Topics: Interferometry , Lasers , Welded joints , Diffraction gratings , Image processing , Manufacturing , Plates (structures) , Separation (Technology) , Thermal stresses , Welding

Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

R. K. Govila, Y.-H. Pao, C. Larner, J. Lau, S. Twerefour, S. Erasmus, S. Dolot

J. Electron. Packag. September 1994, 116(3): 184–190. doi: https://doi.org/10.1115/1.2905684

Abstract

View articletitled, Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

Open the PDF for in another window

Topics: Failure analysis , Solder joints , Water , Solders , Cycles , Crack propagation , Cracking (Materials) , Failure , Failure mechanisms , Fatigue damage

Influence of Polymer Viscoelasticity on a Bending Bilayer

B. D. Harper

J. Electron. Packag. September 1994, 116(3): 191–197. doi: https://doi.org/10.1115/1.2905685

Abstract

View articletitled, Influence of Polymer Viscoelasticity on a Bending Bilayer

Open the PDF for in another window

Topics: Polymers , Viscoelasticity , Polymer films , Thermal stresses , Epoxy adhesives , Epoxy resins , Microelectronic packaging , Molding , Temperature , Viscoelastic materials

Effects of Substrate Conductivity on Convective Cooling of Electronic Components

C. Y. Choi, S. J. Kim, A. Ortega

J. Electron. Packag. September 1994, 116(3): 198–205. doi: https://doi.org/10.1115/1.2905686

Abstract

View articletitled, Effects of Substrate Conductivity on Convective Cooling of Electronic Components

Open the PDF for in another window

Topics: Cooling , Electrical conductivity , Electronic components , Thermal conductivity , Heat conduction , Fluids , Heat , Temperature , Boundary-value problems , Convection

Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks

R. A. Wirtz, Weiming Chen, Ronghua Zhou

J. Electron. Packag. September 1994, 116(3): 206–211. doi: https://doi.org/10.1115/1.2905687

Abstract

View articletitled, Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks

Open the PDF for in another window

Topics: Flow (Dynamics) , Heat sinks , Heat transfer , Coolants , Cooling , Design , Electronic packages , Forced convection

Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process

Wei Qin, Ira M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. September 1994, 116(3): 212–219. doi: https://doi.org/10.1115/1.2905688

Abstract

View articletitled, Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process

Open the PDF for in another window

Topics: Flames , Wire bonding , Wire , Electrodes , Design , Computation , Computer simulation , Cycles , Deflection , Electric fields

A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics

Peter E. Jimenez, Issam Mudawar

J. Electron. Packag. September 1994, 116(3): 220–229. doi: https://doi.org/10.1115/1.2905689

Abstract

View articletitled, A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics

Open the PDF for in another window

Topics: Aircraft , Avionics , Coolants , Flow (Dynamics) , Pressure drop , Subcooling , Cooling , Heat , Military systems , Printed circuit boards

Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Sanjeev Sathe

J. Electron. Packag. September 1994, 116(3): 230–233. doi: https://doi.org/10.1115/1.2905690

Abstract

View articletitled, Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Open the PDF for in another window

Topics: Cylinders , Electronic packages , Heat conduction , Heat , Thermal conductivity , Aluminum , Copper , Dielectric materials , Dimensions , Electronic equipment