Topics: Damage , Fracture mechanics , Solder joints , Fracture (Materials) , Damage mechanics , Fatigue life , Computers , Fatigue , Finite element methods , Anisotropy

Analysis and Modeling of Lead Coplanarity Distributions

E. K. Buratynski

J. Electron. Packag. December 1996, 118(4): 201–205. doi: https://doi.org/10.1115/1.2792153

Abstract

View articletitled, Analysis and Modeling of Lead Coplanarity Distributions

Open the PDF for in another window

Topics: Circuits , Manufacturing , Modeling , Reliability , Soldering , Statistical distributions , Surface mount packaging

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

K. X. Hu, C. P. Yeh, X. S. Wu, K. Wyatt

J. Electron. Packag. December 1996, 118(4): 206–213. doi: https://doi.org/10.1115/1.2792154

Abstract

View articletitled, An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

Open the PDF for in another window

Topics: Delamination , Multi-chip modules , Thin films , Stress , Finite element analysis , Fracture (Materials) , Polymers , Relaxation (Physics) , Reliability

Ball Grid Array Thermomechanical Response During Reflow Assembly

T. E. Voth, T. L. Bergman

J. Electron. Packag. December 1996, 118(4): 214–222. doi: https://doi.org/10.1115/1.2792155

Abstract

View articletitled, Ball Grid Array Thermomechanical Response During Reflow Assembly

Open the PDF for in another window

Topics: Ball-Grid-Array packaging , Manufacturing , Thermomechanics , Computer simulation , Reflow soldering , Soldering , Thermal conductivity

Experimental Investigation of the Formation of Surface Mount Solder Joints

P. P. Conway, M. R. Kalantary, D. J. Williams

J. Electron. Packag. December 1996, 118(4): 223–228. doi: https://doi.org/10.1115/1.2792156

Abstract

View articletitled, Experimental Investigation of the Formation of Surface Mount Solder Joints

Open the PDF for in another window

Topics: Solder joints , Surface mount packaging , Solders , Computers , Manufacturing , Microscopy , Process design , Reflow soldering , Temperature , Wetting

A Model Study of Thermal Stress-Induced Voiding in Electronic Packages

Y. Huang, K. X. Hu, C. P. Yeh, N.-Y. Li, K. C. Hwang

J. Electron. Packag. December 1996, 118(4): 229–234. doi: https://doi.org/10.1115/1.2792157

Abstract

View articletitled, A Model Study of Thermal Stress-Induced Voiding in Electronic Packages

Open the PDF for in another window

Topics: Electronic packages , Stress , Cavitation , Solids , Adhesives , Design , Failure mechanisms , Hardening , Hydrostatics , Integrated circuits

Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects

Y.-H. Pao, E. Jih, V. Siddapureddy

J. Electron. Packag. December 1996, 118(4): 235–243. doi: https://doi.org/10.1115/1.2792158

View articletitled, Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects

Open the PDF for in another window

Topics: Design , Reliability , Solders

Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components

Sidharth, D. B. Barker

J. Electron. Packag. December 1996, 118(4): 244–249. doi: https://doi.org/10.1115/1.2792159

Abstract

View articletitled, Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components

Open the PDF for in another window

Topics: Corners (Structural elements) , Fatigue life , Vibration , Stress , Displacement , Finite element analysis , Avionics , Boundary-value problems , Electronic packages , Electronic packaging

Calculation of Forced-Air Cooling of Electronic Modules With a Two-Fluid Model of Turbulence

O. J. Ilegbusi

J. Electron. Packag. December 1996, 118(4): 250–257. doi: https://doi.org/10.1115/1.2792160

Abstract

View articletitled, Calculation of Forced-Air Cooling of Electronic Modules With a Two-Fluid Model of Turbulence

Open the PDF for in another window

Topics: Cooling , Fluids , Turbulence , Flow (Dynamics) , Density , Diffusion (Physics) , Electronic systems , Energy dissipation , Heat , Heat transfer

Transient Modeling of the Thermal Behavior of Outdoor Electronic Cabinets

Eric B. Zimmerman, Gene T. Colwell

J. Electron. Packag. December 1996, 118(4): 258–263. doi: https://doi.org/10.1115/1.2792161

Abstract

View articletitled, Transient Modeling of the Thermal Behavior of Outdoor Electronic Cabinets

Open the PDF for in another window

Topics: Modeling , Transients (Dynamics) , Temperature , Computer simulation , Differential equations , Electronics , Runge-Kutta methods , Sensitivity analysis