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Volume 122, Issue 1

March 2000

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Technical Papers
Book Reviews
Erratum

Editor’s Note

Ephraim Suhir, Chi Shih Chang

J. Electron. Packag. March 2000, 122(1): 1–2. doi: https://doi.org/10.1115/1.483135

Abstract

View articletitled, Editor’s Note

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Topics: Electronic packaging , Engineering teachers , Industrial research , Packaging , Teams , Materials research , Polymers , Reliability , Solder joints , Testing

Technical Papers

Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board

Ephraim Suhir, Fellow ASME

J. Electron. Packag. March 2000, 122(1): 3–5. doi: https://doi.org/10.1115/1.483134

Abstract

View articletitled, Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board

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Topics: Electronic components , Oscillating frequencies , Oscillations , Printed circuit boards , Vibration , Stiffness , Resonance , Fatigue , Free vibrations

A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

Anand M. Deshpande, Ganesh Subbarayan, Dan Rose

J. Electron. Packag. March 2000, 122(1): 6–12. doi: https://doi.org/10.1115/1.483125

Abstract

View articletitled, A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

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Topics: Artificial neural networks , Fatigue life , Reliability , Solder joints , Design , Solders

Decomposition Techniques for the Efficient Analysis of Area-Array Packages

Anand M. Deshpande, Ganesh Subbarayan

J. Electron. Packag. March 2000, 122(1): 13–19. doi: https://doi.org/10.1115/1.483126

Abstract

View articletitled, Decomposition Techniques for the Efficient Analysis of Area-Array Packages

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Topics: Design , Finite element analysis , Solder joints , Solders , Displacement , Artificial neural networks

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Sejin Han, K. K. Wang

J. Electron. Packag. March 2000, 122(1): 20–27. doi: https://doi.org/10.1115/1.483127

Abstract

View articletitled, Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

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Topics: Cavities , Flow (Dynamics) , Hardening (Curing) , Molding , Packing (Shipments) , Packings (Cushioning) , Pressure , Semiconductors (Materials) , Temperature , Viscosity

On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Jang-hi Im, Mem. ASME, Edward O. Shaffer, II, Theodore Stokich,, Jr., Andrew Strandjord, Jack Hetzner, James Curphy, Cheryl Karas, Greg Meyers, David Hawn, Ashok Chakrabarti, Steve Froelicher

J. Electron. Packag. March 2000, 122(1): 28–33. doi: https://doi.org/10.1115/1.483128

Abstract

View articletitled, On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

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Topics: Adhesion , Atomic force microscopy , Coatings , Polymers , Reliability , Thermal stability , Thin films , Fracture (Process) , Fracture (Materials) , Silicon

Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method

John H. Lau, Fellow ASME, S. W. Ricky Lee, Mem. ASME

J. Electron. Packag. March 2000, 122(1): 34–41. doi: https://doi.org/10.1115/1.483129

Abstract

View articletitled, Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method

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Topics: Fracture (Materials) , Fracture mechanics , Temperature , Stress , Copper , Solder masks

Over-Temperature Forecasts on Electronic Packages Through a Transient R–C Model

Ben-Je Lwo, Kun-Fu Tseng, Ching-Hsing Kao, Luke Su Lu

J. Electron. Packag. March 2000, 122(1): 42–47. doi: https://doi.org/10.1115/1.483130

Abstract

View articletitled, Over-Temperature Forecasts on Electronic Packages Through a Transient R–C Model

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Topics: Steady state , Temperature , Transients (Dynamics) , Circuits , Convection

Thermomechanical Fatigue Testing and Analysis of Solder Alloys

M. A. Palmer, P. E. Redmond, R. W. Messler,, Jr.

J. Electron. Packag. March 2000, 122(1): 48–54. doi: https://doi.org/10.1115/1.483131

Abstract

View articletitled, Thermomechanical Fatigue Testing and Analysis of Solder Alloys

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Topics: Alloys , Cycles , Solder joints , Solders , Stress , Thermomechanics , Tin , Failure , Fatigue , Temperature

New Reworkable High Temperature Low Modulus (in Excess of 400–500 °C) Adhesives for MCM-D Assembly

Jiali Wu, Randy T. Pike, S. K. Sitaraman, C. P. Wong

J. Electron. Packag. March 2000, 122(1): 55–60. doi: https://doi.org/10.1115/1.483124

Abstract

View articletitled, New Reworkable High Temperature Low Modulus (in Excess of 400–500 °C) Adhesives for MCM-D Assembly

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Topics: Adhesives , Tiles , Thermal stability , High temperature , Glass , Manufacturing , Pallets , Adhesion

Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures

Weidong Xie, Suresh K. Sitaraman

J. Electron. Packag. March 2000, 122(1): 61–66. doi: https://doi.org/10.1115/1.483133

Abstract

View articletitled, Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures

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Topics: Laminates , Stress , Thermal stresses , Shapes , Anisotropy , Electronic packaging

Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

Dickson T. S. Yeung, David C. C. Lam, Matthew M. F. Yuen

J. Electron. Packag. March 2000, 122(1): 67–72. doi: https://doi.org/10.1115/1.483137

Abstract

View articletitled, Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

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Topics: Design , Electronic packages , Electronic packaging , Fracture (Materials) , Fracture (Process) , Fracture toughness , Stress , Testing , Geometry , Packaging

Book Reviews

Mechanical Analysis of Electronic Packaging Systems

Stephen A. McKeown,, Author, A. J. Rafanelli,, Reviewer

J. Electron. Packag. March 2000, 122(1): 73. doi: https://doi.org/10.1115/1.483132

Abstract

View articletitled, Mechanical Analysis of Electronic Packaging Systems

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Topics: Electronic packaging , Engineering education , Integrated circuit packaging , Packaging

Erratum

Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121, pp. 179–185]

X. Q. Shi,, W. Zhou,, H. L. J. Pang, and, Z. P. Wang

J. Electron. Packag. March 2000, 122(1): 74. doi: https://doi.org/10.1115/1.483136

Abstract

View articletitled, Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., <strong>121</strong>, pp. 179–185]

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Topics: Alloys , Electrons , Mechanical properties , Solders , Temperature , Eutectic alloys , Soldering , Stress-strain relations , Thermomechanical treatment

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