Volume 129 Issue 3 | J. Electron. Packag.

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Volume 129, Issue 3

September 2007

ISSN 1043-7398

EISSN 1528-9044

Technical Papers

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

D. H. Lee, Y. S. Chung, P. M. Ligrani

J. Electron. Packag. September 2007, 129(3): 221–228. doi: https://doi.org/10.1115/1.2753884

Abstract

View articletitled, Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

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Topics: Flow (Dynamics) , Flow separation , Flow visualization , Jets , Nozzles , Pressure , Fins , Temperature , Impingement cooling , Reynolds number

Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

S. Radhakrishnan, G. Subbarayan, L. Nguyen, W. Mazotti

J. Electron. Packag. September 2007, 129(3): 229–235. doi: https://doi.org/10.1115/1.2753885

Abstract

View articletitled, Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

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Topics: Epoxy adhesives , Epoxy resins , Uncertainty , Viscoelasticity , Temperature , Modeling , Lasers , Displacement

Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors

Brent L. Weight, Christopher A. Mattson, Spencer P. Magleby, Larry L. Howell

J. Electron. Packag. September 2007, 129(3): 236–246. doi: https://doi.org/10.1115/1.2721080

Abstract

View articletitled, Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors

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Topics: Design , Engineering prototypes , Modeling , Optimization , Testing , Displacement , Manufacturing , Deflection , Wear

Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink

X. L. Xie, W. Q. Tao, Y. L. He

J. Electron. Packag. September 2007, 129(3): 247–255. doi: https://doi.org/10.1115/1.2753887

Abstract

View articletitled, Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink

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Topics: Cooling , Heat flux , Heat sinks , Heat transfer , Pressure drop , Temperature , Thermal resistance , Turbulence , Wall thickness , Water

Flexible Profile Compact Thermal Models for Practical Geometries

Mohamed-Nabil Sabry

J. Electron. Packag. September 2007, 129(3): 256–259. doi: https://doi.org/10.1115/1.2753908

Abstract

View articletitled, Flexible Profile Compact Thermal Models for Practical Geometries

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Topics: Boundary-value problems , Errors , Heat , Heat flux , Heating , Temperature , Temperature gradient , Integrated circuit packaging , Multi-chip modules , Reliability

Effect of RCC on the Reliability of Adhesive Flip Chip Joints

Laura K. Frisk, Kati H. Kokko

J. Electron. Packag. September 2007, 129(3): 260–265. doi: https://doi.org/10.1115/1.2753909

Abstract

View articletitled, Effect of RCC on the Reliability of Adhesive Flip Chip Joints

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Topics: Adhesives , Bonding , Flip-chip , Flip-chip devices , Particulate matter , Pressure , Reliability , Temperature , Failure , Delamination

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Fang Liu, Guang Meng, Mei Zhao

J. Electron. Packag. September 2007, 129(3): 266–272. doi: https://doi.org/10.1115/1.2753910

Abstract

View articletitled, Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

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Topics: Damping , Deflection , Dynamics (Mechanics) , Springs , Viscoelasticity , Viscosity , Dynamic analysis

Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation

Leila Jannesari Ladani, Abhijit Dasgupta

J. Electron. Packag. September 2007, 129(3): 273–277. doi: https://doi.org/10.1115/1.2753911

Abstract

View articletitled, Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation

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Topics: Ball-Grid-Array packaging , Creep , Damage , Durability , Finite element analysis , Modeling , Solders , Thermomechanics , Reliability , Solder joints

Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder

Gang Chen, Xu Chen, Kwang Soo Kim, Mohammad Abdel-Karim, Masao Sakane

J. Electron. Packag. September 2007, 129(3): 278–286. doi: https://doi.org/10.1115/1.2753917

Abstract

View articletitled, Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder

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Topics: Constitutive equations , Hardening , Kinematics , Shear (Mechanics) , Solders , Stress , Deformation

On-Wafer Capacitors Under Mechanical Stress

Päivi H. Karjalainen, Pekka Heino

J. Electron. Packag. September 2007, 129(3): 287–290. doi: https://doi.org/10.1115/1.2753918

Abstract

View articletitled, On-Wafer Capacitors Under Mechanical Stress

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Topics: Capacitors , Semiconductor wafers , Stress , Complementary metal oxide semiconductors

Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors

Robert Wadell, Yogendra K. Joshi, Andrei G. Fedorov

J. Electron. Packag. September 2007, 129(3): 291–299. doi: https://doi.org/10.1115/1.2753919

Abstract

View articletitled, Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors

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Topics: Flow (Dynamics) , Heat , Heat flux , Heat transfer , Refrigeration , Temperature , Pressure drop , Refrigerants , Microchannels

Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

Luke M. Thompson, Michael R. Maughan, Karl K. Rink, Donald M. Blackketter, Robert R. Stephens

J. Electron. Packag. September 2007, 129(3): 300–306. doi: https://doi.org/10.1115/1.2753920

Abstract

View articletitled, Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

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Topics: Finite element analysis , Glass , Stress , Wire , Manufacturing , Bridges (Structures) , Cooling , Temperature

Simulations of Process-Induced Warpage During IC Encapsulation Process

Shiang-Yu Teng, Sheng-Jye Hwang

J. Electron. Packag. September 2007, 129(3): 307–315. doi: https://doi.org/10.1115/1.2753936

Abstract

View articletitled, Simulations of Process-Induced Warpage During IC Encapsulation Process

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Topics: Shrinkage (Materials) , Simulation , Warping , Temperature

Spray Cooling of IGBT Devices

Robert G. Mertens, Louis Chow, Kalpathy B. Sundaram, R. Brian Cregger, Daniel P. Rini, Louis Turek, Benjamin A. Saarloos

J. Electron. Packag. September 2007, 129(3): 316–323. doi: https://doi.org/10.1115/1.2753937

Abstract

View articletitled, Spray Cooling of IGBT Devices

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Topics: Cooling , Heat flux , Sprays , Temperature , Water , Junctions , Cycles

A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results

Giulio Lorenzini, Simone Moretti

J. Electron. Packag. September 2007, 129(3): 324–327. doi: https://doi.org/10.1115/1.2756852

Abstract

View articletitled, A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results

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Topics: Computational fluid dynamics , Fins , Heat

Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS

Mehmet Arik, Anant Setlur, Stanton Weaver, Deborah Haitko, James Petroski

J. Electron. Packag. September 2007, 129(3): 328–338. doi: https://doi.org/10.1115/1.2753958

Abstract

View articletitled, Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS

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Topics: Brightness (Photometry) , Design , Heat , Light-emitting diodes , Phosphors , Silicones , Temperature , Thermal management , Temperature distribution , Packaging

Numerical Optimization of the Thermoelectric Cooling Devices

Boris Abramzon

J. Electron. Packag. September 2007, 129(3): 339–347. doi: https://doi.org/10.1115/1.2753959

Abstract

View articletitled, Numerical Optimization of the Thermoelectric Cooling Devices

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Topics: Cooling , Optimization , Temperature , Thermoelectric coolers , Electric current

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Yen-Shu Chen, Kuo-Hsiang Chien, Chi-Chuan Wang, Tzu-Chen Hung, Yuh-Ming Ferng, Bau-Shei Pei

J. Electron. Packag. September 2007, 129(3): 348–355. doi: https://doi.org/10.1115/1.2753970

Abstract

View articletitled, Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

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Topics: Heat , Heat conduction , Plates (structures) , Temperature , Temperature distribution , Thermal resistance , Vapors , Heat transfer , Flat heat pipes , Computer simulation

Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects

Russell Whitenack, Chandra Desai, Mostafa Rassaian

J. Electron. Packag. September 2007, 129(3): 356–365. doi: https://doi.org/10.1115/1.2753981

Abstract

View articletitled, Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects

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Topics: Cycles , Design , Electronic packaging , Failure , Plasticity , Shapes , Solders

Technical Brief

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

Tong Hong Wang, Yi-Shao Lai

J. Electron. Packag. September 2007, 129(3): 366–370. doi: https://doi.org/10.1115/1.2753988

Abstract

View articletitled, Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

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Topics: Convection , Density , Energy dissipation , Flat heat pipes , Heat transfer , Temperature

Technical Papers

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors

Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink

Flexible Profile Compact Thermal Models for Practical Geometries

Effect of RCC on the Reliability of Adhesive Flip Chip Joints

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation

Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder

On-Wafer Capacitors Under Mechanical Stress

Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors

Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

Simulations of Process-Induced Warpage During IC Encapsulation Process

Spray Cooling of IGBT Devices

A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results

Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS

Numerical Optimization of the Thermoelectric Cooling Devices

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects

Technical Brief

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

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