Room Level Modeling of Air Flow in a Contained Data Center Aisle

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Topics: Air entrainment , Air flow , Containment , Data centers , Flow (Dynamics) , Modeling , Temperature , Tiles , Momentum , Resolution (Optics)

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

Rui Zhang, Jian Cai, Qian Wang, Jingwei Li, Yang Hu, Hongda Du, Liangliang Li

J. Electron. Packag. March 2014, 136(1): 011012. doi: https://doi.org/10.1115/1.4026616

Abstract

View articletitled, Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

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Topics: Electronics , Solders , Thermal resistance , Tin , Plates (structures) , Lasers

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

Changsoo Jang, Bongtae Han

J. Electron. Packag. March 2014, 136(1): 011013. doi: https://doi.org/10.1115/1.4026626

Abstract

View articletitled, Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

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Topics: Boiling , Polymers , Temperature , Water , Weight (Mass) , Glass transition , Absorption

Intermittent Failures in Hardware and Software

Roozbeh Bakhshi, Surya Kunche, Michael Pecht

J. Electron. Packag. March 2014, 136(1): 011014. doi: https://doi.org/10.1115/1.4026639

Abstract

View articletitled, Intermittent Failures in Hardware and Software

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Topics: Computer software , Failure , Hardware

Technology Review

Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art

Dapeng Liu, Seungbae Park

J. Electron. Packag. March 2014, 136(1): 014001. doi: https://doi.org/10.1115/1.4026615

Abstract

View articletitled, Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art

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Topics: Bonding , Manufacturing , Semiconductor wafers , Solders , Packaging , Low temperature

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Research Papers

Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints

Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules

Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes

A Compact Modeling Approach to Enhance Collaborative Design of Thermal-Fluid Systems

Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

A New Accurate Closed-Form Analytical Solution for Junction Temperature of High-Powered Devices

Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches

Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone Oil

Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes

Room Level Modeling of Air Flow in a Contained Data Center Aisle

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

Intermittent Failures in Hardware and Software

Technology Review

Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art

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