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Issues
December 2011
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel
J. Electron. Packag. December 2011, 133(4): 041001.
doi: https://doi.org/10.1115/1.4005299
Topics:
Convection
,
Emissivity
,
Heat
,
Radiation (Physics)
,
Temperature
,
Thermal analysis
,
Thermal conductivity
,
Heat transfer
,
Heat conduction
,
Flow (Dynamics)
Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations
J. Electron. Packag. December 2011, 133(4): 041002.
doi: https://doi.org/10.1115/1.4005300
Topics:
Boiling
,
Cooling
,
Flow (Dynamics)
,
Heat sinks
,
Microchannels
,
Critical heat flux
,
Microchannel flow
,
Pressure drop
The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions
J. Electron. Packag. December 2011, 133(4): 041003.
doi: https://doi.org/10.1115/1.4005375
Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections
J. Electron. Packag. December 2011, 133(4): 041004.
doi: https://doi.org/10.1115/1.4005289
Topics:
Boundary-value problems
,
Columns (Structural)
,
Copper
,
Deformation
,
Density
,
Displacement
,
Errors
,
Finite element analysis
,
Finite element model
,
Modeling
Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement
J. Electron. Packag. December 2011, 133(4): 041005.
doi: https://doi.org/10.1115/1.4005290
Topics:
Copper
,
Heat
,
Heat exchangers
,
Temperature
,
Thermal management
,
Thermoelectric devices
,
Water
,
Manufacturing
,
Fluids
,
Cooling
Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties
J. Electron. Packag. December 2011, 133(4): 041006.
doi: https://doi.org/10.1115/1.4005293
Topics:
Stress
,
Temperature
,
Warping
,
Thermomechanics
Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C
J. Electron. Packag. December 2011, 133(4): 041007.
doi: https://doi.org/10.1115/1.4005295
Topics:
Bonding
,
Diffusion bonding (Metals)
,
Pressure
,
Silver
,
Shear (Mechanics)
,
Shear strength
,
Solders
,
Atoms
,
Temperature
Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium
J. Electron. Packag. December 2011, 133(4): 041008.
doi: https://doi.org/10.1115/1.4005296
Topics:
Cavities
,
Design
,
Geometry
,
Optimization
,
Shapes
,
Thermal resistance
,
Degrees of freedom
Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal
J. Electron. Packag. December 2011, 133(4): 041009.
doi: https://doi.org/10.1115/1.4005297
Topics:
Convection
,
Cooling
,
Heat
,
Liquid metals
,
Temperature
,
Thermal resistance
,
Water
,
Stress
,
Coolants
,
Computer cooling
Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results
J. Electron. Packag. December 2011, 133(4): 041010.
doi: https://doi.org/10.1115/1.4005090
Topics:
Printed circuit boards
,
Shock (Mechanics)
,
Manufacturing
A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems
J. Electron. Packag. December 2011, 133(4): 041011.
doi: https://doi.org/10.1115/1.4005298
Topics:
Thermal management
,
Cooling
,
Silicon
,
Circuits
,
Integrated circuits
,
Heat
Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results
J. Electron. Packag. December 2011, 133(4): 041012.
doi: https://doi.org/10.1115/1.4005091
Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations
J. Electron. Packag. December 2011, 133(4): 041013.
doi: https://doi.org/10.1115/1.4005451
Topics:
Engineering simulation
,
Failure
,
Hardening
,
Lead-free solders
,
Simulation
,
Solder joints
,
Solders
,
Stress
,
Finite element analysis
Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change
J. Electron. Packag. December 2011, 133(4): 041014.
doi: https://doi.org/10.1115/1.4005294
Topics:
Manufacturing
,
Plates (structures)
,
Shear (Mechanics)
,
Shear stress
,
Solders
,
Stress
,
Temperature
,
Die cutting
,
Shearing (Deformation)
,
Copper
Thermal Modeling Technique for Multiple Transistors Within Silicon Chip
J. Electron. Packag. December 2011, 133(4): 041015.
doi: https://doi.org/10.1115/1.4005291
Topics:
Finite element analysis
,
Heat
,
Modeling
,
Silicon chips
,
Temperature
,
Temperature distribution
,
Transistors
Technical Briefs
A Creep Model for Solder Alloys
J. Electron. Packag. December 2011, 133(4): 044501.
doi: https://doi.org/10.1115/1.4005288
Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model
J. Electron. Packag. December 2011, 133(4): 044502.
doi: https://doi.org/10.1115/1.4005292
Topics:
Lasers
,
Manufacturing
,
Microwaves
,
Optimization
,
Packaging
,
Reflection
,
Resonance
,
Strip transmission lines
,
Simulation results
,
Simulation
Discussions
Discussion: “Yield Function for Solder Elastoviscoplastic Modeling” (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147–156)
J. Electron. Packag. December 2011, 133(4): 045501.
doi: https://doi.org/10.1115/1.4000901
Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag., 127, pp. 147–156)
J. Electron. Packag. December 2011, 133(4): 045502.
doi: https://doi.org/10.1115/1.4000902
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